The present disclosure generally relates to gas-phase reactors and systems. More particularly, the disclosure relates to gas-phase systems and methods capable of in situ formation of gas-phase compounds that can be used as precursors or reactants in a downstream reactor.
Gas-phase processes are used for a variety of applications, such as chemical vapor deposition processes to deposit material onto a substrate, gas-phase etching processes to remove material from a substrate or a reactor, gas-phase cleaning processes to clean a substrate or reactor, and gas-phase treatment processes to treat a surface of a substrate or a reactor. Precursors for gas-phase processes are generally selected according to a material to be deposited, etched, cleaned, or treated; i.e., the precursors are generally selected to provide desired gas-phase reactants. However, other factors are often used to select between more than one precursor that might be suitable for a particular application. For example, a reactivity or selectivity of a precursor may be a factor in the selection of the precursor. Another consideration for selecting a precursor is the stability of the precursor—e.g., does the precursor break down into other compounds before the precursor has a chance to take part in a desired reaction. Yet further considerations may include vapor pressure of the precursor, toxicity of the precursor, availability of the precursor, and cost of the precursor. Thus, a precursor that might have desirable properties, such as higher selectivity, reactivity, and/or provide more uniform deposition, etch, or treatment, may not be selected for a particular application, because the precursor is relatively expensive, has an undesirable vapor pressure, and/or is toxic.
Remote or direct plasma systems may be used to create activated or energized species from a precursor, where the energized species are more reactive than the precursor for a given reactor temperature. Remote plasma systems generally form a plasma upstream of a reaction chamber, and direct plasma systems generally form a plasma within a reaction chamber, where a substrate is often in or adjacent to the plasma. Remote plasma systems may be advantageous over direct plasma systems for some applications, because the remote plasma systems do not form a plasma directly over a surface of a substrate. As a result, surface damage to a substrate that might otherwise occur in a direct plasma reactor can be reduced or eliminated using a remote plasma. However, remote plasma activated species from many precursors are relatively short lived and recombine or react with other components before the activated species enter the reaction chamber or reach a desired area of a substrate (e.g., a lower portion of a trench formed on a surface of the substrate and/or an outer perimeter of the substrate). Using a direct plasma allows the activated species to form within the reaction chamber, but the activated species may still recombine or otherwise become inactivated prior to reacting desired areas on a substrate.
Accordingly, improved methods and systems for forming reactive species relatively close to a substrate without causing unwanted substrate damage, wherein the reactive species may be relatively stable are desired.
Various embodiments of the present disclosure provide improved methods and systems for forming intermediate reactive species (also referred to herein as compounds) from one or more precursors. The intermediate reactive species can be suitable for use in various gas-phase processes, such as chemical vapor deposition processes (including plasma-enhanced chemical vapor deposition processes), gas-phase etching processes (including plasma-enhanced gas-phase etching processes), gas-phase cleaning (including plasma-enhanced cleaning processes), and gas-phase treatment processes (including plasma-enhanced gas-phase treatment processes).
Exemplary methods and systems can be used to form intermediate reactive species near a reaction chamber, where, for example, the intermediate reactive species might be considered a desirable reactant but an undesirable (e.g., toxic or unstable) precursor source. The methods and systems can be used to provide a steady-state source of desired chemical species, such as particular reactants to a reaction chamber of a reactor. A plasma system that is remote from the reaction chamber can be used to facilitate formation of the desired intermediate reactive species.
In accordance with various embodiments of the disclosure, a gas-phase reactor system includes a reactor comprising a reaction chamber, an intermediate reactive species formation chamber fluidly coupled to the reaction chamber, a first gas source fluidly coupled to the intermediate reactive species formation chamber, and a pressure control device interposed between the intermediate reactive species formation chamber and the reaction chamber. The pressure control device can be used to control an operating pressure of the intermediate reactive species formation chamber. The reactor may be, for example, a chemical vapor deposition reactor, an atomic layer deposition reactor, an etch reactor, a clean reactor, or a treatment reactor, any of which can include direct or remote plasma apparatus. In accordance with various aspects of these embodiments, the system further includes a controller coupled to the pressure control device to maintain a desired operating pressure of the intermediate reactive species formation chamber. In accordance with further aspects, the system includes one or more flow control units (e.g., mass flow controllers) to control flow rates of one or more gasses to the intermediate reactive species formation chamber. Exemplary systems can also include a heater to heat one or more gasses and/or the intermediate reactive species formation chamber to a desired temperature—e.g., to a temperature of about 50° C. to about 200° C. In accordance with further aspects, the pressure control device is a closed-loop pressure controller that controls a gas pressure upstream of the pressure control device. And, in accordance with yet additional aspects, the system further comprises an integrated inlet manifold block between the intermediate reactive species formation chamber and the reactor. The intermediate reactive species formation chamber can include a catalyst to facilitate formation of desired intermediate reactive species.
In accordance with additional exemplary embodiments of the invention, a method of forming intermediate reactive species for use in a reaction chamber of a reactor includes the steps of providing a first gas to an intermediate reactive species formation chamber, controlling a pressure within the intermediate reactive species formation chamber, and forming intermediate reactive species within the intermediate reactive species formation chamber. Exemplary methods in accordance with these embodiments can be used for depositing material onto a surface of a substrate, etching a material on a surface of a substrate, cleaning a surface of a substrate, treating a surface of a substrate, depositing material onto a surface of a reaction chamber, etching a surface of a reaction chamber, treating a surface of the reaction chamber, and/or cleaning a surface of the reaction chamber. In accordance with various aspects of these embodiments, the method additionally includes providing a second gas to the intermediate reactive species formation chamber. In accordance with further aspects, the step of controlling a pressure of the intermediate reactive species formation chamber comprises using a closed-loop upstream pressure controller. In accordance with further aspects, the method includes a step of forming a plasma in a remote plasma unit, which can be selected from the group consisting of an inductively coupled plasma unit and a microwave unit. In accordance with yet further aspects, a method includes controlling a valve between the intermediate reactive species formation chamber and the reaction chamber. In accordance with additional aspects, a method includes a step of heating the intermediate reactive species formation chamber to a desired temperature—e.g., to a temperature of about 50° C. to about 200° C.
In accordance with yet additional embodiments of the invention, a plasma-enhanced reactor system, such as a plasma-enhanced chemical vapor deposition reactor (e.g., a plasma-enhanced atomic layer deposition reactor) system, a plasma-enhanced etch reactor system, a plasma-enhanced clean reactor system, or a plasma-enhanced treatment reactor system, includes a reactor comprising a reaction chamber, an intermediate reactive species formation chamber fluidly coupled to the reaction chamber, a remote plasma unit fluidly coupled to the intermediate reactive species formation chamber, a first gas source coupled to the intermediate reactive species formation chamber, and a pressure control device in fluid communication with and interposed between the intermediate reactive species formation chamber and the reaction chamber. The pressure control device controls an operating pressure of the intermediate reactive species formation chamber. In accordance with various aspects of these embodiments, the system further includes a controller coupled to the pressure control device to maintain a desired operating pressure of the intermediate reactive species formation chamber. In accordance with further aspects, the system includes one or more flow control units to control flow rates of one or more gasses to the remote plasma unit and/or the intermediate reactive species formation chamber. In accordance with further aspects, the pressure control device is a closed-loop pressure controller that controls a gas pressure upstream of the pressure control device. And, in accordance with yet additional aspects, the system further comprises an integrated inlet manifold block between the remote intermediate reactive species formation chamber and the reactor. In accordance with yet additional aspects of these embodiments, the intermediate reactive species formation chamber includes a catalyst—e.g., to facilitate formation of desired intermediate species. And, in accordance with additional aspects, the system includes a heater—e.g., to heat the intermediate reactive species formation chamber to a temperature of about 50° C. to about 200° C.
Both the foregoing summary and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure or the claimed invention.
A more complete understanding of exemplary embodiments of the present disclosure can be derived by referring to the detailed description and claims when considered in connection with the following illustrative FIGURE.
It will be appreciated that elements in the FIGURE are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the FIGURE may be exaggerated relative to other elements to help to improve the understanding of illustrated embodiments of the present disclosure.
The description of exemplary embodiments provided below is merely exemplary and is intended for purposes of illustration only; the following description is not intended to limit the scope of the disclosure or the claims. Moreover, recitation of multiple embodiments having stated features is not intended to exclude other embodiments having additional features or other embodiments incorporating different combinations of the stated features.
Exemplary methods and systems include use of an intermediate reactive species formation chamber to form intermediate reactive species. The intermediate reactive species can be used in subsequent reactions, such as deposition, etch, clean, and/or treatment reactions in a downstream reaction chamber.
Reactor 102 may be used to deposit material onto a surface of a substrate 146, etch material from a surface of substrate 146, clean a surface of substrate 146, treat a surface of substrate 146, deposit material onto a surface within reaction chamber 104, clean a surface within reaction chamber 104, etch a surface within reaction chamber 104, and/or treat a surface within reaction chamber 104. Reactor 102 can be a standalone reactor or part of a cluster tool. Further, reactor 102 can be dedicated to deposition, etch, clean, or treatment processes as described herein, or reactor 102 may be used for multiple processes—e.g., for any combination of deposition, etch, clean, and treatment processes. By way of examples, reactor 102 may include a reactor typically used for chemical vapor deposition, such as plasma-enhanced chemical vapor deposition (PECVD) and/or plasma-enhanced atomic layer deposition (PEALD) processing.
Substrate holder 106 is designed to hold substrate or workpiece 146 in place during processing. In accordance with various exemplary embodiments, reactor 102 includes direct plasma apparatus; in this case substrate holder 106 can form part of a direct plasma circuit. Additionally or alternatively, substrate holder 106 may be heated, cooled, or be at ambient process temperature during processing. By way of example, substrate holder 106 can be heated during substrate 146 processing, such that reactor 102 is operated in a cold-wall, hot-substrate configuration.
Although gas distribution system 108 is illustrated in block form, gas distribution system 108 may be relatively complex and be designed to mix gas (e.g., vapor) from reactant sources 114, 116, 118 intermediate species formation chamber 148, and/or carrier/purge gases from one or more sources 120, 122, 124 prior to distributing the gas mixture to reaction chamber 104. Further, system 108 may be configured to provide vertical (as illustrated) or horizontal flow of gasses to the chamber 104. An exemplary gas distribution system is described in U.S. Pat. No. 8,152,922 to Schmidt et al., issued Apr. 10, 2012, entitled “Gas Mixer and Manifold Assembly for ALD Reactor,” the contents of which are hereby incorporated herein by reference, to the extent the contents do not conflict with the present disclosure. By way of example, distribution system 108 includes a showerhead gas distribution system.
Remote plasma unit 110 is a remote plasma device, which is capable of forming a plasma. By way of particular examples, remote plasma unit 110 can be an inductively coupled plasma unit or a microwave remote plasma unit. In the illustrated example remote plasma unit 110 can be used to create reactive or excited species for use in intermediate reactive species formation chamber 148 and/or reactor 102. Although system 100 is illustrated with remote plasma unit 110, systems in accordance with other exemplary embodiments of the disclosure do not include a remote plasma unit. In addition to or as an alternative to using remote plasma unit 110 to form excited species, system 100 can include another excitation source, such as a thermal or hot filament source, a microwave source, or the like.
Vacuum source 112 can include any suitable vacuum source capable of providing a desired pressure in reaction chamber 104. Vacuum source 112 may include, for example, a dry vacuum pump alone or in combination with a turbo molecular pump.
Reactant gas sources or precursors 114, 116, and 118 can each include one or more gases, or materials that become gaseous, that are used in deposition, etch, clean, or treatment processes. Exemplary gas sources include nitrogen trifluoride (NF3). ammonia (NH3), water vapor (H2O). hydrogen peroxide (H2O2), MMH (mono methyl hydrazine), UDMH (unsymmetrical dimethyl hydrazine), O2/H2, N2/H2, and H2S. Although illustrated with three reactant gas sources 114-118, systems in accordance with the disclosure can include any suitable number of reactant sources.
As noted above, system 100 can be used to form intermediate reactive species from one or more precursors from a gas source such as one or more of gas sources 114-118. Because system 100 can form intermediate reactive species, precursors (e.g. from gas sources 114-118) can have relatively desirable precursor qualities—e.g., be relatively safe, inexpensive, etc., while the intermediate reactive species may have more desirable reactant qualities—e.g., be relatively reactive and provide relatively even deposition or etch characteristics across a surface of a substrate and/or within a reaction chamber. Exemplary intermediate reactive species formed from ammonia include, for example, ammonium fluoride, hydrazine (N2H4), NH2, which is relatively unstable, and diazene (N2H2). Both hydrazine and diazene are considered toxic and are not typically used in vapor deposition processes. However, both hydrazine and diazene have superior properties when forming nitride materials using vapor deposition processing. The present invention allows for the safe, easy formation of these intermediate reactive species. Similarly, OH— intermediate reactive species from H2O may be formed using the system described herein. Additional intermediate reactive species include H2O2 (peroxide), HO2, NH, NH4F (e.g., from excited NF3 species/Ar introduced via remote plasma unit 110 and NH3 introduced to (e.g., heated) intermediate reactive species formation chamber 148), N2H, and HS (e.g., from H2S), trisilophosphines, and excited species thereof. The terms “activated” and “excited” are used interchangeably herein.
