The method and system relate to the area of thin film quality control and in particular, to the quality and process control in manufacturing thin film photovoltaic cells.
Scarcity and environmental effects of fossil energy sources that emerged in recent years have accelerated development of alternative energy sources. Thin film photovoltaic solar panels, being one such source, have attracted particular attention. These panels represent a number of different thin films (stack) deposited on large size flexible web substrates or large size rigid substrates like glass, metal and others. The films may be of such materials as dielectrics, metals, semiconductors, and are typically combined in multilayer stacks usually separated by so-called scribe lines into a plurality of individual photovoltaic cells. In addition to separating the cells, the scribe lines enable serial connection of individual photovoltaic cells increasing the voltage generated by the panel.
The panels are produced in a continuous production process, where they are transferred from one station to another by conveyor type facilities. The continuous production process does not allow the process to be stopped, and panel quality control off-line to be performed as in other thin film industries. Accordingly, the layer quality control should either be a part of the production process or what is known as on-line quality control. The speed of the on-line quality control should be such as to allow the production process to be maintained without reducing the conveyor speed and, at the same time allow, material characterization, defect detection, defect classification and generation of feedback to the forward or backward located production stations with respect to the quality control system production systems and, if possible, defect repair.
There are several important material parameters of the thin films which need to be known to successfully control the process. These parameters include: the refractive index (n) and the extinction coefficient (k), both as a function of the wavelength, the film thickness (d), roughness, energy gap, absorption, roughness, conductivity, crystallinity percentage, crystal phase or material composition, photoluminescence spectrum and intensity as well as some other parameters. To provide information useful for quality assessment, these parameters should be measured continuously and almost simultaneously across the width of the moving panel/web such that the measurement data collected will provide a sufficient data density required for mapping real time monitoring of a respective process quality. The measurement process and measurement conditions should be the same for each of sampled points and the signal-to-noise ratio of the measurement should enable determination of reliable thin film optical parameters.
Availability of such a method of thin film quality control would significantly improve the quality of thin film solar panel production, improve the yield, and reduce the costs. The photovoltaic solar thin film production industry would welcome such a method and would use it for different thin film production applications.
A method and apparatus for a photovoltaic thin film quality control where the thin film is supported by a support and a section of the film is illuminated by a polychromatic illumination source or a monochromatic illumination source such as laser. The source may form on the thin film a substantially continuous illuminated line or illuminate discrete sampling points. A sampling unit samples a plurality of discrete sampled points located on the illuminated line and images the points onto an optical switch. A control unit with the help of a calibration scanner generates a concordance look-up-table between the coordinates of the above sampled points on the thin film and their coordinates on the optical switch. A single detector samples all of the points by optically switching between the points and determines the spectral signal of the illumination reflected, transmitted or scattered by the sampled points. The photovoltaic thin film parameters applicable to the quality control are derived from the spectral signal and include film thickness, index of refraction, extinction or absorption coefficients, surface roughness, crystallinity percentage, conductivity, energy gap, crystal phase, material composition and others. The derived film parameters are applied to adjust manufacturing equipment process control parameters.
The method and system disclosed are herein presented, by way of non-limiting examples only, with reference to the accompanying drawings, wherein like numerals depict the same elements throughout the text of the specifications. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the method.
The term “thin film” as used in the current disclosure means a single photovoltaic thin film and a plurality of thin films with each film deposited on the top of the previous one or what is known as a “stack.”
Any one of the terms, “reflection” or “transmission” as used in the present disclosure incorporate both reflection and transmission phenomena.
Any one of the terms, “light”, “illumination” or “radiation” as used in the present disclosure has the same meaning.
The term “sampled point” as used in the current disclosure means any point of the thin film at which reflection or transmission spectra or scattering is measured.
The term “collected” means light reflected, transmitted or scattered by a sampled point and received by a sensor.
The term “individual photovoltaic cell” as used in the current disclosure means any thin film photovoltaic cell bound by scribe lines scribed in different thin films of the stack.
The term “panel” as used in the current disclosure means a plurality of photovoltaic cells located on the same substrate and electrically connected between them.
The term “Raman scattering” relates to inelastic scattering where the scattered light has a different than the incident light wavelength.
In the following detailed description, for purposes of explanation only, numerous specific details are set forth in order to provide a thorough understanding of the present system and method. It will be apparent, however, that the present system and method may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawings.
