Patent Application
20230230814
The present invention relates generally to plasma processing, and, in particular embodiments, to a method and apparatus for plasma processing.
In recent decades plasma processing has found a variety of applications in a number of industries. For example, plasma processes are routinely used for deposition or removal of materials, including deposition or etching of thin layers employed in the fabrication of microelectronic circuits, flat-panel or other displays, solar cells, microelectromechanical systems, and the like.
The manufacture of semiconductor devices involves a series of techniques including formation, patterning, and removal of a number of layers of material on a substrate. In order to achieve the physical and electrical specifications of current and next generation semiconductor devices, processing flows enabling reduction of feature size while maintaining structural integrity are desirable for various patterning processes. Historically, with microfabrication, transistors have been created in one plane, with wiring/metallization formed above, and have thus been characterized as two-dimensional (2D) circuits or 2D fabrication. Scaling efforts have greatly increased the number of transistors per unit area in 2D circuits, yet scaling efforts are running into greater challenges as scaling enters nanometer-scale semiconductor device fabrication nodes.
As device structures densify and develop vertically, the desire for precision material processing becomes more compelling. Trade-offs between selectivity, profile control, film conformality, and uniformity in plasma processes can be difficult to manage. Thus, equipment and techniques that isolate, and control the process conditions that are optimal for etch and deposition regimes are desirable in order to precisely manipulate materials and meet advanced scaling challenges.
With each generation of semiconductor technology, not only have the materials have to be precisely manipulated, but also sufficient uniformity has to be maintained across the semiconductor wafer. In particular, features at the edges have to look and function similar to the features at the center of the wafer. If such variation across the wafer is excessive, the chips formed at the edges of the wafer have to be discarded thereby significantly reducing process yield.
Plasma processes are commonly used in the manufacture of semiconductor devices. For example, plasma etching and plasma deposition are common process steps during semiconductor device fabrication. Controlling across wafer variation during plasma processing is challenging due to the large wafer sizes, e.g., 300 mm, used in semiconductor manufacturing.
In accordance with an embodiment of the present invention, a plasma processing system includes a vacuum chamber, a substrate holder configured to hold a substrate to be processed where the substrate holder is disposed in the vacuum chamber. The system further includes an electron source disposed above a peripheral region of the substrate holder, the electron source being configured to generate an electron beam towards the peripheral region of the substrate holder.
In accordance with an alternative embodiment of the present invention, a method of processing includes placing a substrate to be processed on a substrate holder disposed within a vacuum chamber, where the substrate includes a central region surrounded by a peripheral region. From an electron source, an electron beam including ballistic electrons is directed towards the peripheral region.
In accordance with an alternative embodiment of the present invention, an electron-generating apparatus of a plasma system includes an edge electrode portion disposed around a central portion. The edge electrode portion includes an inner diameter greater than the diameter of the central portion, a thickness less than the inner diameter, a first conductive region disposed between the inner diameter and an outer diameter, and a first electrical coupling component for coupling a direct-current (DC) power supply to the first conductive region. The edge electrode portion also includes an outer surface configured to be exposed to a plasma of the plasma system and configured to generate electrons.
For a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
Corresponding numerals and symbols in the different figures generally refer to corresponding parts unless otherwise indicated. The figures are drawn to clearly illustrate the relevant aspects of the embodiments and are not necessarily drawn to scale. Furthermore, the number, size, and positioning of gas conduits in various figures do not reflect the number, size, and positioning of gas conduits in practice and are mere intended to illustrate relevant concepts.
To improve manufacturing yield during plasma processing, embodiments of the present invention disclose a plasma processing tool and method in which electron beams are generated selectively in a peripheral region of an electrode assembly overlying a peripheral region of the wafer. The electrons beams may be concurrently or sequentially applied selectively during the plasma process so as to change the reactivity of the wafer surface in this peripheral region, which helps mitigate variations between devices in the central region of the wafer and the peripheral region of the wafer.