In the context of reactor etching, treating, or cleaning, the intermediate reactants that are formed can be used to etch, treat, or clean reactor parts, such as a fore line, that might otherwise not be cleaned, treated, or etched with less stable reactants.
Purge gas sources 120-124 include one or more gases, or materials that become gaseous, that are relatively unreactive in reactor 102. Exemplary purge gasses include nitrogen, argon, helium, and any combinations thereof. Although illustrated with three purge gas sources, system in accordance with the present disclosure can include any suitable number of purge gas sources. Further one or more purge gas sources can provide one or more carrier gasses and/or system 100 can include additional carrier gas sources to provide a carrier gas to be mixed with one or more gases from a reactant source.
Flow controllers 126-136 can include any suitable device for controlling gas flow. For example, flow controllers 124-132 can be mass flow controllers.
Intermediate reactive species formation chamber 148 allows formation of desired intermediate reactive species, which can then be introduced into reaction chamber 104—e.g., in a steady-state manner. A pressure within intermediate reactive species formation chamber 148 can be controlled using pressure control device 140. System 100 can also include a presser sensor 152 to measure a pressure within intermediate reactive species formation chamber 148. In the illustrated example, pressure control device and pressure sensor 152 are coupled to controller 142 to control (e.g., closed-loop control) a pressure within intermediate reactive species formation chamber 148. Pressure control device 140 can include any suitable device that controls an upstream pressure. By way of example, pressure control device 140 is an active (e.g., closed-loop) pressure controller, such as MKS model 640A pressure controller. Alternatively, pressure control device can include a throttle valve. System 100 can be configured to pulse intermediate reactive species from intermediate reactive species formation chamber 148 to reaction chamber 104 using pressure control device 140 or other suitable valve.
A pressure within intermediate reactive species formation chamber 148 can be controlled independently from the pressure within reaction chamber 104. A pressure within intermediate reactive species formation chamber 148 can vary according to application. By way of examples, a pressure in intermediate reactive species formation chamber 148 can range from about 10 milliTorr to about 10 Torr.
Heater 150 can be used to heat intermediate reactive species formation chamber 148 to a desired temperature. Heater 150 can be configured to independently control a temperature of intermediate reactive species formation chamber 148—e.g., independent from a temperature within reaction chamber 104. Exemplary systems can control both a temperature and a pressure within intermediate reactive species formation chamber 148. Heater 150 can be a (e.g., resistive) jacket heater, a built-in heater, a radiant heater, or the like. In accordance with illustrated examples of the disclosure, heater 150 is configured to heat intermediate reactive species formation chamber 148 to a temperature of about 50° C. to about 200° C., or about 75° C. to about 175° C., or about 100° C. to about 150° C. Although not illustrated one or source gas lines (e.g., lines 131, 135, 137) and/or one or more purge gas lines (e.g., lines 127, 129, 133) can be heated to facilitate obtaining and/or retaining a desired temperature within intermediate reactive species formation chamber 148 and/or reaction chamber 104.
As illustrated, intermediate reactive species formation chamber 148 includes an inlet 154. Inlet 154 can include a first region 156 that has a larger cross-sectional opening relative to a downstream section 158. Further, inlet 154 can be tapered, e.g., in a frusto-conical shape, to provide angled walls. The angled walls can promote desired mixing of reactants within intermediate reactive species formation chamber 148. One or more reactants can be introduced to intermediate reactive species formation chamber 148 at or near inlet 154 to allow the reactants additional time to mix and react to form desired compounds/species within intermediate reactive species formation chamber 148.
Intermediate reactive species formation chamber 148 can be formed from a variety of materials, such as stainless steel or a Hastelloy® alloy. Intermediate reactive species formation chamber 148 can also include a catalyst within (e.g., coated on a surface or as a packed bed) intermediate reactive species formation chamber 148. The catalyst can be used to facilitate formation of one or more desired intermediate reactive species. For example, in the case when ammonia is used to make hydrazine, the catalyst may include iron, manganese oxide (MgO), or titanium oxide (TiO2). Other suitable catalytic materials include noble metals, such as platinum, palladium, and rhodium. Additionally or alternatively intermediate reactive species formation chamber 148 can include a liner, such as a quartz liner.
Optional integrated inlet manifold block 140 is designed to receive and distribute one or more gasses to reaction chamber 104. An exemplary integrated inlet manifold block 140 is disclosed in U.S. Pat. No. 7,918,938 to Provencher et al., issued Apr. 5, 2011, entitled “High Temperature ALD Inlet Manifold,” the contents of which are hereby incorporated herein by reference, to the extent the contents do not conflict with the present disclosure.
Although exemplary embodiments of the present disclosure are set forth herein, it should be appreciated that the disclosure is not so limited. For example, although the methods and reactor systems are described in connection with various specific configurations, the disclosure is not necessarily limited to these examples. Various modifications, variations, and enhancements of the exemplary systems and methods set forth herein may be made without departing from the spirit and scope of the present disclosure.
The subject matter of the present disclosure includes all novel and nonobvious combinations and subcombinations of the various systems, components, and configurations, and other features, functions, acts, and/or properties disclosed herein, as well as any and all equivalents thereof.
Number | Name | Date | Kind |
---|---|---|---|
D56051 | Cohn | Aug 1920 | S |
2161626 | Loughner et al. | Jun 1939 | A |
2745640 | Cushman | May 1956 | A |
2990045 | Root | Sep 1959 | A |
3089507 | Drake et al. | May 1963 | A |
3094396 | Flugge et al. | Jun 1963 | A |
3232437 | Hultgren | Feb 1966 | A |
3833492 | Bollyky | Sep 1974 | A |
3854443 | Baerg | Dec 1974 | A |
3862397 | Anderson et al. | Jan 1975 | A |
3887790 | Ferguson | Jun 1975 | A |
4054071 | Patejak | Oct 1977 | A |
4058430 | Suntola et al. | Nov 1977 | A |
4134425 | Gussefeld et al. | Jan 1979 | A |
4145699 | Hu et al. | Mar 1979 | A |
4164959 | Wurzburger | Aug 1979 | A |
4176630 | Elmer | Dec 1979 | A |
4181330 | Kojima | Jan 1980 | A |
4194536 | Stine et al. | Mar 1980 | A |
4322592 | Martin | Mar 1982 | A |
4389973 | Suntola et al. | Jun 1983 | A |
4393013 | McMenamin | Jul 1983 | A |
4401507 | Engle | Aug 1983 | A |
4414492 | Hanlet | Nov 1983 | A |
4436674 | McMenamin | Mar 1984 | A |
4479831 | Sandow | Oct 1984 | A |
4499354 | Hill et al. | Feb 1985 | A |
4512113 | Budinger | Apr 1985 | A |
4570328 | Price et al. | Feb 1986 | A |
4579623 | Suzuki et al. | Apr 1986 | A |
D288556 | Wallgren | Mar 1987 | S |
4653541 | Oehlschlaeger et al. | Mar 1987 | A |
4654226 | Jackson et al. | Mar 1987 | A |
4681134 | Paris | Jul 1987 | A |
4718637 | Contin | Jan 1988 | A |
4722298 | Rubin et al. | Feb 1988 | A |
4735259 | Vincent | Apr 1988 | A |
4753192 | Goldsmith et al. | Jun 1988 | A |
4756794 | Yoder | Jul 1988 | A |
4780169 | Stark et al. | Oct 1988 | A |
4789294 | Sato et al. | Dec 1988 | A |
4821674 | deBoer et al. | Apr 1989 | A |
4827430 | Aid et al. | May 1989 | A |
4837185 | Yau et al. | Jun 1989 | A |
4854263 | Chang et al. | Aug 1989 | A |
4857137 | Tashiro et al. | Aug 1989 | A |
4857382 | Sheng et al. | Aug 1989 | A |
4882199 | Sadoway et al. | Nov 1989 | A |
4976996 | Monkowski et al. | Dec 1990 | A |
4978567 | Miller | Dec 1990 | A |
4984904 | Nakano et al. | Jan 1991 | A |
4985114 | Okudaira | Jan 1991 | A |
4986215 | Yamada | Jan 1991 | A |
4987856 | Hey | Jan 1991 | A |
4991614 | Hammel | Feb 1991 | A |
5013691 | Lory et al. | May 1991 | A |
5027746 | Frijlink | Jul 1991 | A |
5028366 | Harakal et al. | Jul 1991 | A |
5060322 | Delepine | Oct 1991 | A |
5062386 | Christensen | Nov 1991 | A |
5065698 | Koike | Nov 1991 | A |
5074017 | Toya et al. | Dec 1991 | A |
5098638 | Sawada | Mar 1992 | A |
5104514 | Quartarone | Apr 1992 | A |
