Claims
- 1. A method of manufacturing a component that will, in use, experience a thermal load and will be operated at a mean operating temperature, the method comprising:
selecting a material having a coefficient of thermal expansion having a zero-crossing at a first temperature; manufacturing the component using the selected material at a second temperature, wherein the first temperature is between the second temperature and the mean operating temperature, so as to minimize deformation of the component at the mean operating temperature.
- 2. A method according to claim 1, wherein the first temperature is equal to the average of the second temperature and the mean operating temperature.
- 3. A method according to claim 1, wherein the integral of the coefficient of thermal expansion of the selected material from the second temperature to the mean operating temperature is substantially zero.
- 4. A method according to claim 1, wherein the selected material is a material having a low coefficient of thermal expansion.
- 5. A method according to claim 1, wherein the selected material is a material having a substantially zero coefficient of thermal expansion.
- 6. A method according to claim 5, wherein the selected material is a glass or a glass-ceramic comprising additives to provide the coefficient of thermal expansion.
- 7. A method according to claim 1, wherein the second temperature is adjusted to enable use of a material having a coefficient of thermal expansion zero-crossing temperature that is fixed or of a limited variability.
- 8. A component for use in a lithographic apparatus, the apparatus being configured to project a patterned beam of radiation onto a target portion of a substrate, wherein the component is made of a material having a coefficient of thermal expansion having a zero-crossing at a first temperature between a second temperature at which the component is manufactured and a mean operating temperature of the component.
- 9. A component according to claim 8, wherein the first temperature is equal to the average of the second temperature and the mean operating temperature.
- 10. A component according to claim 8, wherein the integral of the coefficient of thermal expansion of the material from the second temperature to the mean operating temperature is substantially zero.
- 11. A component according to claim 8, wherein the material is a material having a low coefficient of thermal expansion.
- 12. A component according to claim 8, wherein the material is a material having a substantially zero coefficient of thermal expansion.
- 13. A component according to claim 8, wherein the component is an optical component in at least one of a radiation system and a projection system of the lithographic apparatus.
- 14. A component according to claim 13, wherein the optical component is an optical element in the at least one of the radiation system and the projection system that experiences in use a highest thermal load.
- 15. A component according to claim 13, wherein the optical component is a mirror.
- 16. A component according to claim 15, wherein the mirror comprises a substrate manufactured from a material having a low coefficient of thermal expansion and a multilayer stack.
- 17. A component according to claim 15, wherein the mirror comprises a substrate manufactured from a material having a substantially zero coefficient of thermal expansion and a multilayer stack.
- 18. A lithographic apparatus, comprising:
a radiation system configured to provide a beam of radiation; a support configured to support a patterning device, the patterning device configured to pattern the beam according to a desired pattern; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam of radiation onto a target portion of the substrate, wherein at least one component in the apparatus that in use experiences a thermal load is made of a low coefficient of thermal expansion material having a coefficient of thermal expansion having a zero-crossing at a temperature between a manufacturing temperature and a mean operating temperature of the at least one component.
- 19. A device manufacturing method, comprising:
providing a substrate that is at least partially covered by a layer of radiation-sensitive material; providing a beam of radiation using a radiation system; using patterning means to endow the beam of radiation with a pattern in its cross-section; projecting the patterned beam of radiation onto a target portion of the layer of radiation-sensitive material using a projection system, wherein at least one component in at least one of the radiation system and the projection system experiencing a thermal load has a mean operating temperature and is made of a low coefficient of thermal expansion material such that a coefficient of thermal expansion zero-crossing temperature of the material is between a manufacturing temperature of the at least one component and the mean operating temperature.
Priority Claims (1)
Number |
Date |
Country |
Kind |
01310155.5 |
Dec 2001 |
EP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. application Ser. No. 10/307,485, filed Dec. 2, 2002, the entire contents of which are hereby incorporated in their entirety.
Continuations (1)
|
Number |
Date |
Country |
Parent |
10307485 |
Dec 2002 |
US |
Child |
10785046 |
Feb 2004 |
US |