Reference is made to
Operation of any one of the systems illustrated in
Typically, one or more thin films 108 could be deposited on a rigid or flexible substrate 124 that may be sheet cut or a continuous web substrate. Thin film deposition is a continuous production process and in order to coat and pattern different substrate sections by one or more thin films 108, the substrate is translated between different production stations located backward 132 (See
Control unit 116 (
Each of the illuminations sub-units 204 include a light source 212 such as an incandescent lamp or arc lamp, luminescence lamp, white LED or an assembly of LEDs forming a polychromatic light source. The spectrum of polychromatic illumination sources 212 is selected such as to ensure that at least a part of the thin film controlled is partially transparent. A condenser lens 216 collects the illumination emitted by source 212 and images source 212 on the first end or input facet 220 of a fiber optics bundle 224. Lens 216 also matches the illuminating beam aperture to the aperture of fiber optics bundle 224. First end 220 of fiber optics bundle 224 is planar and configured into a round or rectangular shape with dimensions of 15 mm to 25 mm. The second end or output facet 228 of fiber optics bundle 224 is configured into a line. Assuming a bundle of 200,000 fifty-micron diameter fibers, the line would be about 1000 mm long. In some embodiments fibers may be located such that there will be a distance between them illuminating discrete locations and forming a line e.g. longer than 1000 mm. In order to provide a more homogeneous illumination distribution along the illuminated line, a diffuser 232 is inserted between second end 228 of bundle 224 and cylindrical lens 236 imaging the second end 228 in the object plane 106 coinciding with thin film 108 plane.
Illumination unit 238 is a laser based illumination unit. A laser light source is selected to ensure efficient inelastic Raman scattering useful for measuring structural properties of film 108. Each of the illuminations sub-units 240 includes a light source 244 such as a green 514 nm Argon laser or a red HeNe laser emitting at 632.8 nm, or semiconductor green lasers emitting in the range of 500 nm to 515 nm commercially available from Nichia Co. Ltd., Tokushima Japan, or Sumitomo Co. Ltd., Tokyo Japan and Osram GmbH, Munich Germany and semiconductor red lasers emitting in the range of 615 nm to 652 nm available from Sony Tokyo Japan and Sanyo Tokyo Japan and a number of other manufacturers as well as an optional scanning mirror 248 and a lens 252. Lens 252 forms on the controlled thin film a spot 202 of several tens to several hundreds of microns. The spot size, illumination time, and the power density that the spot couples to the thin film are selected to enable efficient Raman scattering without causing crystallization or other negative effects within the measured thin film. The lasers may be operated in a continuous operation mode or pulse mode with pulse duration of several milliseconds to a few seconds. Operation in pulse mode may be synchronized with measurement locations during panel movement on a conveyer. It should be noted that light delivery to the sampling points, e.g. from a laser, can be also provided via an optical switch.
In some embodiments the illumination unit may include both polychromatic light sources and monochromatic light sources such as lasers. Different optical elements such as beam combiners and similar (not shown) may be used to enable illumination of the same controlled thin film sampled spot by each of the illumination types.
A number of illumination sub-units 204 with each sub-unit illuminating a segment 300 (
In an alternative embodiment, illustrated in
In some embodiments of the sampling unit both Raman spectrometer 460 and spectrometer 444 may be present and optical switch 436 or an additional minor may be operative to direct the spectrum to be analyzed to the proper spectrometer. Operation of switch 436 or of the additional mirror may be synchronized with the operation of the illumination sources and spectrometers. In order to determine additional thin film parameters, Raman scattering measurements can be combined with either reflectance or transmittance measurements or both by sampling on points located in a close proximity to the Raman sampling point.