5116018 | Friemoth et al. | May 1992 | A |
D327534 | Manville | Jun 1992 | S |
5119760 | McMillan et al. | Jun 1992 | A |
5167716 | Boitnott et al. | Dec 1992 | A |
5178682 | Tsukamoto et al. | Jan 1993 | A |
5183511 | Yamazaki et al. | Feb 1993 | A |
5192717 | Kawakami | Mar 1993 | A |
5194401 | Adams et al. | Mar 1993 | A |
5199603 | Prescott | Apr 1993 | A |
5221556 | Hawkins et al. | Jun 1993 | A |
5242539 | Kumihashi et al. | Sep 1993 | A |
5243195 | Nishi | Sep 1993 | A |
5246500 | Samata et al. | Sep 1993 | A |
5271967 | Kramer et al. | Dec 1993 | A |
5278494 | Obigane | Jan 1994 | A |
5288684 | Yamazaki et al. | Feb 1994 | A |
5306946 | Yamamoto | Apr 1994 | A |
5310456 | Kadomura | May 1994 | A |
5310698 | Wild | May 1994 | A |
5315092 | Takahashi et al. | May 1994 | A |
5326427 | Jerbic | Jul 1994 | A |
5326722 | Huang | Jul 1994 | A |
5336327 | Lee | Aug 1994 | A |
5354580 | Goela et al. | Oct 1994 | A |
5356478 | Chen et al. | Oct 1994 | A |
5360269 | Ogawa et al. | Nov 1994 | A |
5380367 | Berton | Jan 1995 | A |
5382311 | Ishikawa et al. | Jan 1995 | A |
5404082 | Hernandez et al. | Apr 1995 | A |
5413813 | Cruse et al. | May 1995 | A |
5414221 | Gardner | May 1995 | A |
5415753 | Hurwitt et al. | May 1995 | A |
5421893 | Perlov | Jun 1995 | A |
5422139 | Shinriki et al. | Jun 1995 | A |
5430011 | Tanaka et al. | Jul 1995 | A |
5494494 | Mizuno et al. | Feb 1996 | A |
5496408 | Motoda et al. | Mar 1996 | A |
5504042 | Cho et al. | Apr 1996 | A |
5518549 | Hellwig | May 1996 | A |
5527417 | Iida et al. | Jun 1996 | A |
5531835 | Fodor et al. | Jul 1996 | A |
5574247 | Nishitani et al. | Nov 1996 | A |
5577331 | Suzuki | Nov 1996 | A |
5589002 | Su | Dec 1996 | A |
5589110 | Motoda et al. | Dec 1996 | A |
5595606 | Fujikawa et al. | Jan 1997 | A |
5601641 | Stephens | Feb 1997 | A |
5604410 | Vollkommer et al. | Feb 1997 | A |
5616947 | Tamura | Apr 1997 | A |
5621982 | Yamashita | Apr 1997 | A |
5632919 | MacCracken et al. | May 1997 | A |
D380527 | Velez | Jul 1997 | S |
5679215 | Barnes et al. | Oct 1997 | A |
5681779 | Pasch et al. | Oct 1997 | A |
5683517 | Shan | Nov 1997 | A |
5695567 | Kordina | Dec 1997 | A |
5718574 | Shimazu | Feb 1998 | A |
5724748 | Brooks | Mar 1998 | A |
5728223 | Murakarni et al. | Mar 1998 | A |
5730801 | Tepman et al. | Mar 1998 | A |
5732744 | Barr et al. | Mar 1998 | A |
5736314 | Hayes et al. | Apr 1998 | A |
5781693 | Balance et al. | Jul 1998 | A |
5782979 | Kaneno | Jul 1998 | A |
5786027 | Rolfson | Jul 1998 | A |
5796074 | Edelstein et al. | Aug 1998 | A |
5801104 | Schuegraf et al. | Sep 1998 | A |
5819434 | Herchen et al. | Oct 1998 | A |
5827757 | Robinson, Jr. et al. | Oct 1998 | A |
5836483 | Disel | Nov 1998 | A |
5837320 | Hampden-Smith et al. | Nov 1998 | A |
5852879 | Schumaier | Dec 1998 | A |
5853484 | Jeong | Dec 1998 | A |
5855680 | Soininen et al. | Jan 1999 | A |
5855681 | Maydan et al. | Jan 1999 | A |
5873942 | Park | Feb 1999 | A |
5877095 | Tamura et al. | Mar 1999 | A |
5888876 | Shiozawa et al. | Mar 1999 | A |
5908672 | Ryu | Jun 1999 | A |
5916365 | Sherman | Jun 1999 | A |
5920798 | Higuchi et al. | Jul 1999 | A |
5968275 | Lee et al. | Oct 1999 | A |
5975492 | Brenes | Nov 1999 | A |
5979506 | Aarseth | Nov 1999 | A |
5997588 | Goodwin | Dec 1999 | A |
D419652 | Hall et al. | Jan 2000 | S |
6013553 | Wallace | Jan 2000 | A |
6015465 | Kholodenko et al. | Jan 2000 | A |
6017779 | Miyasaka | Jan 2000 | A |
6024799 | Chen | Feb 2000 | A |
6035101 | Sajoto et al. | Mar 2000 | A |
6042652 | Hyun | Mar 2000 | A |
6017818 | Wytman | Apr 2000 | A |
6044860 | Nue | Apr 2000 | A |
6050506 | Guo et al. | Apr 2000 | A |
6060691 | Minami et al. | May 2000 | A |
6067680 | Pan et al. | May 2000 | A |
6074443 | Venkatesh | Jun 2000 | A |
6083321 | Lei et al. | Jul 2000 | A |
6086677 | Umotoy et al. | Jul 2000 | A |
6099302 | Hong et al. | Aug 2000 | A |
6122036 | Yamasaki et al. | Sep 2000 | A |
6124600 | Moroishi et al. | Sep 2000 | A |
6125789 | Gupta et al. | Oct 2000 | A |
6129044 | Zhao et al. | Oct 2000 | A |
6134807 | Komino | Oct 2000 | A |
6137240 | Bogdan et al. | Oct 2000 | A |
6140252 | Cho et al. | Oct 2000 | A |
6148761 | Majewski et al. | Nov 2000 | A |
6160244 | Ohashi | Dec 2000 | A |
6161500 | Kopacz et al. | Dec 2000 | A |
6162323 | Koshimizu et al. | Dec 2000 | A |
6180979 | Hofman et al. | Jan 2001 | B1 |
6187691 | Fukuda | Feb 2001 | B1 |
6190634 | Lieber | Feb 2001 | B1 |
6194037 | Terasaki et al. | Feb 2001 | B1 |
6201999 | Jevtic | Mar 2001 | B1 |
6204206 | Hurley | Mar 2001 | B1 |
6207932 | Yoo | Mar 2001 | B1 |
6212789 | Kato | Apr 2001 | B1 |
6250250 | Maishev et al. | Jun 2001 | B1 |
6271148 | Kao | Aug 2001 | B1 |
6274878 | Li et al. | Aug 2001 | B1 |
6287965 | Kang et al. | Sep 2001 | B1 |
D449873 | Bronson | Oct 2001 | S |
6296909 | Spitsberg | Oct 2001 | B1 |
6299133 | Waragai et al. | Oct 2001 | B2 |
6302964 | Umotoy et al. | Oct 2001 | B1 |
6303523 | Cheung | Oct 2001 | B2 |
6305898 | Yamagishi et al. | Oct 2001 | B1 |
6312525 | Bright et al. | Nov 2001 | B1 |
6315512 | Tabrizi et al. | Nov 2001 | B1 |
D451893 | Robson | Dec 2001 | S |
D452220 | Robson | Dec 2001 | S |
6325858 | Wengert | Dec 2001 | B1 |
6326597 | Lubomirsky et al. | Dec 2001 | B1 |
6329297 | Balish | Dec 2001 | B1 |
6342427 | Choi et al. | Jan 2002 | B1 |
6347636 | Xia | Feb 2002 | B1 |
6352945 | Matsuki | Mar 2002 | B1 |
6367410 | Leahey et al. | Apr 2002 | B1 |
6368987 | Kopacz et al. | Apr 2002 | B1 |
6370796 | Zucker | Apr 2002 | B1 |
6374831 | Chandran | Apr 2002 | B1 |
6375312 | Ikeda et al. | Apr 2002 | B1 |
D457609 | Piano | May 2002 | S |
6383566 | Zagdoun | May 2002 | B1 |
6383955 | Matsuki | May 2002 | B1 |
6387207 | Janakiraman | May 2002 | B1 |
6391803 | Kim et al. | May 2002 | B1 |
6398184 | Sowada et al. | Jun 2002 | B1 |
6410459 | Blalock et al. | Jun 2002 | B2 |
6413321 | Kim et al. | Jul 2002 | B1 |
6413583 | Moghadam et al. | Jul 2002 | B1 |
6420279 | Ono et al. | Jul 2002 | B1 |
D461233 | Whalen | Aug 2002 | S |
D461882 | Piano | Aug 2002 | S |
6435798 | Satoh | Aug 2002 | B1 |
6436819 | Zhang | Aug 2002 | B1 |
6437444 | Andideh | Aug 2002 | B2 |
6445574 | Saw et al. | Sep 2002 | B1 |
6446573 | Hirayama et al. | Sep 2002 | B2 |
6448192 | Kaushik | Sep 2002 | B1 |
6450757 | Saeki | Sep 2002 | B1 |
6454860 | Metzner et al. | Sep 2002 | B2 |
6455445 | Matsuki | Sep 2002 | B2 |
6461435 | Littau et al. | Oct 2002 | B1 |
6468924 | Lee | Oct 2002 | B2 |
6472266 | Yu et al. | Oct 2002 | B1 |
6475276 | Elers et al. | Nov 2002 | B1 |
6475930 | Junker et al. | Nov 2002 | B1 |
6478872 | Chae et al. | Nov 2002 | B1 |
6482331 | Lu et al. | Nov 2002 | B2 |
6482663 | Buckland | Nov 2002 | B1 |
6483989 | Okada et al. | Nov 2002 | B1 |
6499533 | Yamada | Dec 2002 | B2 |
6503562 | Saito et al. | Jan 2003 | B1 |
6503826 | Oda | Jan 2003 | B1 |
6511539 | Raaijmakers | Jan 2003 | B1 |
6521295 | Remington | Feb 2003 | B1 |
6521547 | Chang et al. | Feb 2003 | B1 |
6528430 | Kwan | Mar 2003 | B2 |
6528767 | Bagley et al. | Mar 2003 | B2 |
6531193 | Fonash et al. | Mar 2003 | B2 |
6531412 | Conti et al. | Mar 2003 | B2 |
6534395 | Werkhoven et al. | Mar 2003 | B2 |
6552209 | Lei et al. | Apr 2003 | B1 |
6569239 | Arai et al. | May 2003 | B2 |
6573030 | Fairbairn et al. | Jun 2003 | B1 |
6576062 | Matsuse | Jun 2003 | B2 |
6576064 | Griffiths et al. | Jun 2003 | B2 |
6576300 | Berry et al. | Jun 2003 | B1 |
6578589 | Mayusumi | Jun 2003 | B1 |
6579833 | McNallan et al. | Jun 2003 | B1 |
6583048 | Vincent et al. | Jun 2003 | B1 |
6590251 | Kang et al. | Jul 2003 | B2 |
6594550 | Okrah | Jul 2003 | B1 |
6598559 | Vellore et al. | Jul 2003 | B1 |
6627503 | Ma et al. | Sep 2003 | B2 |
6632478 | Gaillard et al. | Oct 2003 | B2 |
6633364 | Hayashi | Oct 2003 | B2 |
6635117 | Kinnard et al. | Oct 2003 | B1 |
6638839 | Deng et al. | Oct 2003 | B2 |
6645304 | Yamaguchi | Nov 2003 | B2 |
6648974 | Ogliari et al. | Nov 2003 | B1 |
6649921 | Cekic et al. | Nov 2003 | B1 |
6652924 | Sherman | Nov 2003 | B2 |
6656281 | Ueda | Dec 2003 | B1 |
6673196 | Oyabu | Jan 2004 | B1 |
6682973 | Paton et al. | Jan 2004 | B1 |
D486891 | Cronce | Feb 2004 | S |
6688784 | Templeton | Feb 2004 | B1 |
6689220 | Nguyen | Feb 2004 | B1 |
6692575 | Omstead et al. | Feb 2004 | B1 |
6692576 | Halpin et al. | Feb 2004 | B2 |
6699003 | Saeki | Mar 2004 | B2 |
6709989 | Ramdani et al. | Mar 2004 | B2 |
6710364 | Guldi et al. | Mar 2004 | B2 |
6713824 | Mikata | Mar 2004 | B1 |
6716571 | Gabriel | Apr 2004 | B2 |
6730614 | Lim et al. | May 2004 | B1 |
6734090 | Agarwala et al. | May 2004 | B2 |
6740853 | Kitayama et al. | May 2004 | B1 |
6743475 | Skarp et al. | Jun 2004 | B2 |
6743738 | Todd et al. | Jun 2004 | B2 |
6753507 | Fure et al. | Jun 2004 | B2 |
6756318 | Nguyen et al. | Jun 2004 | B2 |
6759098 | Han | Jul 2004 | B2 |
6760981 | Leap | Jul 2004 | B2 |
6784108 | Donohoe et al. | Aug 2004 | B1 |