An embodiment plasma-processing apparatus will be described using
In this embodiment, a plasma processing apparatus 100 comprises a processing chamber 105 (e.g., a vacuum chamber), a gas input system no, a substrate holder 115, and an upper electrode assembly 120, and a coil 125. The gas input system 110 provides process gases into the processing chamber 105. The gas input system no may include multiple inputs and may input different gases into the processing chamber 105. In an embodiment, a radio-frequency (RF) bias is applied to the coil 125, generating an Inductively Coupled Plasma (ICP) in a region 130 of the processing chamber 105. In other embodiments, the plasma may be generated as a Capacitively Coupled Plasma (CCP), a microwave plasma, or a generated by other methods. A workpiece or substrate 135, e.g., a semiconductor wafer, may be placed on the substrate holder 115. In an embodiment, an RF bias may be applied to the substrate holder 115 and the substrate 135 through a matching network 137.
In addition, a focus ring 139 may be placed around the substrate 135. In some embodiments, the plasma process may be an etch process, such as a Reactive Ion Etch (RIE) process, an Atomic Layer Etch (ALE) process, or the like. In other embodiments, the plasma process may be a deposition process, such as a Plasma-Enhanced Physical Vapor Deposition (PVD) process, a Plasma-Enhanced Chemical Vapor Deposition (CVD) process, an Atomic Layer Deposition (ALD) process, or the like. In yet other embodiments, the plasma process may produce any physical or chemical modification of the substrate.
In an embodiment, the upper electrode assembly 120 comprises an edge electrode 140, and optionally, a center electrode 145. As described further, the edge electrode 140 may be an electron source for ballistic electrons. In embodiments wherein the substrate 135 is approximately circular in shape, the edge electrode 140 and the optional center electrode 145 may be annular and circular in shape, respectively. It is appreciated herein that since the substrate 135, the upper electrode assembly 120, and the edge and center electrodes 140 and 145 are of nonzero height, the term circular is intended to mean more precisely cylindrical, and the term annular is intended to mean more precisely in the shape of an annular cylinder.
A direct-current (DC) supply 150 provides a DC bias to the edge electrode 140. In various embodiments, the DC bias may be continuous or pulsed. In an embodiment, the DC bias supplied to the edge electrode 140 is negative with respect to a peripheral region, for example an extreme edge region 165, of the substrate 135, creating an electric field from the extreme edge region 165 to the edge electrode 140. Under the influence of this electric field, positively charged ions in the plasma are accelerated towards the edge electrode 140 and some collide with it. In some of these collisions, electrons are ejected from the edge electrode 140. Such electrons are referred to as secondary electrons, to distinguish them from plasma electrons arising from the ionization of gases. The ratio of the number of secondary electrons ejected from a surface to the number of positive ions colliding with it is the secondary electron emission coefficient. The secondary electron emission coefficient depends on a variety of factors. It is generally higher for oxide surfaces and lower for metal surfaces. For a silicon surface, a typical secondary electron emission coefficient may be approximately 0.1 (e.g., 0.027 for 100V ions in one illustration), indicating that for every ten ions colliding with a silicon electrode surface, one secondary electron may be generated.
Secondary electrons emanating from the edge electrode 140 are accelerated towards the extreme edge region 165 of the substrate 135 under the influence of the electric field and gain energy in the process, but may be scattered off course and also lose energy in collisions with various species present in the plasma. Ballistic electrons 160 suffer no collisions in the plasma and arrive at the extreme edge region 165 carrying the full energy imparted to them by the electric field. For example, if the electric potential difference between the edge electrode 140 and the extreme edge region 165 is 300V, ballistic electrons 160 may arrive at the substrate 135 carrying energies of approximately 300 eV. Other, nearly ballistic, electrons may only undergo a small number of nearly elastic collisions, maintaining most of the energy, and arrive at the substrate with substantial energy sufficient to stimulate chemical reactions thereon. Still other electrons may suffer many collisions and carry little more than the energy corresponding to the average electron temperature in the plasma.