When output facet or second end of bundle 416 (
Thin film optical parameters such as the film thickness (d), film refractive index (n), film extinction coefficient (k), surface roughness, intensity and spectrum of photoluminescence or Raman scattering, and the like may change between the sampled points 404. These parameters characterize the quality of the thin film as well as that of the process of its manufacture and influence the reflected/transmitted light spectrum. Spectrometer 444 is operative to determine the spectral signal of the light collected from each of sampled points 404, enabling, as explained below, determination of these parameters. Specific material parameters can be extracted from the measurements of the thin film characteristics, for example by help of using dielectric function models for fitting the wavelength dispersion of the refractive index (n) and the extinction coefficient (k). The parameters can include film thickness, energy gap, absorption coefficient, surface roughness, conductivity, crystallinity percentage, crystal phase or material composition. It should be noted that the crystallinity may be determined using either absorption coefficient or by analyzing Raman scattering spectrum. [“Relationship between Raman crystallinity and open-circuit voltage in microcrystalline silicon solar cells”, C. Droz, E. Vallat-Sauvain, J. Bailat, L. Feitknecht, J. Meier, A. Shah, Solar Energy Materials and Solar Cells 81, issue 1, 61-71, 2004]. Sampling unit 400 selects and samples a plurality of points 404 located on a straight line 408 residing in the illuminated object plane 106 of thin film 108. Particular thin film production process or thin film materials may determine the number, size and location of sampled points 404, for example, the sampled points may be located within individual photovoltaic cells, scribe lines, contact frames, and specially introduced measurement targets. In order to interpret the measured spectrum into thin film parameters at the particular sampled point 404 it is desirable to have coordinates of each of the sampled points on the thin film. This may be achieved, for a coordinate axis along the panel width, by a process of calibration in course of which a concordance or look-up-table (LUT) between the location of each of the sampled point 404 on illuminated line 408 of the controlled thin film 108 and its image spot on two-dimensional switch 436 or on a curved line 424 is determined as well as for coordinate axis along the panel length by controlling the movement of the measured panel on a conveyer.
It should be noted that knowledge of the above measured material parameters and their spatial distribution within the thin film enables improvement of deposition process or treatment of the thin film and in particularly thin film uniformity. This may be done for example, by varying process equipment control parameters such as deposition time, deposition temperature, deposition rate, pressure in the deposition chamber, deposition source material composition, etc.
The coordinate calibration facility 500, a schematic illustration of an exemplary embodiment of which is shown in
In a case when one fiber illuminates several mirrors on the optical switch, all these mirrors should be identified and attributed to the selected sampled point. The detector of spectrometer 444 or 460 measures the radiation or light intensity reflected by each of these mirrors and determines the one with the maximal intensity. Coordinates of each of the pixels of switch 436 are well known, and coordinates of the mirror 504 moving along illuminated line could be easily identified by connecting a linear or rotary encoder to the minor. Based on these coordinates a concordance or LUT containing corresponding coordinates of the sampled points on the controlled thin film corresponding to their coordinates on the converter facets can be prepared. It should be noted that in case of transmission configuration as shown in
The diameter of individual fibers forming bundle 416 is about 50 micron. The size of an individual micro mirror (pixel) of switch 436 is about 14×14 micron or less. Under the assumption that lens 432 images bundle 416 (
Correspondence between the input facet 428 of bundle 416 and individual fibers forming curved line 424 is easy to establish since only one fiber at a time picks-up the illumination reflected by mirror 504 or transmitted by slit 520 or aperture 524. The imaging system 440 that images the spot on the two-dimensional array may be a variable magnification system providing an illuminated spot of the desired size, further increasing the accuracy of spot coordinates on the switch determination. Practically, the scanning mirror, or slit, or diaphragm, are illumination modulation devices (or objects) that modulate the illumination along the sampled line. Determination of the coordinates of these devices along the illuminated line and corresponding to these location coordinates on the switch enable generation of a look-up-table (LUT). Generally, the LUT may be prepared at the optical sampling unit production stage, since once unit 112 is assembled, the relation between the sampled points 404 coordinates on the illuminated line 516 and the corresponding output plane 420 of fiber optics bundle remains constant. The calibration method described allows low cost non-coherent optical fiber bundles to be used. Typically, the LUTs would be stored in memory 142 (
The system disclosed enables quality control of a thin film with the sampled points arranged substantially in a line or staggered line segments across one dimension of the substrate. A mechanism providing a relative movement between the thin film located in the object plane and the object plane 106 approximately perpendicularly to the direction of the illuminated line 516 (300, 408) on which sampled points 508 are located enables scanning and sampling of the other dimension of the thin film.
It is known that thermal drift of the light sources adversely affects the spectral stability of the illumination emitted by these sources and makes it insufficient for accurate determination of thin film optical parameters. The instability of the light sources may be compensated by a comparison of the spectrum to a well known and stable source of spectrum and normalization of the measurement results.
Optical properties of silicon are stable so the changes that may occur in the quality control process are changes most probably relating to the changes in the spectrum of illumination source 204. In order to reduce the possible measurement errors that may be caused by the built into spectrometer 444 detector, the detector stability may be further improved by stabilizing detector temperature and excluding any environmental changes effect. This is usually done by coupling a detector with a thermoelectric cooler and packing the detector into a hermetically closed housing. Practically, the present system allows calibration of measurements of every reading of the detector and introducing/using the calibration results for actual spectrum measurement correction.