6809005 | Ranade et al. | Oct 2004 | B2 |
6815350 | Kim et al. | Nov 2004 | B2 |
6820570 | Kilpela et al. | Nov 2004 | B2 |
6821910 | Adomaitis et al. | Nov 2004 | B2 |
6824665 | Shelnut et al. | Nov 2004 | B2 |
6825134 | Law et al. | Nov 2004 | B2 |
6835039 | Van Den Berg | Dec 2004 | B2 |
6846515 | Vrtis | Jan 2005 | B2 |
6847014 | Benjamin et al. | Jan 2005 | B1 |
6858524 | Haukka et al. | Feb 2005 | B2 |
6858547 | Metzner | Feb 2005 | B2 |
6861334 | Raaijmakers et al. | Mar 2005 | B2 |
6863019 | Shamouilian | Mar 2005 | B2 |
6864041 | Brown | Mar 2005 | B2 |
6872258 | Park et al. | Mar 2005 | B2 |
6872259 | Strang | Mar 2005 | B2 |
6874247 | Hsu | Apr 2005 | B1 |
6874480 | Ismailov | Apr 2005 | B1 |
6875677 | Conley, Jr. et al. | Apr 2005 | B1 |
6876017 | Goodner | Apr 2005 | B2 |
6884066 | Nguyen et al. | Apr 2005 | B2 |
6884319 | Kim | Apr 2005 | B2 |
6889864 | Lindfors et al. | May 2005 | B2 |
6895158 | Alyward et al. | May 2005 | B2 |
6899507 | Yamagishi et al. | May 2005 | B2 |
6909839 | Wang et al. | Jun 2005 | B2 |
6911092 | Sneh | Jun 2005 | B2 |
6913796 | Albano et al. | Jul 2005 | B2 |
6930059 | Conley, Jr. et al. | Aug 2005 | B2 |
6935269 | Lee et al. | Aug 2005 | B2 |
6939817 | Sandhu et al. | Sep 2005 | B2 |
6951587 | Narushima | Oct 2005 | B1 |
6953609 | Carollo | Oct 2005 | B2 |
6955836 | Kumagai et al. | Oct 2005 | B2 |
6972478 | Waite et al. | Dec 2005 | B1 |
6974781 | Timmermans et al. | Dec 2005 | B2 |
6976822 | Woodruff | Dec 2005 | B2 |
6984595 | Yamazaki | Jan 2006 | B1 |
6990430 | Hosek | Jan 2006 | B2 |
7005391 | Min | Feb 2006 | B2 |
7021881 | Yamagishi | Apr 2006 | B2 |
7045430 | Ahn et al. | May 2006 | B2 |
7049247 | Gates et al. | May 2006 | B2 |
7053009 | Conley, Jr. et al. | May 2006 | B2 |
7055875 | Bonora | Jun 2006 | B2 |
7071051 | Jeon et al. | Jul 2006 | B1 |
7084079 | Conti et al. | Aug 2006 | B2 |
7087536 | Nemani et al. | Aug 2006 | B2 |
7088003 | Gates et al. | Aug 2006 | B2 |
7092287 | Beulens et al. | Aug 2006 | B2 |
7098149 | Lukas | Aug 2006 | B2 |
7109098 | Ramaswamy et al. | Sep 2006 | B1 |
7115838 | Kurara et al. | Oct 2006 | B2 |
7122085 | Shero et al. | Oct 2006 | B2 |
7122222 | Xiao et al. | Oct 2006 | B2 |
7129165 | Basol et al. | Oct 2006 | B2 |
7132360 | Schaeffer et al. | Nov 2006 | B2 |
7135421 | Ahn et al. | Nov 2006 | B2 |
7143897 | Guzman et al. | Dec 2006 | B1 |
7147766 | Uzoh et al. | Dec 2006 | B2 |
7153542 | Nguyen et al. | Dec 2006 | B2 |
7157327 | Haupt | Jan 2007 | B2 |
7163721 | Zhang et al. | Jan 2007 | B2 |
7163900 | Weber | Jan 2007 | B2 |
7172497 | Basol et al. | Feb 2007 | B2 |
7186648 | Rozbicki | Mar 2007 | B1 |
7192824 | Ahn et al. | Mar 2007 | B2 |
7192892 | Ahn et al. | Mar 2007 | B2 |
7195693 | Cowans | Mar 2007 | B2 |
7204887 | Kawamura et al. | Apr 2007 | B2 |
7205246 | MacNeil et al. | Apr 2007 | B2 |
7205247 | Lee et al. | Apr 2007 | B2 |
7207763 | Lee | Apr 2007 | B2 |
7208389 | Tipton et al. | Apr 2007 | B1 |
7211524 | Ryu et al. | May 2007 | B2 |
7234476 | Arai | Jun 2007 | B2 |
7235137 | Kitayama et al. | Jun 2007 | B2 |
7235482 | Wu | Jun 2007 | B2 |
7235501 | Ahn et al. | Jun 2007 | B2 |
7238596 | Kouvetakis et al. | Jul 2007 | B2 |
7265061 | Cho et al. | Sep 2007 | B1 |
D553104 | Oohashi et al. | Oct 2007 | S |
7288463 | Papasouliotis | Oct 2007 | B1 |
7290813 | Bonora | Nov 2007 | B2 |
7294581 | Haverkort et al. | Nov 2007 | B2 |
7297641 | Todd et al. | Nov 2007 | B2 |
7298009 | Yan et al. | Nov 2007 | B2 |
D557226 | Uchino et al. | Dec 2007 | S |
7307178 | Kiyomori et al. | Dec 2007 | B2 |
7312148 | Ramaswamy et al. | Dec 2007 | B2 |
7312162 | Ramaswamy et al. | Dec 2007 | B2 |
7312494 | Ahn et al. | Dec 2007 | B2 |
7323401 | Ramaswamy et al. | Jan 2008 | B2 |
7326657 | Xia et al. | Feb 2008 | B2 |
7327948 | Shrinivasan | Feb 2008 | B1 |
7329947 | Adachi et al. | Feb 2008 | B2 |
7335611 | Ramaswamy et al. | Feb 2008 | B2 |
7354847 | Chan et al. | Apr 2008 | B2 |
7357138 | Ji et al. | Apr 2008 | B2 |
7393418 | Yokogawa | Jul 2008 | B2 |
7393736 | Ahn et al. | Jul 2008 | B2 |
7393765 | Hanawa et al. | Jul 2008 | B2 |
7396491 | Marking et al. | Jul 2008 | B2 |
7399388 | Moghadam et al. | Jul 2008 | B2 |
7402534 | Mahajani | Jul 2008 | B2 |
7405166 | Liang et al. | Jul 2008 | B2 |
7405454 | Ahn et al. | Jul 2008 | B2 |
7414281 | Fastow | Aug 2008 | B1 |
7422775 | Ramaswamy et al. | Sep 2008 | B2 |
7429532 | Ramaswamy et al. | Sep 2008 | B2 |
7431966 | Derderian et al. | Oct 2008 | B2 |
7437060 | Wang et al. | Oct 2008 | B2 |
7442275 | Cowans | Oct 2008 | B2 |
7476291 | Wang et al. | Jan 2009 | B2 |
7479198 | Guffrey | Jan 2009 | B2 |
D585968 | Elkins et al. | Feb 2009 | S |
7489389 | Shibazaki et al. | Feb 2009 | B2 |
7494882 | Vitale | Feb 2009 | B2 |
7498242 | Kumar et al. | Mar 2009 | B2 |
7501292 | Matsushita et al. | Mar 2009 | B2 |
7503980 | Kida et al. | Mar 2009 | B2 |
7514375 | Shanker et al. | Apr 2009 | B1 |
7541297 | Mallick et al. | Apr 2009 | B2 |
D593969 | Li | Jun 2009 | S |
7547363 | Tomiyasu et al. | Jun 2009 | B2 |
7566891 | Rocha-Alvarez et al. | Jul 2009 | B2 |
7575968 | Sadaka et al. | Aug 2009 | B2 |
7579785 | DeVincentis et al. | Aug 2009 | B2 |
7582555 | Lang | Sep 2009 | B1 |
7589003 | Kouvetakis et al. | Sep 2009 | B2 |
7589029 | Derderian et al. | Sep 2009 | B2 |
D602575 | Breda | Oct 2009 | S |
7601223 | Lindfors et al. | Oct 2009 | B2 |
7601225 | Tuominen et al. | Oct 2009 | B2 |
7611751 | Elers | Nov 2009 | B2 |
7611980 | Wells et al. | Nov 2009 | B2 |
7618226 | Takizawa | Nov 2009 | B2 |
7629277 | Ghatnagar | Dec 2009 | B2 |
7632549 | Goundar | Dec 2009 | B2 |
7640142 | Tachikawa et al. | Dec 2009 | B2 |
7651583 | Kent et al. | Jan 2010 | B2 |
7651961 | Clark | Jan 2010 | B2 |
D609655 | Sugimoto | Feb 2010 | S |
7678197 | Maki | Mar 2010 | B2 |
7678715 | Mungekar et al. | Mar 2010 | B2 |
7682454 | Sneh | Mar 2010 | B2 |
7682657 | Sherman | Mar 2010 | B2 |
D613829 | Griffin et al. | Apr 2010 | S |
D614153 | Fondurulia et al. | Apr 2010 | S |
D614267 | Breda | Apr 2010 | S |
D614268 | Breda | Apr 2010 | S |
7690881 | Yamagishi | Apr 2010 | B2 |
7691205 | Ikedo | Apr 2010 | B2 |
7713874 | Milligan | May 2010 | B2 |
7720560 | Menser et al. | May 2010 | B2 |
7723648 | Tsukamoto et al. | May 2010 | B2 |
7727864 | Elers | Jun 2010 | B2 |
7732343 | Niroomand et al. | Jun 2010 | B2 |
7740705 | Li | Jun 2010 | B2 |
7754621 | Putjkonen | Jul 2010 | B2 |
7767262 | Clark | Aug 2010 | B2 |
7780440 | Shibagaki et al. | Aug 2010 | B2 |
7789965 | Matsushita et al. | Sep 2010 | B2 |
7790633 | Tarafdar et al. | Sep 2010 | B1 |
7803722 | Liang | Sep 2010 | B2 |
7807578 | Bencher et al. | Oct 2010 | B2 |
7816278 | Reed et al. | Oct 2010 | B2 |
7824492 | Tois et al. | Nov 2010 | B2 |
7825040 | Fukazawa et al. | Nov 2010 | B1 |
7833353 | Furukawahara et al. | Nov 2010 | B2 |
7838084 | Derderian et al. | Nov 2010 | B2 |
7842518 | Miyajima | Nov 2010 | B2 |
7842622 | Lee et al. | Nov 2010 | B1 |
D629874 | Hermans | Dec 2010 | S |
7851019 | Tuominen et al. | Dec 2010 | B2 |
7851232 | van Schravendijk et al. | Dec 2010 | B2 |
7865070 | Nakamura | Jan 2011 | B2 |
7884918 | Hattori | Feb 2011 | B2 |
7888233 | Gauri | Feb 2011 | B1 |
D634719 | Yasuda et al. | Mar 2011 | S |
7897215 | Fair et al. | Mar 2011 | B1 |
7902582 | Forbes et al. | Mar 2011 | B2 |
7910288 | Abatchev et al. | Mar 2011 | B2 |
7915139 | Lang | Mar 2011 | B1 |
7919416 | Lee et al. | Apr 2011 | B2 |
7925378 | Gilchrist et al. | Apr 2011 | B2 |
7935940 | Smargiassi | May 2011 | B1 |
7939447 | Bauer et al. | May 2011 | B2 |
7955516 | Chandrachood | Jun 2011 | B2 |
7963736 | Takizawa et al. | Jun 2011 | B2 |
7972980 | Lee et al. | Jul 2011 | B2 |
7981751 | Zhu et al. | Jul 2011 | B2 |
D643055 | Takahashi | Aug 2011 | S |
7992318 | Kawaji | Aug 2011 | B2 |
7994721 | Espiau et al. | Aug 2011 | B2 |
7998875 | DeYoung | Aug 2011 | B2 |
8003174 | Fukazawa | Aug 2011 | B2 |
8004198 | Bakre et al. | Aug 2011 | B2 |
8020315 | Nishimura | Sep 2011 | B2 |
8030129 | Jeong | Oct 2011 | B2 |
8038835 | Hayashi et al. | Oct 2011 | B2 |
8041197 | Kasai et al. | Oct 2011 | B2 |
8041450 | Takizawa et al. | Oct 2011 | B2 |
8043972 | Numakura | Oct 2011 | B1 |
8055378 | Numakura | Nov 2011 | B2 |
8060252 | Gage et al. | Nov 2011 | B2 |
8071451 | Uzoh | Dec 2011 | B2 |
8071452 | Raisanen | Dec 2011 | B2 |
8072578 | Yasuda et al. | Dec 2011 | B2 |
8076230 | Wei | Dec 2011 | B2 |
8076237 | Uzoh | Dec 2011 | B2 |
8076251 | Akae et al. | Dec 2011 | B2 |
8082946 | Laverdiere et al. | Dec 2011 | B2 |
D652896 | Gether | Jan 2012 | S |
8092604 | Tomiyasu et al. | Jan 2012 | B2 |
D653734 | Sisk | Feb 2012 | S |
D655055 | Toll | Feb 2012 | S |
8119466 | Avouris | Feb 2012 | B2 |
8137462 | Fondurulia et al. | Mar 2012 | B2 |
8137465 | Shrinivasan et al. | Mar 2012 | B1 |
8138676 | Mills | Mar 2012 | B2 |
8142862 | Lee et al. | Mar 2012 | B2 |
8143174 | Xia et al. | Mar 2012 | B2 |