The magnitude of the DC bias applied from the DC power supply to the edge electrode 140 affects not only the energies, but also the number of electrons arriving at the extreme edge region 165. The electron energy required to stimulate chemical reactions at a surface depends on the surface and the chemical reactions desired. In many plasma processes of interest, energies on the order of a few hundred electron-volts may accelerate or decelerate the reaction rate at the surface, while in others energies on the order of dozens of electron-volts may be sufficient. The magnitude of the DC bias applied to the edge electrode may also have to be sufficient to ensure that a sufficient number of electrons arrive at the extreme edge region 165 with enough energy. In some embodiments, the DC bias applied to the edge electrode 140 is negative with respect to the minimum potential appearing on an extreme edge region 165 of the substrate 135, which may be somewhat different from the minimum potential appearing elsewhere on the substrate 135. When an RF bias is supplied to the substrate 135, the minimum potential occurs at the most negative point of the RF cycle. When an RF bias is supplied to the substrate 135 through a capacitance, a DC self-bias may also appear on the substrate 135 and contribute to the total substrate bias. This substrate self-bias depends on both system and operating parameters. In various embodiments, the DC bias applied to the edge electrode 140 is selected to be in the range from 50V to 1000V, and about 500 V to 1000 V in one embodiment. In some embodiments, the DC bias applied to the edge electrode 140 may be applied while the substrate RF bias is on. In other embodiments, the DC bias applied to the edge electrode 140 and the substrate RF bias may be applied alternately. In an illustration, the substrate RF bias may be turned off, a DC pulse may then be applied to the edge electrode 140, and the substrate RF bias turned on after the DC pulse, with the sequence repeating. Such embodiments are particularly advantageous when the substrate self-bias is large.
Although secondary electrons may be initially ejected from the edge electrode 140 at various angles, and electrons may change direction due to collisions in the plasma, the electric field is strongest along a direction perpendicular to the surface of the edge electrode 140 and is highly effective in steering many electrons in that direction. As a result, the application of a negative DC bias to the edge electrode generates a beam of ballistic and nearby ballistic electrons. To a good approximation, the secondary electron density is annular in cross section and reflects the dimensions of the edge electrode 140. These secondary electrons travel substantially in a path perpendicular to the edge electrode and impinge the peripheral regions of the substrate 135. Accordingly, ballistic and nearby ballistic electrons are delivered to the peripheral regions of the substrate 135 with a high level of spatial precision.
As illustrated in
In another embodiment, the width of the edge electrode 140 may be larger than the width of the extreme edge region 165 of the substrate 135 so that the electron beam both covers and extends somewhat outside the substrate 135. Extension of the electron beam beyond the edge of the substrate 135 may be beneficial in at least two ways. During plasma operation, ions can penetrate a small clearance commonly present between the substrate 135 and the focus ring 139, but the interior of the clearance is often shaded from electrons. Positive charge can thus accumulate on the substrate holder 115 in the clearance. This charge in turns alters the electrical potential near the edge of the substrate 135, resulting in differences in the desired plasma process between the extreme edge 165 and the rest of the substrate 135. When the electron beam covers the clearance area, beam electrons neutralize and thus prevent build-up of positive charges there. In addition, extension of the electron beam beyond the edge of the substrate 135 reduces the impact of any misalignment in the placement of the substrate 135 with respect to the edge electrode 140.
In addition to generating secondary electrons, positive ions (not shown) impinging on the edge electrode 140 may also dislodge atoms of the electrode material, in a process known as sputtering. These atoms may then enter the plasma and arrive at the substrate 135. If the edge electrode 140 and the optional center electrode 145 are directly exposed to the plasma, they may be made of materials selected specifically such that they are not detrimental to the intended plasma process. Alternatively, edge electrode 140 and the optional center electrode 145 may be clad in a protective layer made of a material that is not detrimental to the intended plasma process. Embodiments and other characteristics of the upper electrode assembly 120 are discussed further below.
In some embodiments, the beam of electrons may be directed onto the substrate 135 at the same time that the surface of the substrate 135 is exposed to the ions from the plasma. In this case, the beam electrons are present at the extreme edge region 165 while the ions interact with the surface of the substrate 135. Alternatively, in some embodiments, the beam of electrons may be directed onto the extreme edge region 165 and then followed by the ion flux so that the surface of the substrate 135 receives the electrons at a different time than which the ions are received.
