INTEGRATED CIRCUIT UTILIZING DOWN BOND TO DEFINE THE FUNCTION OF THE DIE AND THE IMPLEMENTING METHOD THEREOF

Abstract

The present invention provides an integrated circuit and the method of implementing the same. The integrated circuit includes a die, a base, a covering material and a plurality of pins. The die has at least a first function and a second function and includes a plurality of signal pads and at least a switching pad. The die receives and outputs signals through the signal pads, and the switching pad is utilized to switch the functions of the die. The base is utilized to support the die, and the covering material is utilized to cover the die and the base. One terminal of each pin is inside the covering material and coupled to the corresponding signal pad, and the other terminal of each pin is outside the covering material. The signal pads are connected to the circuits outside the integrate circuit through the pins.

Description

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a top view of a semiconductor die;

FIG. 2 is a side view of an integrated circuit;

FIG. 3 is a side view of an integrated circuit according to a first embodiment of the present invention; and

FIG. 4 is a side view of and integrated circuit according to a second embodiment of the present invention.

DETAILED DESCRIPTION

Certain terms are used throughout the description and following claims to refer to particular components. As one skilled in the art will appreciate, electronic equipment manufacturers may refer to a component by different names. This document does not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms “include” and “comprise” are used in an open-ended fashion, and thus should be interpreted to mean “include, but not limited to . . . ”. Also, the term “couple” is intended to mean either an indirect or direct electrical connection. Accordingly, if one device is coupled to another device, that connection may be through a direct electrical connection, or through an indirect electrical connection via other devices and connections.

Referring to FIG. 3, a side view of an integrated circuit according to a first embodiment of the present invention is shown. The integrated circuit 300 includes a die 100, a covering material 310, a base 220, a pin 340, an interior wire 330, and a down bond wire 320. The die 100 disposed on the base 220 has at least a first function and a second function, and the pads 111˜115 and 117˜122 are the signal pads for receiving and outputting signals, the pad 116 is the switching pad for receiving the control signal to define the function of the die 100. As shown in FIG. 3, the signal pad 117 is connected to the pin 340 of the IC 300 through the interior wire 330, and thereby the signal pad 117 outputs signals generated by the die 100 or receives signals from external circuits via the pin 340. The pads 111˜115 and 118˜122 are also connected to other pins through other interior wires respectively. The pad 116 is connected to the base 220 through the down bond wire 320, and therefore the pad 116 is effectively coupled to ground, which is an equivalent effect of making the pad 116 receive a low voltage level. That is, the pad 116 receives the control signal with a low voltage level without through any pin, and therefore the die 100 performs the first function accordingly. When the desired function of the integrated circuit 300 is determined, the pad 116 can be connected to the base 220 through the down-bond wire 320 to define the function of the die 100, such that the cost of the integrated circuit 300 is decreased due to the reduction in the number of the pins. The covering material 310 covers the die 100, the base 220, the interior wire 330, the down-bond wire 320, and the upper portion of the pin 340. The lower portion of the pin 340 is outside the covering material 310. Preferably, the covering material 310 is a thermoset seal or a plastic shell.

Referring to FIG. 4, a side view of an integrated circuit according to a second embodiment of the present invention is shown. In the integrated circuit 400, the pad 116 of the die 100 is not connected to the base 220 or any pin, and therefore the voltage level on the pad 116 is effectively high, causing the die 100 to operate the second function.

In summary, for prior art, the desired function of a die is defined by receiving the control signal via the corresponding pin. However, in the present invention, a die can be defined to perform one function by not connecting the switching pad of the die to any pin and to perform another function by connecting the switching pad of the die to the base via the down bond wire. Hence, during packaging the integrated circuit, at least one pin can be omitted to lower the cost.

Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.

Claims

1. An integrated circuit using down bond to define functions of a die, comprising: a die, which has at least a first function and a second function, comprising a plurality of signal pads and at least a switching pad, wherein the die receives and outputs signals through the signal pads, and the switching pad is for switching the functions of the die;a base for supporting the die;a covering material for covering the die and the base; anda plurality of pins, wherein one terminal of each pin is inside the covering material and coupled to the corresponding signal pad, and the other terminal of each pin is outside the covering material, and the signal pads are connected to the circuits outside the integrated circuit through the pins.

2. The integrated circuit of claim 1, wherein the switching pad is connected to the base through a down bond wire, such that the die performs the first function.

3. The integrated circuit of claim 1, wherein the switching pad is not connected to any connecting wire, such that the die performs the second function.

4. The integrated circuit of claim 1, wherein the covering material is a thermoset seal.

5. The integrated circuit of claim 1, wherein the covering material is a plastic shell.

6. A method of implementing an integrated circuit using down bond to define functions of a die, comprising: providing a base;supporting a die with the base, wherein the die, which has at least a first function and a second function, comprises a plurality of signal pads and at least a switching pad, wherein the die receives and outputs signals through the signal pads, and the switching pad is for switching the functions of the die;coupling the signal pads to a plurality of pins, wherein one terminal of each pin is coupled to the corresponding signal pad, and the signal pads are connected to the circuits outside the integrated circuit through the pins;covering the base, the die, and the terminals of the pins coupled to the signal pads with a covering material, such that the other terminal of each pin is outside the covering material.

7. The method of claim 6, further comprising: connecting the switching pad to the base through a down bond wire, such that the die performs the first function.

8. The method of claim 6, further comprising: floating the switching pad, such that the die performs the second function.

9. The method of claim 6, wherein the covering material is a thermoset seal.

10. The method of claim 6, wherein the covering material is a plastic shell.