8147242 | Shibagaki et al. | Apr 2012 | B2 |
8173554 | Lee et al. | May 2012 | B2 |
8187951 | Wang | May 2012 | B1 |
8272516 | Salvador | May 2012 | B2 |
8192901 | Kageyama | Jun 2012 | B2 |
8196234 | Glunk | Jun 2012 | B2 |
8197915 | Oka et al. | Jun 2012 | B2 |
8216380 | White et al. | Jul 2012 | B2 |
8231799 | Bera et al. | Jul 2012 | B2 |
D665055 | Yanagisawa et al. | Aug 2012 | S |
8241991 | Hsieh et al. | Aug 2012 | B2 |
8242031 | Mallick et al. | Aug 2012 | B2 |
8252114 | Vukovic | Aug 2012 | B2 |
8252659 | Huyghabaert et al. | Aug 2012 | B2 |
8252691 | Beynet et al. | Aug 2012 | B2 |
8267633 | Obikane | Sep 2012 | B2 |
8278176 | Bauer et al. | Oct 2012 | B2 |
8282769 | Iizuka | Oct 2012 | B2 |
8287648 | Reed et al. | Oct 2012 | B2 |
8293016 | Bahng et al. | Oct 2012 | B2 |
8298951 | Nakano | Oct 2012 | B1 |
8307472 | Saxon et al. | Nov 2012 | B1 |
8309173 | Tuominen et al. | Nov 2012 | B2 |
8323413 | Son | Dec 2012 | B2 |
8329599 | Fukazawa et al. | Dec 2012 | B2 |
8334219 | Lee et al. | Dec 2012 | B2 |
8367528 | Bauer et al. | Feb 2013 | B2 |
8372204 | Nakamura | Feb 2013 | B2 |
8393091 | Kawamoto | Mar 2013 | B2 |
8394466 | Hong et al. | Mar 2013 | B2 |
8415258 | Akae | Apr 2013 | B2 |
8415259 | Lee et al. | Apr 2013 | B2 |
8440259 | Chiang et al. | May 2013 | B2 |
8444120 | Gregg et al. | May 2013 | B2 |
8445075 | Xu et al. | May 2013 | B2 |
8465811 | Ueda | Jun 2013 | B2 |
8466411 | Arai | Jun 2013 | B2 |
8470187 | Ha | Jun 2013 | B2 |
8484846 | Dhindsa | Jul 2013 | B2 |
8492170 | Xie et al. | Jul 2013 | B2 |
8496756 | Cruse et al. | Jul 2013 | B2 |
8506713 | Takagi | Aug 2013 | B2 |
8535767 | Kimura | Sep 2013 | B1 |
D691974 | Osada et al. | Oct 2013 | S |
8551892 | Nakano | Oct 2013 | B2 |
8563443 | Fukazawa | Oct 2013 | B2 |
8569184 | Oka | Oct 2013 | B2 |
8591659 | Fang et al. | Nov 2013 | B1 |
8592005 | Ueda | Nov 2013 | B2 |
8608885 | Goto et al. | Nov 2013 | B2 |
8617411 | Singh | Dec 2013 | B2 |
8633115 | Chang et al. | Jan 2014 | B2 |
8647722 | Kobayashi et al. | Feb 2014 | B2 |
8664127 | Bhatia et al. | Mar 2014 | B2 |
8664627 | Ishikawa et al. | Mar 2014 | B1 |
8667654 | Gros-Jean | Mar 2014 | B2 |
8668957 | Dussarrat et al. | Mar 2014 | B2 |
8669185 | Onizawa | Mar 2014 | B2 |
8683943 | Onodera et al. | Apr 2014 | B2 |
8711338 | Liu et al. | Apr 2014 | B2 |
D705745 | Kurs et al. | May 2014 | S |
8720965 | Hino et al. | May 2014 | B2 |
8722510 | Watanabe et al. | May 2014 | B2 |
8722546 | Fukazawa et al. | May 2014 | B2 |
8726837 | Patalay et al. | May 2014 | B2 |
8728832 | Raisanen et al. | May 2014 | B2 |
8742668 | Nakano et al. | Jun 2014 | B2 |
8764085 | Urabe | Jul 2014 | B2 |
8784950 | Fukazawa et al. | Jul 2014 | B2 |
8784951 | Fukazawa et al. | Jul 2014 | B2 |
8785215 | Kobayashi et al. | Jul 2014 | B2 |
8790749 | Omori et al. | Jul 2014 | B2 |
8802201 | Raisanen et al. | Aug 2014 | B2 |
8820809 | Ando et al. | Sep 2014 | B2 |
8821640 | Cleary et al. | Sep 2014 | B2 |
8841182 | Chen et al. | Sep 2014 | B1 |
8845806 | Aida et al. | Sep 2014 | B2 |
D715410 | Lohmann | Oct 2014 | S |
8864202 | Schrameyer | Oct 2014 | B1 |
D716742 | Jang et al. | Nov 2014 | S |
8877655 | Shero et al. | Nov 2014 | B2 |
8883270 | Shero et al. | Nov 2014 | B2 |
8901016 | Ha et al. | Dec 2014 | B2 |
8911826 | Adachi et al. | Dec 2014 | B2 |
8912101 | Tsuji et al. | Dec 2014 | B2 |
D720838 | Yamagishi et al. | Jan 2015 | S |
8940646 | Chandrasekharan | Jan 2015 | B1 |
8945305 | Marsh | Feb 2015 | B2 |
8945339 | Kakimoto | Feb 2015 | B2 |
8956983 | Swaminathan | Feb 2015 | B2 |
D724701 | Yamagishi et al. | Mar 2015 | S |
8967608 | Mitsumori et al. | Mar 2015 | B2 |
8986456 | Fondurulia et al. | Mar 2015 | B2 |
8991887 | Shin et al. | Mar 2015 | B2 |
8993054 | Jung et al. | Mar 2015 | B2 |
D726884 | Yamagishi et al. | Apr 2015 | S |
9005539 | Halpin et al. | Apr 2015 | B2 |
9017481 | Pettinger et al. | Apr 2015 | B1 |
9018093 | Tsuji et al. | Apr 2015 | B2 |
9018111 | Milligan et al. | Apr 2015 | B2 |
9021985 | Alokozai et al. | May 2015 | B2 |
9023737 | Beynet et al. | May 2015 | B2 |
9023738 | Kato et al. | May 2015 | B2 |
9029253 | Milligan et al. | May 2015 | B2 |
9029272 | Nakano | May 2015 | B1 |
D732644 | Yamagishi et al. | Jun 2015 | S |
D733261 | Yamagishi et al. | Jun 2015 | S |
D733843 | Yamagishi et al. | Jul 2015 | S |
9096931 | Yednak et al. | Aug 2015 | B2 |
9117657 | Nakano et al. | Aug 2015 | B2 |
9123510 | Nakano et al. | Sep 2015 | B2 |
9136108 | Matsushita et al. | Sep 2015 | B2 |
9142393 | Okabe et al. | Sep 2015 | B2 |
9171714 | Mori | Oct 2015 | B2 |
9171716 | Fukuda | Oct 2015 | B2 |
9190263 | Ishikawa et al. | Nov 2015 | B2 |
9190264 | Yuasa et al. | Nov 2015 | B2 |
9196483 | Lee et al. | Nov 2015 | B1 |
9202727 | Dunn et al. | Dec 2015 | B2 |
9257274 | Kang et al. | Feb 2016 | B2 |
9299595 | Dunn et al. | Mar 2016 | B2 |
9324811 | Weeks | Apr 2016 | B2 |
9341296 | Yednak | May 2016 | B2 |
9384987 | Camillo | Jul 2016 | B2 |
9394608 | Jung et al. | Jul 2016 | B2 |
9396934 | Shero et al. | Jul 2016 | B2 |
9396956 | Tolle | Jul 2016 | B1 |
9404587 | Fukazawa | Aug 2016 | B2 |
9412564 | Shugrue | Aug 2016 | B2 |
9447498 | Milligan | Sep 2016 | B2 |
20010017103 | Takeshita et al. | Aug 2001 | A1 |
20010018267 | Shinriki et al. | Aug 2001 | A1 |
20010019777 | Tanaka et al. | Sep 2001 | A1 |
20010019900 | Hasegawa | Sep 2001 | A1 |
20010028924 | Sherman | Oct 2001 | A1 |
20010046765 | Cappellani et al. | Nov 2001 | A1 |
20010049202 | Maeda et al. | Dec 2001 | A1 |
20020001974 | Chan | Jan 2002 | A1 |
20020001976 | Danek | Jan 2002 | A1 |
20020011210 | Satoh et al. | Jan 2002 | A1 |
20020014204 | Pyo | Feb 2002 | A1 |
20020064592 | Datta et al. | May 2002 | A1 |
20020076507 | Chiang et al. | Jun 2002 | A1 |
20020079714 | Soucy et al. | Jun 2002 | A1 |
20020088542 | Nishikawa et al. | Jul 2002 | A1 |
20020098627 | Pomarede et al. | Jul 2002 | A1 |
20020108670 | Baker et al. | Aug 2002 | A1 |
20020110991 | Li | Aug 2002 | A1 |
20020114886 | Chou et al. | Aug 2002 | A1 |
20020115252 | Haukka et al. | Aug 2002 | A1 |
20020164420 | Derderian | Nov 2002 | A1 |
20020172768 | Endo et al. | Nov 2002 | A1 |
20020187650 | Blalock et al. | Dec 2002 | A1 |
20020197849 | Mandal | Dec 2002 | A1 |
20030003635 | Paranjpe et al. | Jan 2003 | A1 |
20030003696 | Gelatos et al. | Jan 2003 | A1 |
20030010452 | Park et al. | Jan 2003 | A1 |
20030012632 | Saeki | Jan 2003 | A1 |
20030015596 | Evans | Jan 2003 | A1 |
20030019428 | Ku et al. | Jan 2003 | A1 |
20030019580 | Strang | Jan 2003 | A1 |
20030025146 | Narwankar et al. | Feb 2003 | A1 |
20030040158 | Saitoh | Feb 2003 | A1 |
20030042419 | Katsumata et al. | Mar 2003 | A1 |
20030049375 | Nguyen et al. | Mar 2003 | A1 |
20030054670 | Wang et al. | Mar 2003 | A1 |
20030059535 | Luo et al. | Mar 2003 | A1 |
20030059980 | Chen et al. | Mar 2003 | A1 |
20030066826 | Lee et al. | Apr 2003 | A1 |
20030075925 | Lindfors et al. | Apr 2003 | A1 |
20030091938 | Fairbairn et al. | May 2003 | A1 |
20030094133 | Yoshidome et al. | May 2003 | A1 |
20030111963 | Tolmachev et al. | Jun 2003 | A1 |
20030121608 | Chen | Jul 2003 | A1 |
20030134038 | Paranjpe | Jul 2003 | A1 |
20030141820 | White et al. | Jul 2003 | A1 |
20030143328 | Chen | Jul 2003 | A1 |
20030157436 | Manger et al. | Aug 2003 | A1 |
20030168001 | Sneh | Sep 2003 | A1 |
20030170583 | Nakashima | Sep 2003 | A1 |
20030180458 | Sneh | Sep 2003 | A1 |
20030183156 | Dando | Oct 2003 | A1 |
20030188685 | Wang | Oct 2003 | A1 |
20030192875 | Bieker et al. | Oct 2003 | A1 |
20030198587 | Kaloyeros | Oct 2003 | A1 |
20030209323 | Yokogaki | Nov 2003 | A1 |
20030217915 | Ouellet | Nov 2003 | A1 |
20030228772 | Cowans | Dec 2003 | A1 |
20030232138 | Tuominen et al. | Dec 2003 | A1 |
20040009679 | Yeo et al. | Jan 2004 | A1 |
20040013577 | Ganguli et al. | Jan 2004 | A1 |
20040013818 | Moon et al. | Jan 2004 | A1 |
20040016637 | Yang | Jan 2004 | A1 |
20040018307 | Park et al. | Jan 2004 | A1 |
20040018750 | Sophie et al. | Jan 2004 | A1 |
20040023516 | Londergan et al. | Feb 2004 | A1 |
20040029052 | Park et al. | Feb 2004 | A1 |
20040036129 | Forbes et al. | Feb 2004 | A1 |
20040106249 | Huotari | Feb 2004 | A1 |
20040063289 | Ohta | Apr 2004 | A1 |
20040071897 | Verplancken et al. | Apr 2004 | A1 |
20040077182 | Lim et al. | Apr 2004 | A1 |
20040079960 | Shakuda | Apr 2004 | A1 |
20040080697 | Song | Apr 2004 | A1 |
20040082171 | Shin et al. | Apr 2004 | A1 |
20040094402 | Gopalraja | May 2004 | A1 |
20040101622 | Park et al. | May 2004 | A1 |
20040103914 | Cheng et al. | Jun 2004 | A1 |
20040124131 | Aitchison | Jul 2004 | A1 |
20040124549 | Curran | Jul 2004 | A1 |
20040134429 | Yamanaka | Jul 2004 | A1 |
20040144980 | Ahn et al. | Jul 2004 | A1 |
20040146644 | Xia et al. | Jul 2004 | A1 |
20040168627 | Conley et al. | Sep 2004 | A1 |
20040169032 | Murayama et al. | Sep 2004 | A1 |