If an electron 220 impinges upon the surface 210 with sufficient energy, it may break a bond at the surface, thereby desorbing a species previously bonded to the surface and leaving a dangling bond. For example, the electron 220 can stimulate desorption of a hydrogen atom 223 and create a first dangling bond 227.
Dangling bonds thus created may participate in subsequent reactions. For example, a hydrogen atom 230 may arrive at the site of a second dangling bond 233 and adsorb on the surface by forming a bond with an atom of the underlying material, thus terminating the second dangling bond 233. Likewise, a reactant R1 240 may adsorb on the surface thus terminating a third dangling bond 243. In another event, the interaction of a reactant R2 250 with a dangling bond may results in two species, a reactant R2′ 253 adsorbed on the surface and a reaction byproduct P 257 leaving the surface. In some plasma processes, the reactants R1 and R2 may be fluorocarbons.
Changes in the surface density of dangling bonds or in the species covering the surface may affect different plasma processes such as etching or deposition. For example, dangling bonds may promote deposition. Likewise, coverage of a silicon surface by fluorocarbons may protect it from plasma ions, rendering it relatively more resistant to etching than a hydrogen-terminated surface. Notably, the arrival of additional electrons may create additional dangling bonds on the adsorbed reactants, leading to continued growth of material on the surface 210. For example, if the reactant R1 240 or the reactant R2 250 are fluorocarbons, a fluorocarbon coating may continue to grow on the surface 210.
In an embodiment, the extreme edge region 165 of the substrate 135, referred to in
The substrate 135 may be a circular semiconductor wafer in one embodiment.
In an illustration the extreme edge region 310 includes an outer edge 330 of the wafer 300. In some embodiments, the extreme edge region includes an annular region extending inward from the outer edge 330 by a width 320 that is 10 percent or less and preferably two percent or less of the radius of the substrate 135. For example, for a wafer with a 300-millimeter diameter, the extreme edge region includes an annular region extending inward from the outer edge 330 by a width 320 of 15 millimeters or less, and preferably 3 millimeters or less. It is contemplated herein that in some applications, the extreme edge region 310 may not reach the outer edge 330 and may instead lie entirely within the circle defined by the outer edge 330. It is also recognized herein that if a substrate is not circular, the extreme edge region may not be annular in shape. At least one aspect of the effect of the plasma process in the extreme edge region 165 of the substrate 135 may be different from the same aspect in an interior portion 340 of the wafer. For example, the plasma process may be a deposition process and an aspect of the effect of the plasma process may be the rate of growth on the top surface or sidewall of a given type of feature. The plasma process may be an etch process intended to form line features by etching around them and an aspect of the effect of the plasma process may be width of the line features. Or the plasma process may be a etch process intended to etch approximately cylindrical holes in a layer on a substrate and an aspect of the effect of the plasma process may be the diameter of the holes.
Accordingly, an outer hole diameter 470 that is smaller than the previously described hole diameter 455 and thus closer to the interior hole diameter 425 may be achieved in the extreme edge region of the wafer with the use of an electron beam. It is appreciated herein that although beam electrons may reach the interior surfaces of the hole being etched, their impact on inhibiting the etching of the hole is limited by the relative unavailability of fluorocarbon reactants inside the hole due to the shadowing effect of the sidewalls.
The edge electrode 140 may be supplied with a continuous or pulsed DC bias. In an exemplary application of an etch process, the process may remove one monolayer of the material intended to be etched in approximately 100 milliseconds, and the number of surface sites on a surface of an etch mask may be of the order of magnitude of 1015 sites per centimeter squared. For example, the total number of lattice surface sites on a silicon (100) surface is about 1.3×1015 cm−2. To influence chemical processes on the surface of an etch mask in such an etch process advantageously, various embodiments may provide an electron flux between 1014 and 1016 electrons per centimeter squared per 100 milliseconds. For illustration, the electron flux can be selected so as to maintain a supersaturation of electrons relative to the instantaneous concentration of the reactants or dangling bonds on the surface, which can itself be lower than the total number of bond sites.
