Patent Application
20080013293
The invention will become more fully understood from the detailed description given herein below illustration only, and thus is not limitative of the present invention, and wherein:
The present invention will be apparent from the following detailed description, which proceeds with reference to the accompanying drawings, wherein the same references relate to the same elements.
Referring to
The substrate 41 has a first surface 411 and a second surface 412 disposed opposite to the first surface 411, and a plurality of first connecting pads P1 is formed on the second surface 412. In this embodiment, the substrate 41 can be a dual-layer circuit substrate or a multi-layer circuit substrate according to the actual requirement, and can be made of glass, bismaleimide-triazine (BT) resin, fiberglass reinforced epoxy resin (FR4) or Getek resin.
The first IC unit 42 is disposed on the first surface 411 of the substrate 41. In this embodiment, the first IC unit 42 can be disposed on the first surface 411 of the substrate 41 by the surface mount technology (SMT), wire bonding technology or flip-chip bonding technology according to the actual conditions.
The cover 44 covers the first IC unit 42 to protect the first IC unit 42 from collision and damage. In this embodiment, the cover 44 may be made of resin or metal.
The second IC unit 43 is disposed on the second surface 412 of the substrate 41, and is disposed on the second surface 412 of the substrate by the surface mount technology or the flip-chip bonding technology.
The carrier 45 can be a dual-layer circuit board or a multi-layer circuit board, which is disposed corresponding to the first connecting pads P1 of the substrate 41. The carrier 45 has a third surface 451 and a fourth surface 452 opposite to the third surface 451. A plurality of second connecting pads P2 is formed on the third surface 451, and a plurality of third connecting pads P3 is formed on the fourth surface 452. In this embodiment, the second connecting pad P2 is electrically connected to the first connecting pad P1 through a solder ball S1, and can be electrically connected to the first connecting pad P1 through a conductive bump or a conductive adhesive. The third connecting pad P3 is electrically connected to the second connecting pad P2 through a metal wire or a via. In addition, the thickness of the carrier 45 is greater than that of the second IC unit 43 in order to prevent the second IC unit 43 from influencing the electrical connection between the first connecting pad P1 and the second connecting pad P2. Of course, it is also possible to prevent the second IC unit 43 from influencing the electrical connection between the first connecting pad P1 and the second connecting pad P2 by controlling the height of the solder ball S1 or the conductive bump.
In this embodiment, the first connecting pad P1 of the substrate 41 is electrically connected to the second connecting pad P2 of the carrier 45 by the surface mount technology, and then a non-conductive adhesive is applied between the substrate 41 and the carrier 45 so as to enhance the structural stability.
Furthermore, the carrier 45 of this embodiment is a dual-layer circuit substrate and is made of, without limitation, glass, bismaleimide-triazine (BT) resin, fiberglass reinforced epoxy resin (FR4) or Getek resin. In this example, the carrier 45 is made of the cheaper FR4.
Referring to
In addition, the second connecting pads P2 formed on the third surface 451 of the carrier 45 can be arranged as a ball grid array (BGA), as shown in
As shown in
As shown in
In this embodiment, the third connecting pad P3 of the carrier 45 may also be electrically connected to the fourth connecting pad P4 of the printed circuit board 46 by the surface mount technology. Similar to the above-mentioned example, the non-conductive adhesive is then applied between the carrier 45 and the printed circuit board 46 in order to enhance the structural stability.
In the embodiment as shown in
In summary, the IC module according to the invention has the additional carrier, and the first connecting pads are electrically connected to the second connecting pads of the carrier. When the IC module is disposed on a printed circuit board and needs to be disassembled or repaired, the carrier is separated from the printed circuit board. Compared with the prior art IC module, the second IC unit cannot be easily touched and thereby damaged. In addition, if the carrier is bonded to the printed circuit board through the lane grid array, the IC module may be disassembled and repaired more easily as compared with the IC module having the carrier bonded to the printed circuit board through the ball grid array and has enhanced yield and reliability after the IC module is disassembled or repaired.
Although the invention has been described with reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments, will be apparent to persons skilled in the art. It is, therefore, contemplated that the appended claims will cover all modifications that fall within the true scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 095126095 | Jul 2006 | TW | national |