20040198069 | Metzner et al. | Oct 2004 | A1 |
20040200499 | Harvey et al. | Oct 2004 | A1 |
20040209477 | Buxbaum et al. | Oct 2004 | A1 |
20040211357 | Gadgil | Oct 2004 | A1 |
20040212947 | Nguyen | Oct 2004 | A1 |
20040214399 | Ahn et al. | Oct 2004 | A1 |
20040219793 | Hishiya et al. | Nov 2004 | A1 |
20040221807 | Verghese et al. | Nov 2004 | A1 |
20040247779 | Selvamanickam et al. | Dec 2004 | A1 |
20040261712 | Hayashi et al. | Dec 2004 | A1 |
20040266011 | Lee et al. | Dec 2004 | A1 |
20050008799 | Tomiyasu et al. | Jan 2005 | A1 |
20050019026 | Wang et al. | Jan 2005 | A1 |
20050020071 | Sonobe et al. | Jan 2005 | A1 |
20050023624 | Ahn et al. | Feb 2005 | A1 |
20050028735 | Yoo | Feb 2005 | A1 |
20050034674 | Ono | Feb 2005 | A1 |
20050037154 | Koh et al. | Feb 2005 | A1 |
20050037610 | Cha | Feb 2005 | A1 |
20050051093 | Makino et al. | Mar 2005 | A1 |
20050054228 | March | Mar 2005 | A1 |
20050059262 | Yin et al. | Mar 2005 | A1 |
20050064207 | Senzaki et al. | Mar 2005 | A1 |
20050064719 | Liu | Mar 2005 | A1 |
20050066893 | Soininen | Mar 2005 | A1 |
20050069651 | Miyoshi | Mar 2005 | A1 |
20050070123 | Hirano | Mar 2005 | A1 |
20050070729 | Kiyomori et al. | Mar 2005 | A1 |
20050072357 | Shero et al. | Apr 2005 | A1 |
20050074983 | Shinriki et al. | Apr 2005 | A1 |
20050082161 | Brucker | Apr 2005 | A1 |
20050092249 | Kilpela et al. | May 2005 | A1 |
20050095770 | Kumagai et al. | May 2005 | A1 |
20050100669 | Kools et al. | May 2005 | A1 |
20050101154 | Huang | May 2005 | A1 |
20050106893 | Wilk | May 2005 | A1 |
20050110069 | Kil et al. | May 2005 | A1 |
20050112282 | Gordon et al. | May 2005 | A1 |
20050120805 | Lane | Jun 2005 | A1 |
20050120962 | Ushioda et al. | Jun 2005 | A1 |
20050123690 | Derderian et al. | Jun 2005 | A1 |
20050133161 | Carpenter et al. | Jun 2005 | A1 |
20050142361 | Nakanishi | Jun 2005 | A1 |
20050145338 | Park et al. | Jul 2005 | A1 |
20050153571 | Senzaki | Jul 2005 | A1 |
20050173003 | Laverdiere et al. | Aug 2005 | A1 |
20050175789 | Helms | Aug 2005 | A1 |
20050181535 | Yun et al. | Aug 2005 | A1 |
20050187647 | Wang et al. | Aug 2005 | A1 |
20050191828 | Al-Bayati et al. | Sep 2005 | A1 |
20050208718 | Lim et al. | Sep 2005 | A1 |
20050212119 | Shero | Sep 2005 | A1 |
20050214457 | Schmitt et al. | Sep 2005 | A1 |
20050214458 | Meiere | Sep 2005 | A1 |
20050218462 | Ahn et al. | Oct 2005 | A1 |
20050221618 | AmRhein et al. | Oct 2005 | A1 |
20050223994 | Blomiley et al. | Oct 2005 | A1 |
20050227502 | Schmitt et al. | Oct 2005 | A1 |
20050229848 | Shinriki | Oct 2005 | A1 |
20050229972 | Hoshi et al. | Oct 2005 | A1 |
20050241176 | Shero et al. | Nov 2005 | A1 |
20050241763 | Huang et al. | Nov 2005 | A1 |
20050251990 | Choi | Nov 2005 | A1 |
20050255257 | Choi et al. | Nov 2005 | A1 |
20050258280 | Goto et al. | Nov 2005 | A1 |
20050260347 | Narwankar et al. | Nov 2005 | A1 |
20050260850 | Loke | Nov 2005 | A1 |
20050263075 | Wang et al. | Dec 2005 | A1 |
20050263932 | Heugel | Dec 2005 | A1 |
20050271813 | Kher et al. | Dec 2005 | A1 |
20050274323 | Seidel et al. | Dec 2005 | A1 |
20050282101 | Adachi | Dec 2005 | A1 |
20050287725 | Kitagawa | Dec 2005 | A1 |
20050287771 | Seamons et al. | Dec 2005 | A1 |
20060013946 | Park et al. | Jan 2006 | A1 |
20060014384 | Lee et al. | Jan 2006 | A1 |
20060014397 | Seamons et al. | Jan 2006 | A1 |
20060016783 | Wu et al. | Jan 2006 | A1 |
20060019033 | Muthukrishnan et al. | Jan 2006 | A1 |
20060019502 | Park et al. | Jan 2006 | A1 |
20060021703 | Umotoy et al. | Feb 2006 | A1 |
20060024439 | Tuominen et al. | Feb 2006 | A2 |
20060046518 | Hill et al. | Mar 2006 | A1 |
20060051520 | Behle et al. | Mar 2006 | A1 |
20060051925 | Ahn et al. | Mar 2006 | A1 |
20060060930 | Metz et al. | Mar 2006 | A1 |
20060062910 | Meiere | Mar 2006 | A1 |
20060068121 | Lee et al. | Mar 2006 | A1 |
20060068125 | Radhakrishnan | Mar 2006 | A1 |
20060087638 | Hirayanagi | Apr 2006 | A1 |
20060063346 | Lee et al. | May 2006 | A1 |
20060105566 | Waldfried et al. | May 2006 | A1 |
20060107898 | Blomberg | May 2006 | A1 |
20060110934 | Fukuchi | May 2006 | A1 |
20060113675 | Chang et al. | Jun 2006 | A1 |
20060113806 | Tsuji et al. | Jun 2006 | A1 |
20060128168 | Ahn et al. | Jun 2006 | A1 |
20060130767 | Herchen | Jun 2006 | A1 |
20060137609 | Puchacz et al. | Jun 2006 | A1 |
20060147626 | Blomberg | Jul 2006 | A1 |
20060148180 | Ahn et al. | Jul 2006 | A1 |
20060163612 | Kouvetakis et al. | Jul 2006 | A1 |
20060172531 | Lin et al. | Aug 2006 | A1 |
20060177855 | Utermohlen | Aug 2006 | A1 |
20060191555 | Yoshida et al. | Aug 2006 | A1 |
20060193979 | Meiere et al. | Aug 2006 | A1 |
20060199357 | Wan et al. | Sep 2006 | A1 |
20060205223 | Smayling | Sep 2006 | A1 |
20060208215 | Metzner et al. | Sep 2006 | A1 |
20060213439 | Ishizaka | Sep 2006 | A1 |
20060223301 | Vanhaelemeersch et al. | Oct 2006 | A1 |
20060226117 | Bertram et al. | Oct 2006 | A1 |
20060228888 | Lee et al. | Oct 2006 | A1 |
20060236934 | Choi et al. | Oct 2006 | A1 |
20060240574 | Yoshie | Oct 2006 | A1 |
20060240662 | Conley et al. | Oct 2006 | A1 |
20060251827 | Nowak | Nov 2006 | A1 |
20060257563 | Doh et al. | Nov 2006 | A1 |
20060257584 | Derderian et al. | Nov 2006 | A1 |
20060258078 | Lee et al. | Nov 2006 | A1 |
20060258173 | Xiao et al. | Nov 2006 | A1 |
20060260545 | Ramaswamy et al. | Nov 2006 | A1 |
20060263522 | Byun | Nov 2006 | A1 |
20060264060 | Ramaswamy et al. | Nov 2006 | A1 |
20060264066 | Bartholomew | Nov 2006 | A1 |
20060266289 | Verghese et al. | Nov 2006 | A1 |
20060269692 | Balseanu | Nov 2006 | A1 |
20060278524 | Stowell | Dec 2006 | A1 |
20060286818 | Wang et al. | Dec 2006 | A1 |
20060291982 | Tanaka | Dec 2006 | A1 |
20070006806 | Imai | Jan 2007 | A1 |
20070010072 | Bailey et al. | Jan 2007 | A1 |
20070020953 | Tsai et al. | Jan 2007 | A1 |
20070022954 | Iizuka et al. | Feb 2007 | A1 |
20070026651 | Learn et al. | Feb 2007 | A1 |
20070028842 | Inagawa et al. | Feb 2007 | A1 |
20070031598 | Okuyama et al. | Feb 2007 | A1 |
20070031599 | Gschwandtner et al. | Feb 2007 | A1 |
20070032082 | Ramaswamy et al. | Feb 2007 | A1 |
20070037412 | Dip et al. | Feb 2007 | A1 |
20070042117 | Kupurao et al. | Feb 2007 | A1 |
20070049053 | Mahajani | Mar 2007 | A1 |
20070054499 | Jang | Mar 2007 | A1 |
20070059948 | Metzner et al. | Mar 2007 | A1 |
20070062453 | Ishikawa | Mar 2007 | A1 |
20070065578 | McDougall | Mar 2007 | A1 |
20070066010 | Ando | Mar 2007 | A1 |
20070066079 | Kolster et al. | Mar 2007 | A1 |
20070054405 | Kim | Apr 2007 | A1 |
20070077355 | Chacin et al. | Apr 2007 | A1 |
20070082132 | Shinriki | Apr 2007 | A1 |
20070096194 | Streck et al. | May 2007 | A1 |
20070098527 | Hall et al. | May 2007 | A1 |
20070107845 | Ishizawa et al. | May 2007 | A1 |
20070111545 | Lee et al. | May 2007 | A1 |
20070116873 | Li et al. | May 2007 | A1 |
20070123037 | Lee et al. | May 2007 | A1 |
20070125762 | Cui et al. | Jun 2007 | A1 |
20070128538 | Fairbairn et al. | Jun 2007 | A1 |
20070128876 | Fukiage | Jun 2007 | A1 |
20070134942 | Ahn et al. | Jun 2007 | A1 |
20070146621 | Yeom | Jun 2007 | A1 |
20070148990 | Deboer et al. | Jun 2007 | A1 |
20070155138 | Tomasini et al. | Jul 2007 | A1 |
20070158026 | Amikura | Jul 2007 | A1 |
20070163440 | Kim et al. | Jul 2007 | A1 |
20070166457 | Yamoto et al. | Jul 2007 | A1 |
20070166966 | Todd et al. | Jul 2007 | A1 |
20070166999 | Vaarstra | Jul 2007 | A1 |
20070173071 | Afzali-Ardakani et al. | Jul 2007 | A1 |
20070175393 | Nishimura et al. | Aug 2007 | A1 |
20070175397 | Tomiyasu et al. | Aug 2007 | A1 |
20070186952 | Honda et al. | Aug 2007 | A1 |
20070207275 | Nowak et al. | Sep 2007 | A1 |
20070209590 | Li | Sep 2007 | A1 |
20070210890 | Hsu et al. | Sep 2007 | A1 |
20070215048 | Suzuki et al. | Sep 2007 | A1 |
20070218200 | Suzuki et al. | Sep 2007 | A1 |
20070218705 | Matsuki et al. | Sep 2007 | A1 |
20070224777 | Hamelin | Sep 2007 | A1 |
20070224833 | Morisada et al. | Sep 2007 | A1 |
20070232031 | Singh et al. | Oct 2007 | A1 |
20070232071 | Balseanu et al. | Oct 2007 | A1 |
20070232501 | Tonomura | Oct 2007 | A1 |
20070234955 | Suzuki et al. | Oct 2007 | A1 |
20070237697 | Clark | Oct 2007 | A1 |
20070237699 | Clark | Oct 2007 | A1 |
20070241688 | DeVancentis et al. | Oct 2007 | A1 |
20070248767 | Okura | Oct 2007 | A1 |
20070249131 | Allen et al. | Oct 2007 | A1 |
20070252532 | DeVancentis et al. | Oct 2007 | A1 |
20070251444 | Gros-Jean et al. | Nov 2007 | A1 |
20070252244 | Srividya et al. | Nov 2007 | A1 |
20070264807 | Leone et al. | Nov 2007 | A1 |
20070275166 | Thridandam et al. | Nov 2007 | A1 |
20070277735 | Mokhesi et al. | Dec 2007 | A1 |
20070281496 | Ingle et al. | Dec 2007 | A1 |
20070298362 | Rocha-Alvarez et al. | Dec 2007 | A1 |
20080003824 | Padhi et al. | Jan 2008 | A1 |
20080003838 | Haukka et al. | Jan 2008 | A1 |
20080006208 | Ueno et al. | Jan 2008 | A1 |
20080018004 | Steidl | Jan 2008 | A1 |