For embodiments wherein the DC bias applied to the edge electrode 140 is continuous, commonly available continuous DC power supplies are well capable for providing the necessary currents.
In some embodiments, the continuous DC bias may be applied only when and for the duration of time needed to stimulate growth on etch-mask surfaces. Commonly available pulsed DC power supplies operating in the kilohertz frequency range provide thousands of pulses per second. For embodiments wherein the DC bias applied to the edge electrode 140 is pulsed, current levels required to provide beam fluxes between 1014 and 1016 electrons per centimeter squared per 100 milliseconds are well within the capabilities of such power supplies. In an embodiment, the pulse width is selected to be long enough to ensure that the desired beam flux is supplied. In some embodiments, DC pulses may be applied only when needed to stimulate growth on etch mask surfaces.
Accordingly, in this embodiment, an upper electrode assembly 120 comprises a center electrode 145, an inner insulator 620, an edge electrode 140, and an outer insulator 530. The center electrode 145 may be approximately cylindrical in shape and its thickness may be smaller than its diameter. The inner insulator 620, the edge electrode 140, and the outer insulator 530 may be approximately annular cylinders in shape. In an embodiment, the center electrode 145 may be made of doped silicon. The inner insulator 620 may be made of a variety of insulating materials, including ceramics such as yttria.
In various embodiments, the center electrode 610 may be supplied with a different bias voltage than the edge electrode 140. Various embodiments of the biasing of the center electrode 145 and the edge electrode 140 will be discussed further below.
In embodiments wherein the outer piece 750 is conducting, it may be grounded, or DC- or RF-biased in continuous or pulsed mode. In such embodiments, an additional insulating ring (not shown) may surround the outer piece 750.
In the embodiments of
A surface region 830 of the protective dielectric 820 faces the plasma, covers the edge electrode 140, and is approximately annular in shape. When a negative DC bias is applied to the edge electrode, positive ions in the plasma are attracted towards the edge electrode 140, impinge on the surface region 830, and generate secondary electrons from the surface region 830. However, since the dielectric is not conducting, charges gradually collect on the surface region 830 until generation of secondary electrons and therefore the resulting electron beam is extinguished.
In an embodiment, the protective dielectric 1030 may be yttria. Yttria is commonly used as a coating in plasma systems and generally does not result in signification contamination. In other embodiments, the protective dielectric 1030 may comprise one or more pieces of one or more other insulating materials, including other ceramics. The edge and center electrodes 140 and 145 are made of conducting materials, such as doped silicon, metals or alloys, or combinations thereof. In various embodiments, the edge and center electrodes 140 and 145 may be printed into one or more pieces of the body 1020 or the protective dielectric 1030, or they may be assembled from individual pieces. The edge and center electrodes 140 and 145 are provided with edge contact 825 and center contact 1045 for electrical access to allow independent biasing.
The HF (High-Frequency) and LF (Low-frequency) biases noted in rows 1-3 of
Other biasing configurations are also possible. For example, the HF bias applied to the center electrode 145 in configurations 1-3 may also be applied to the edge electrode 140, in addition to the pulsed DC bias A. In other configurations, the substrate 115 may be grounded, while RF bias is applied to the center electrode 145, and optionally the edge electrode 140. Furthermore, various biases may be applied through matching networks or capacitances and coils may be present to further sustain the plasma.
It is recognized herein that in some embodiments of plasma processing systems, an inductively-coupled plasma may be sustained by a planar coil. In such embodiments, a faraday cage may be used to permit DC biasing of a dedicated electrode and thus the generation of an electron beam directed at an extreme edge region of a wafer.
In some plasma systems, it is customary to supply process gases through an upper electrode assembly.
In an embodiment, the protective dielectric 1430 may be yttria. In other embodiments, the protective dielectric 1430 may comprise one or more pieces of one or more other insulating materials, including other ceramics. The edge and center electrodes 1250 and 1260 are made of conducting materials, such as doped silicon, metals or alloys, or combinations thereof. In various embodiments, the edge and center electrodes 1250 and 1260 may be printed into one or more pieces of the body 1420 or the protective dielectric 1430, or they may be assembled from individual pieces.