The simplest way to correct the results of spectrum measurement is to correct all sampled point measurement results on an equal value. Generally, calibration based on silicon calibration target or other optically stable target allows both a relative and absolute calibration of the spectrum measurement. For example, the silicon calibration target optical properties are well known and methods of calculating its absolute reflection coefficient are also known. For example, see U.S. RE 34,873 patent. Each system may be produced with a calibration target and even the differences or change between the systems will be minimized. Other than silicon materials, such as glass, multilayer coatings similar to the controlled coating, and materials similar to the coating controlled, may be used for the calibration purpose.
Control unit 116 (
Control unit 116 (
The system described is used for quality control of a thin film deposited on any substrate and, in particular, on a large area substrate.
In order to enable continuous thin film quality control, the controlled thin film is moved in a second direction 828 approximately perpendicular to the direction of line 812 on which sampled points 804 reside (
The method includes determination of the spectral signal data of the illumination or light reflected or transmitted or inelastically (Raman) scattered by sampled points. This may be done e.g. by comparison of the actual measured spectrum data to a theoretical spectrum stored in the memory, selection of the most appropriate theoretical spectrum, and conversion of the selected spectrum data loaded in a LUT into at least one of the thin film parameters associated with each sampled point. It is worthwhile to mention that if there would be no defects of the thin film controlled, the reflected (or transmitted or scattered) illumination would remain unchanged across the length of the illuminated line. The change in the thin film optical parameters varies the reflected/transmitted/scattered illumination spectrum and accordingly proper interpretation of this variation enables determination of thin film parameters such as the film thickness (d), the film refractive index (n), the film extinction coefficient (k),surface roughness, the film conductivity, energy gap (Eg), crystallinity percentage crystal phase and material composition. The determination of these parameters is performed, based on the closest matching theoretical and measured spectra. Some specific material parameters, e.g. energy gap parameter, can be extracted from the measurements of the thin film characteristics, for example by determining dielectric function models used for fitting the wavelength dispersion of the refractive index (n) and the extinction coefficient (k). Based on the thin film process control parameters as measures of the variation of thin film quality, manufacturing equipment process control parameters can be adjusted in order to control thin film quality including at least one of a group consisting of the deposition pressure, deposition time, deposition rate, deposition temperature, and deposition source material composition.
Should the deviation of the controlled parameters indicate on a defect in the controlled film presence, the defect location and type is communicated to forward 136 and backward 132 (
A setup process precedes system 100 operation. The setup process includes at least the operations of generation of a concordance look-up-table between the coordinates of the sampled points 804 in the object plane 106 and their coordinates in the optical switch 436 (
Another embodiment includes a method of determining parameters of a photovoltaic thin film deposited on a substrate in a patterned photovoltaic panel where the panel includes multiple individual photovoltaic cells. This embodiment starts by providing at least one photovoltaic cell panel and one or more optical sampling systems. The method continues by enabling relative movement between the optical sampling system and the panel, and controlling the movement. Next the locations of individual photovoltaic cells on the panel are mapped and, each sampled point location is synchronized such that the sampled point reading takes place, when the sampled point is located at a pre-determined place along the panel movement path.
A number of embodiments have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the method. Accordingly, other embodiments are within the scope of the following claims:
This is a United States non-provisional application being filed under 35 USC 111 and 37 CFR 1.53(b) and is a continuation-in-part of U.S. patent application Ser. No. 12/410,878 filed on Mar. 25, 2009, which application claims the benefit of the priority of United States Provisional Application for patent assigned Ser. No. 61/080,279 and filed on Jul. 14, 2008, as well as United States Provisional Application for patent assigned Ser. No. 61/105,931 filed on Oct. 16, 2008, each of these three applications being incorporated herein by reference in their entirety. The application also incorporates by reference and by inclusion in the appendix to this application, United States Provisional Application for patent assigned Ser. No. 61/160,294 and filed on Mar. 14, 2009, United States Provisional Application for patent assigned Ser. No. 61/160,374 and filed on Mar. 16, 2009, and United States Provisional Application for patent assigned Ser. No. 61/226,735 and filed on Jul. 19, 2009 all of which have been commonly assigned to the same assignee.
Number | Date | Country | |
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61080279 | Jul 2008 | US | |
61105931 | Oct 2008 | US | |
61226735 | Jul 2009 | US |
Number | Date | Country | |
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Parent | 12410878 | Mar 2009 | US |
Child | 12775293 | US |