20080023436 | Gros-Jean et al. | Jan 2008 | A1 |
20080026574 | Brcka | Jan 2008 | A1 |
20080026597 | Munro et al. | Jan 2008 | A1 |
20080029790 | Ahn et al. | Feb 2008 | A1 |
20080036354 | Letz et al. | Feb 2008 | A1 |
20080038485 | Lukas | Feb 2008 | A1 |
20080054332 | Kim et al. | Mar 2008 | A1 |
20080054813 | Espiau et al. | Mar 2008 | A1 |
20080057659 | Forbes et al. | Mar 2008 | A1 |
20080061667 | Gaertner et al. | Mar 2008 | A1 |
20080066778 | Matsushita et al. | Mar 2008 | A1 |
20080069955 | Hong et al. | Mar 2008 | A1 |
20080075881 | Won et al. | Mar 2008 | A1 |
20080076266 | Fukazawa et al. | Mar 2008 | A1 |
20080081104 | Hasebe et al. | Apr 2008 | A1 |
20080081113 | Clark | Apr 2008 | A1 |
20080081121 | Morita et al. | Apr 2008 | A1 |
20080085226 | Fondurulia et al. | Apr 2008 | A1 |
20080092815 | Chen et al. | Apr 2008 | A1 |
20080102203 | Wu | May 2008 | A1 |
20080113094 | Casper | May 2008 | A1 |
20080113096 | Mahajani | May 2008 | A1 |
20080113097 | Mahajani et al. | May 2008 | A1 |
20080124197 | van der Meulen et al. | May 2008 | A1 |
20080124908 | Forbes et al. | May 2008 | A1 |
20080133154 | Krauss et al. | Jun 2008 | A1 |
20080142483 | Hua | Jun 2008 | A1 |
20080149031 | Chu et al. | Jun 2008 | A1 |
20080152463 | Chidambaram et al. | Jun 2008 | A1 |
20080153311 | Padhi et al. | Jun 2008 | A1 |
20080173240 | Furukawahara | Jul 2008 | A1 |
20080173326 | Gu et al. | Jul 2008 | A1 |
20080176375 | Erben et al. | Jul 2008 | A1 |
20080179104 | Zhang | Jul 2008 | A1 |
20080182075 | Chopra | Jul 2008 | A1 |
20080182390 | Lemmi et al. | Jul 2008 | A1 |
20080191193 | Li et al. | Aug 2008 | A1 |
20080199977 | Weigel et al. | Aug 2008 | A1 |
20080202416 | Provencher | Aug 2008 | A1 |
20080203487 | Hohage et al. | Aug 2008 | A1 |
20080211423 | Shinmen et al. | Sep 2008 | A1 |
20080211526 | Shinma | Sep 2008 | A1 |
20080216077 | Emani et al. | Sep 2008 | A1 |
20080224240 | Ahn et al. | Sep 2008 | A1 |
20080233288 | Clark | Sep 2008 | A1 |
20080237572 | Chui et al. | Oct 2008 | A1 |
20080241384 | Jeong | Oct 2008 | A1 |
20080242097 | Boescke et al. | Oct 2008 | A1 |
20080242116 | Clark | Oct 2008 | A1 |
20080248310 | Kim et al. | Oct 2008 | A1 |
20080257494 | Hayashi et al. | Oct 2008 | A1 |
20080261413 | Mahajani | Oct 2008 | A1 |
20080264337 | Sano et al. | Oct 2008 | A1 |
20080267598 | Nakamura | Oct 2008 | A1 |
20080277715 | Ohmi et al. | Nov 2008 | A1 |
20080282970 | Heys et al. | Nov 2008 | A1 |
20080295872 | Riker et al. | Dec 2008 | A1 |
20080298945 | Cox | Dec 2008 | A1 |
20080299326 | Fukazawa | Dec 2008 | A1 |
20080302303 | Choi et al. | Dec 2008 | A1 |
20080305246 | Choi et al. | Dec 2008 | A1 |
20080305443 | Nakamura | Dec 2008 | A1 |
20080315292 | Ji et al. | Dec 2008 | A1 |
20080317972 | Hendriks | Dec 2008 | A1 |
20090000550 | Tran et al. | Jan 2009 | A1 |
20090000551 | Choi et al. | Jan 2009 | A1 |
20090011608 | Nabatame | Jan 2009 | A1 |
20090020072 | Mizunaga et al. | Jan 2009 | A1 |
20090023229 | Matsushita | Jan 2009 | A1 |
20090029503 | Arai | Jan 2009 | A1 |
20090029528 | Sanchez et al. | Jan 2009 | A1 |
20090029564 | Yamashita et al. | Jan 2009 | A1 |
20090033907 | Watson | Feb 2009 | A1 |
20090035947 | Horii | Feb 2009 | A1 |
20090041952 | Yoon et al. | Feb 2009 | A1 |
20090041984 | Mayers et al. | Feb 2009 | A1 |
20090042344 | Ye et al. | Feb 2009 | A1 |
20090045829 | Awazu | Feb 2009 | A1 |
20090050621 | Awazu | Feb 2009 | A1 |
20090061644 | Chiang et al. | Mar 2009 | A1 |
20090061647 | Mallick et al. | Mar 2009 | A1 |
20090085156 | Dewey et al. | Apr 2009 | A1 |
20090090382 | Morisada | Apr 2009 | A1 |
20090093094 | Ye et al. | Apr 2009 | A1 |
20090095221 | Tam et al. | Apr 2009 | A1 |
20090107404 | Ogliari et al. | Apr 2009 | A1 |
20090122293 | Shibazaki | May 2009 | A1 |
20090130331 | Asai | May 2009 | A1 |
20090136668 | Gregg et al. | May 2009 | A1 |
20090136683 | Fukasawa et al. | May 2009 | A1 |
20090139657 | Lee et al. | Jun 2009 | A1 |
20090142935 | Fukazawa et al. | Jun 2009 | A1 |
20090146322 | Weling et al. | Jun 2009 | A1 |
20090156015 | Park et al. | Jun 2009 | A1 |
20090206056 | Xu | Aug 2009 | A1 |
20090209081 | Matero | Aug 2009 | A1 |
20090211523 | Kuppurao et al. | Aug 2009 | A1 |
20090211525 | Sarigiannis et al. | Aug 2009 | A1 |
20090236014 | Wilson | Sep 2009 | A1 |
20090239386 | Suzaki et al. | Sep 2009 | A1 |
20090242957 | Ma et al. | Oct 2009 | A1 |
20090246374 | Vukovic | Oct 2009 | A1 |
20090246399 | Goundar | Oct 2009 | A1 |
20090250955 | Aoki | Oct 2009 | A1 |
20090261331 | Yang et al. | Oct 2009 | A1 |
20090269506 | Okura et al. | Oct 2009 | A1 |
20090269941 | Raisanen | Oct 2009 | A1 |
20090275205 | Kiehlbauch et al. | Nov 2009 | A1 |
20090277510 | Shikata | Nov 2009 | A1 |
20090283041 | Tomiyasu et al. | Nov 2009 | A1 |
20090283217 | Lubomirsky et al. | Nov 2009 | A1 |
20090286400 | Heo et al. | Nov 2009 | A1 |
20090286402 | Xia et al. | Nov 2009 | A1 |
20090289300 | Sasaki et al. | Nov 2009 | A1 |
20090304558 | Patton | Dec 2009 | A1 |
20090311857 | Todd et al. | Dec 2009 | A1 |
20100001409 | Humbert et al. | Jan 2010 | A1 |
20100006031 | Choi et al. | Jan 2010 | A1 |
20100014479 | Kim | Jan 2010 | A1 |
20100015813 | McGinnis et al. | Jan 2010 | A1 |
20100024727 | Kim et al. | Feb 2010 | A1 |
20100025796 | Dabiran | Feb 2010 | A1 |
20100041179 | Lee | Feb 2010 | A1 |
20100041243 | Cheng et al. | Feb 2010 | A1 |
20100055312 | Kato et al. | Mar 2010 | A1 |
20100055442 | Kellock | Mar 2010 | A1 |
20100075507 | Chang et al. | Mar 2010 | A1 |
20100089320 | Kim | Apr 2010 | A1 |
20100090149 | Thompson et al. | Apr 2010 | A1 |
20100092696 | Shinriki | Apr 2010 | A1 |
20100093187 | Lee et al. | Apr 2010 | A1 |
20100102417 | Ganguli et al. | Apr 2010 | A1 |
20100116209 | Kato | May 2010 | A1 |
20100124610 | Aikawa et al. | May 2010 | A1 |
20100124618 | Kobayashi et al. | May 2010 | A1 |
20100124621 | Kobayashi et al. | May 2010 | A1 |
20100126605 | Stones | May 2010 | A1 |
20100130017 | Luo et al. | May 2010 | A1 |
20100134023 | Mills | Jun 2010 | A1 |
20100136216 | Tsuei et al. | Jun 2010 | A1 |
20100140221 | Kikuchi et al. | Jun 2010 | A1 |
20100144162 | Lee et al. | Jun 2010 | A1 |
20100151206 | Wu et al. | Jun 2010 | A1 |
20100159638 | Jeong | Jun 2010 | A1 |
20100162752 | Tabata et al. | Jul 2010 | A1 |
20100170441 | Won et al. | Jul 2010 | A1 |
20100178137 | Chintalapati et al. | Jul 2010 | A1 |
20100178423 | Shimizu et al. | Jul 2010 | A1 |
20100184302 | Lee et al. | Jul 2010 | A1 |
20100193501 | Zucker et al. | Aug 2010 | A1 |
20100195392 | Freeman | Aug 2010 | A1 |
20100221452 | Kang | Sep 2010 | A1 |
20100230051 | Iizuka | Sep 2010 | A1 |
20100233886 | Yang et al. | Sep 2010 | A1 |
20100243166 | Hayashi et al. | Sep 2010 | A1 |
20100244688 | Braun et al. | Sep 2010 | A1 |
20100255198 | Cleary et al. | Oct 2010 | A1 |
20100255625 | De Vries | Oct 2010 | A1 |
20100255658 | Aggarwal | Oct 2010 | A1 |
20100259152 | Yasuda et al. | Oct 2010 | A1 |
20100270675 | Harada | Oct 2010 | A1 |
20100275846 | Kitagawa | Nov 2010 | A1 |
20100282645 | Wang | Nov 2010 | A1 |
20100285319 | Kwak et al. | Nov 2010 | A1 |
20100294199 | Tran et al. | Nov 2010 | A1 |
20100301752 | Bakre et al. | Dec 2010 | A1 |
20100304047 | Yang et al. | Dec 2010 | A1 |
20100307415 | Shero et al. | Dec 2010 | A1 |
20100317198 | Antonelli | Dec 2010 | A1 |
20100322604 | Fondurulia et al. | Dec 2010 | A1 |
20110000619 | Suh | Jan 2011 | A1 |
20110006402 | Zhou | Jan 2011 | A1 |
20110006406 | Urbanowicz et al. | Jan 2011 | A1 |
20110014795 | Lee | Jan 2011 | A1 |
20110027999 | Sparks et al. | Feb 2011 | A1 |
20110034039 | Liang et al. | Feb 2011 | A1 |
20110048642 | Mihara et al. | Mar 2011 | A1 |
20110052833 | Hanawa et al. | Mar 2011 | A1 |
20110056513 | Hombach et al. | Mar 2011 | A1 |
20110056626 | Brown et al. | Mar 2011 | A1 |
20110061810 | Ganguly et al. | Mar 2011 | A1 |
20110070380 | Shero et al. | Mar 2011 | A1 |
20110081519 | Dillingh | Apr 2011 | A1 |
20110086516 | Lee et al. | Apr 2011 | A1 |
20110089469 | Merckling | Apr 2011 | A1 |
20110097901 | Banna et al. | Apr 2011 | A1 |
20110107512 | Gilbert | May 2011 | A1 |
20110108194 | Yoshioka et al. | May 2011 | A1 |
20110108741 | Ingram | May 2011 | A1 |
20110108929 | Meng | May 2011 | A1 |
20110117490 | Bae et al. | May 2011 | A1 |
20110117737 | Agarwala et al. | May 2011 | A1 |
20110117749 | Sheu | May 2011 | A1 |
20110124196 | Lee | May 2011 | A1 |
20110139748 | Donnelly et al. | Jun 2011 | A1 |
20110143032 | Vrtis et al. | Jun 2011 | A1 |
20110143461 | Fish et al. | Jun 2011 | A1 |
20110159202 | Matsushita | Jun 2011 | A1 |
20110159673 | Hanawa et al. | Jun 2011 | A1 |
20110175011 | Ehrne et al. | Jul 2011 | A1 |
20110183079 | Jackson et al. | Jul 2011 | A1 |
20110183269 | Zhu | Jul 2011 | A1 |
20110183527 | Cho | Jul 2011 | A1 |
20110192820 | Yeom et al. | Aug 2011 | A1 |
20110198736 | Shero et al. | Aug 2011 | A1 |