The edge electrode 1250 and the center electrode 1260 are provided with an edge contact 1440 and a center contact 1445 for electrical access, respectively, to allow biasing. Gas conduits 1240 are disposed in the protected upper electrode assembly 1400 to allow passage of gas.
As mentioned before, it is contemplated herein that in various embodiments, DC biases applied to an edge electrode or a center electrode or both, whether continuous or pulsed, may be applied only at selected times before or during a plasma process. For example, a DC bias may be applied only in an early phase of a plasma process, only during one step of a multi-step process, only occasionally to counteract erosion of features such as etch masks, only when erosion of features such as etch masks reaches a level of concern, in a periodic manner, or the like. Likewise, the DC biases may be modulated, for example, by changing the magnitudes of the biases, or changing the pulse widths and pulse frequencies for pulsed biases, or limiting the current supplied to electrodes, at selected times before or during a plasma process. Furthermore, a DC bias may be applied to an edge electrode or a center electrode while one or more RF biases are on or alternate with one or more RF biases. For example, one or more RF biases may be turned off, a DC pulse applied, said RF bias(es) turned on, and the sequence repeated.
As mentioned above, in some embodiments of upper electrode assemblies, there may be no central electrode. It is contemplated herein that in such cases, the upper electrode assembly may be annular in shape, with at least a portion of the inactive central portion absent.
In the embodiments disclosed above, an edge electrode supplied with a pulsed or continuous DC bias is used to generate an electron beam composed primarily of secondary electrons and direct it toward an extreme edge region of a substrate. In other embodiments, other electron sources, possibly external to key elements of a traditional plasma processing apparatus, may be employed to form the beam.
In this embodiment, an RF bias is applied to a primary coil 1520, sustaining a plasma in a region 1525 of the primary chamber 1515 for plasma processing. In an embodiment, the electron source 1510 comprises a source chamber 1550, which may be an annular cylinder. An electron source plasma, distinct from the primary plasma, may be created in an interior region 1553 of the source chamber 1550 by a variety of techniques, including inductive coupling, electron-cyclotron resonance (ECR), hallow-cathode, and the like.
In the embodiment illustrated in
Example embodiments of the invention are summarized here. Other embodiments can also be understood from the entirety of the specification as well as the claims filed herein.
Example 1. A plasma processing system, including: a vacuum chamber; a substrate holder configured to hold a substrate to be processed and being disposed in the vacuum chamber; and an electron source disposed above a peripheral region of the substrate holder, the electron source being configured to generate an electron beam towards the peripheral region of the substrate holder.
Example 2. The system of example 1, where the electron source includes an edge electrode coupled to a direct current (DC) supply node.
Example 3. The system of example 2, where a ratio of an inside radius of the edge electrode to a width of the edge electrode varies between 10:1 to 150:1.
Example 4. The system of one of examples 2 to 3, where the edge electrode is covered by a dielectric material.
Example 5. The system of one of examples 2 to 4, further including a central electrode disposed above a central region of the substrate holder, the central electrode disposed within the edge electrode.
Example 6. The system of example 5, further including a gas inlet through the central electrode for providing a gas into the chamber.
Example 7. The system of one of examples 5 to 6, where the central electrode includes doped semiconductor material.
Example 8. The system of one of examples 1 to 7, where the system is configured to generate plasma within the vacuum chamber using an inductive process or a capacitive process.
Example 9. The system of one of examples 1 to 8, where the electron source includes an outlet configured to be coupled to an external source of electrons.
Example 10. A method of processing a semiconductor substrate using the system of claim 1, where the method includes placing the semiconductor substrate over the substrate holder; and processing the semiconductor substrate in the vacuum chamber.
Example 11. A method of processing including: placing a substrate to be processed on a substrate holder disposed within a vacuum chamber, the substrate including a central region surrounded by a peripheral region; and from an electron source, directing an electron beam including ballistic electrons towards the peripheral region.
Example 12. The method of example 11, where directing the electron beam includes applying a first direct-current pulse on an edge electrode disposed above the peripheral region.
Example 13. The method of one of examples 11 or 12, where the electron source includes an edge electrode disposed above the peripheral region and a central electrode disposed over the central region.
Example 14. The method of example 13, where directing the electron beam includes: applying a pulse sequence of direct current on the edge electrode, a high frequency bias on the center electrode, and a low frequency bias on the substrate holder; applying a first pulse sequence of direct current on the edge electrode, a high frequency bias and a second pulse sequence of direct current on the center electrode, and a low frequency bias on the substrate holder; applying a first pulse sequence of direct current on the edge electrode, a high frequency bias and a second pulse sequence of direct current on the center electrode, and a third pulse sequence of low frequency bias on the substrate holder; applying a first pulse sequence of direct current on the edge electrode, a reference potential on the center electrode, and a high frequency bias and a low frequency bias on the substrate holder; applying a first pulse sequence of direct current on the edge electrode, a second pulse sequence of direct current on the center electrode, and a high frequency bias and a low frequency bias on the substrate holder; applying a first pulse sequence of direct current on the edge electrode, a reference potential on the center electrode, and a high frequency bias and a pulsed low frequency bias on the substrate holder; or applying a pulse sequence of direct current on the edge electrode, a second pulse sequence of direct current on the center electrode, and a high frequency bias and a pulsed low frequency bias on the substrate holder.
Example 15. The method of example 13, where directing the electron beam includes: applying a pulse sequence of direct current on the edge electrode, a radio frequency bias on the center electrode, and a reference potential on the substrate holder; applying a radio frequency bias and a pulse sequence of direct current on the edge electrode, a radio frequency bias on the center electrode, and a reference potential on the substrate holder; or applying a pulse sequence of direct current on the edge electrode, a reference potential on the center electrode, and a radio frequency bias on the substrate holder.
Example 16. The method of one of examples 11 to 15, further including: generating plasma within a vacuum chamber; and directing ions from the plasma towards the substrate; and processing a surface of the substrate with the ions and the electron beam including the ballistic electrons.
Example 17. The method of example 16, where directing the electron beam and directing the ions are alternated.
Example 18. The method of example 16, where directing the electron beam and directing the ions is performed at the same time.
Example 19. An electron-generating apparatus of a plasma system, including: an edge electrode portion disposed around a central portion, the edge electrode portion including: an inner diameter greater than the diameter of the central portion, a thickness less than the inner diameter, a first conductive region disposed between the inner diameter and an outer diameter, a first electrical coupling component for coupling a direct-current (DC) power supply to the first conductive region, and an outer surface configured to be exposed to a plasma of the plasma system and configured to generate electrons.
Example 20. The apparatus of example 19, where the edge electrode portion is covered by a dielectric material.
Example 21. The apparatus of one of examples 19 or 20, further including: a central electrode portion disposed in the central portion, the central electrode portion including: a second conductive region distributed along or within the central electrode portion, a second electrical coupling component for a direct current (DC) source or an alternating current (AC) power source, the second electrical coupling component being coupled to the second conductive region, and a diameter that is larger than a thickness of the central electrode portion, where the second electrical coupling component is electrically isolated from the first electrical coupling component.
Example 22. The apparatus of example 21, where the second conductive region includes a doped semiconductor material.
Example 23. The apparatus of one of examples 21 to 22, where the central electrode portion includes a plurality of gas conduits, the plurality of gas conduits including a gas inlet on a surface of the central electrode portion and a gas outlet on an opposite surface.
While this invention has been described with reference to illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications and combinations of the illustrative embodiments, as well as other embodiments of the invention, will be apparent to persons skilled in the art upon reference to the description. For example, other embodiments of upper electrode assemblies discussed above, such as in
This application is a continuation of U.S. application Ser. No. 16/221,918, filed on Dec. 17, 2018, entitled “Method and Apparatus for Plasma Processing,” and claims the benefit of U.S. Provisional Application No. 62/724,865, filed on Aug. 30, 2018, which applications are hereby incorporated herein by reference in their entirety.
| Number | Date | Country | |
|---|---|---|---|
| 62724865 | Aug 2018 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 16221918 | Dec 2018 | US |
| Child | 18189519 | US |