20110210468 | Shannon et al. | Sep 2011 | A1 |
20110220874 | Hanrath | Sep 2011 | A1 |
20110236600 | Fox et al. | Sep 2011 | A1 |
20110239936 | Suzaki et al. | Oct 2011 | A1 |
20110254052 | Kouvetakis | Oct 2011 | A1 |
20110256675 | Avouris | Oct 2011 | A1 |
20110256726 | LaVoie | Oct 2011 | A1 |
20110256727 | Beynet et al. | Oct 2011 | A1 |
20110256734 | Hausmann et al. | Oct 2011 | A1 |
20110265549 | Cruse et al. | Nov 2011 | A1 |
20110265715 | Keller | Nov 2011 | A1 |
20110265725 | Tsuji | Nov 2011 | A1 |
20110265951 | Xu et al. | Nov 2011 | A1 |
20110275166 | Shero et al. | Nov 2011 | A1 |
20110281417 | Gordon et al. | Nov 2011 | A1 |
20110283933 | Makarov et al. | Nov 2011 | A1 |
20110294075 | Chen et al. | Dec 2011 | A1 |
20110308460 | Hong et al. | Dec 2011 | A1 |
20120003500 | Yoshida et al. | Jan 2012 | A1 |
20120006489 | Okita | Jan 2012 | A1 |
20120024479 | Palagashvili et al. | Feb 2012 | A1 |
20120032311 | Gates | Feb 2012 | A1 |
20120043556 | Dube et al. | Feb 2012 | A1 |
20120052681 | Marsh | Mar 2012 | A1 |
20120070136 | Koelmel et al. | Mar 2012 | A1 |
20120070997 | Larson | Mar 2012 | A1 |
20120090704 | Laverdiere et al. | Apr 2012 | A1 |
20120098107 | Raisanen et al. | Apr 2012 | A1 |
20120100464 | Kageyama | Apr 2012 | A1 |
20120103264 | Choi et al. | May 2012 | A1 |
20120103939 | Wu et al. | May 2012 | A1 |
20120107607 | Takaki et al. | May 2012 | A1 |
20120114877 | Lee | May 2012 | A1 |
20120121823 | Chhabra | May 2012 | A1 |
20120128897 | Xiao et al. | May 2012 | A1 |
20120135145 | Je et al. | May 2012 | A1 |
20120156108 | Fondurulia et al. | Jun 2012 | A1 |
20120160172 | Wamura et al. | Jun 2012 | A1 |
20120164327 | Sato | Jun 2012 | A1 |
20120164837 | Tan et al. | Jun 2012 | A1 |
20120164842 | Watanabe | Jun 2012 | A1 |
20120171391 | Won | Jul 2012 | A1 |
20120171874 | Thridandam et al. | Jul 2012 | A1 |
20120207456 | Kim et al. | Aug 2012 | A1 |
20120212121 | Lin | Aug 2012 | A1 |
20120214318 | Fukazawa et al. | Aug 2012 | A1 |
20120220139 | Lee et al. | Aug 2012 | A1 |
20120225561 | Watanabe | Sep 2012 | A1 |
20120240858 | Taniyama et al. | Sep 2012 | A1 |
20120263876 | Haukka et al. | Oct 2012 | A1 |
20120270339 | Xie et al. | Oct 2012 | A1 |
20120270393 | Pore et al. | Oct 2012 | A1 |
20120289053 | Holland et al. | Nov 2012 | A1 |
20120295427 | Bauer | Nov 2012 | A1 |
20120304935 | Oosterlaken et al. | Dec 2012 | A1 |
20120305196 | Mori et al. | Dec 2012 | A1 |
20120315113 | Hiroki | Dec 2012 | A1 |
20120318334 | Bedell et al. | Dec 2012 | A1 |
20120321786 | Satitpunwaycha et al. | Dec 2012 | A1 |
20120322252 | Son et al. | Dec 2012 | A1 |
20120325148 | Yamagishi et al. | Dec 2012 | A1 |
20120328780 | Yamagishi et al. | Dec 2012 | A1 |
20130005122 | Schwarzenbach et al. | Jan 2013 | A1 |
20130011983 | Tsai | Jan 2013 | A1 |
20130014697 | Kanayama | Jan 2013 | A1 |
20130014896 | Shoji et al. | Jan 2013 | A1 |
20130019944 | Hekmatshoar-Tabai et al. | Jan 2013 | A1 |
20130019945 | Hekmatshoar-Tabai et al. | Jan 2013 | A1 |
20130023129 | Reed | Jan 2013 | A1 |
20130048606 | Mao et al. | Feb 2013 | A1 |
20130064973 | Chen et al. | Mar 2013 | A1 |
20130068727 | Okita | Mar 2013 | A1 |
20130068970 | Matsushita | Mar 2013 | A1 |
20130078392 | Xiao et al. | Mar 2013 | A1 |
20130081702 | Mohammed et al. | Apr 2013 | A1 |
20130084714 | Oka et al. | Apr 2013 | A1 |
20130104988 | Yednak et al. | May 2013 | A1 |
20130104992 | Yednak et al. | May 2013 | A1 |
20130105796 | Liu et al. | May 2013 | A1 |
20130115383 | Lu et al. | May 2013 | A1 |
20130115763 | Takamure et al. | May 2013 | A1 |
20130122712 | Kim et al. | May 2013 | A1 |
20130126515 | Shero et al. | May 2013 | A1 |
20130129577 | Halpin et al. | May 2013 | A1 |
20130134148 | Tachikawa | May 2013 | A1 |
20130160709 | White | Jun 2013 | A1 |
20130168354 | Kanarik | Jul 2013 | A1 |
20130180448 | Sakaue et al. | Jul 2013 | A1 |
20130183814 | Huang et al. | Jul 2013 | A1 |
20130203266 | Hintze | Aug 2013 | A1 |
20130210241 | Lavoie et al. | Aug 2013 | A1 |
20130217239 | Mallick et al. | Aug 2013 | A1 |
20130217240 | Mallick et al. | Aug 2013 | A1 |
20130217241 | Underwood et al. | Aug 2013 | A1 |
20130217243 | Underwood et al. | Aug 2013 | A1 |
20130224964 | Fukazawa | Aug 2013 | A1 |
20130230814 | Dunn et al. | Sep 2013 | A1 |
20130256838 | Sanchez et al. | Oct 2013 | A1 |
20130264659 | Jung | Oct 2013 | A1 |
20130269612 | Cheng et al. | Oct 2013 | A1 |
20130285155 | Glass | Oct 2013 | A1 |
20130288480 | Sanchez et al. | Oct 2013 | A1 |
20130292047 | Tian et al. | Nov 2013 | A1 |
20130292676 | Milligan et al. | Nov 2013 | A1 |
20130292807 | Raisanen et al. | Nov 2013 | A1 |
20130313656 | Tong | Nov 2013 | A1 |
20130319290 | Xiao et al. | Dec 2013 | A1 |
20130323435 | Xiao et al. | Dec 2013 | A1 |
20130330165 | Wimplinger | Dec 2013 | A1 |
20130330911 | Huang et al. | Dec 2013 | A1 |
20130330933 | Fukazawa et al. | Dec 2013 | A1 |
20130337583 | Kobayashi et al. | Dec 2013 | A1 |
20130340619 | Tammera | Dec 2013 | A1 |
20130344248 | Clark | Dec 2013 | A1 |
20140000843 | Dunn et al. | Jan 2014 | A1 |
20140001520 | Glass | Jan 2014 | A1 |
20140014642 | Elliot et al. | Jan 2014 | A1 |
20140014644 | Akiba et al. | Jan 2014 | A1 |
20140020619 | Vincent et al. | Jan 2014 | A1 |
20140027884 | Tang et al. | Jan 2014 | A1 |
20140036274 | Marquardt et al. | Feb 2014 | A1 |
20140048765 | Ma et al. | Feb 2014 | A1 |
20140056679 | Yamabe et al. | Feb 2014 | A1 |
20140057454 | Subramonium | Feb 2014 | A1 |
20140060147 | Sarin et al. | Mar 2014 | A1 |
20140062304 | Nakano et al. | Mar 2014 | A1 |
20140067110 | Lawson et al. | Mar 2014 | A1 |
20140073143 | Alokozai et al. | Mar 2014 | A1 |
20140077240 | Roucka et al. | Mar 2014 | A1 |
20140084341 | Weeks | Mar 2014 | A1 |
20140087544 | Tolle | Mar 2014 | A1 |
20140094027 | Azumo et al. | Apr 2014 | A1 |
20140096716 | Chung et al. | Apr 2014 | A1 |
20140099798 | Tsuji | Apr 2014 | A1 |
20140103145 | White et al. | Apr 2014 | A1 |
20140110798 | Cai | Apr 2014 | A1 |
20140116335 | Tsuji et al. | May 2014 | A1 |
20140120487 | Kaneko | May 2014 | A1 |
20140127907 | Yang | May 2014 | A1 |
20140141625 | Fuzazawa et al. | May 2014 | A1 |
20140159170 | Raisanen et al. | Jun 2014 | A1 |
20140174354 | Arai | Jun 2014 | A1 |
20140175054 | Carlson et al. | Jun 2014 | A1 |
20140179085 | Hirose et al. | Jun 2014 | A1 |
20140182053 | Huang | Jul 2014 | A1 |
20140217065 | Winkler et al. | Aug 2014 | A1 |
20140220247 | Haukka et al. | Aug 2014 | A1 |
20140225065 | Rachmady et al. | Aug 2014 | A1 |
20140227072 | Lee et al. | Aug 2014 | A1 |
20140251953 | Winkler et al. | Sep 2014 | A1 |
20140251954 | Winkler et al. | Sep 2014 | A1 |
20140256156 | Harada et al. | Sep 2014 | A1 |
20140283747 | Kasai et al. | Sep 2014 | A1 |
20140346650 | Raisanen et al. | Nov 2014 | A1 |
20140349033 | Nonaka et al. | Nov 2014 | A1 |
20140363980 | Kawamata et al. | Dec 2014 | A1 |
20140363985 | Jang et al. | Dec 2014 | A1 |
20140367043 | Bishara et al. | Dec 2014 | A1 |
20150004316 | Thompson et al. | Jan 2015 | A1 |
20150004317 | Dussarrat et al. | Jan 2015 | A1 |
20150007770 | Chandrasekharan et al. | Jan 2015 | A1 |
20150014632 | Kim et al. | Jan 2015 | A1 |
20150021599 | Ridgeway | Jan 2015 | A1 |
20150024609 | Milligan et al. | Jan 2015 | A1 |
20150048485 | Tolle | Feb 2015 | A1 |
20150078874 | Sansoni | Mar 2015 | A1 |
20150086316 | Greenberg | Mar 2015 | A1 |
20150091057 | Xie et al. | Apr 2015 | A1 |
20150096973 | Dunn et al. | Apr 2015 | A1 |
20150099072 | Takamure et al. | Apr 2015 | A1 |
20150111374 | Bao | Apr 2015 | A1 |
20150132212 | Winkler et al. | May 2015 | A1 |
20150140210 | Jung et al. | May 2015 | A1 |
20150147483 | Fukazawa | May 2015 | A1 |
20150147877 | Jung | May 2015 | A1 |
20150162214 | Thompson | Jun 2015 | A1 |
20150167159 | Halpin et al. | Jun 2015 | A1 |
20150170954 | Agarwal | Jun 2015 | A1 |
20150174768 | Rodnick | Jun 2015 | A1 |
20150179427 | Hirose et al. | Jun 2015 | A1 |
20150184291 | Alokozai et al. | Jul 2015 | A1 |
20150187568 | Pettinger et al. | Jul 2015 | A1 |
20150217456 | Tsuji et al. | Aug 2015 | A1 |
20150240359 | Jdira et al. | Aug 2015 | A1 |
20150255324 | Li et al. | Sep 2015 | A1 |
20150267295 | Hill et al. | Sep 2015 | A1 |
20150267297 | Shiba | Sep 2015 | A1 |
20150267299 | Hawkins | Sep 2015 | A1 |
20150267301 | Hill et al. | Sep 2015 | A1 |
20150284848 | Nakano et al. | Oct 2015 | A1 |
20150287626 | Arai | Oct 2015 | A1 |
20150308586 | Shugrue et al. | Oct 2015 | A1 |
20150315704 | Nakano et al. | Nov 2015 | A1 |
20150376211 | Girard | Dec 2015 | A1 |
20160013042 | Hashimoto et al. | Jan 2016 | A1 |
20160020094 | Van Aerde et al. | Jan 2016 | A1 |
20160093528 | Chandrashekar et al. | Mar 2016 | A1 |
20160141176 | Van Aerde et al. | May 2016 | A1 |
Number | Date | Country |
---|---|---|
1563483 | Jan 2005 | CN |
101330015 | Dec 2008 | CN |
101522943 | Sep 2009 | CN |
101423937 | Sep 2011 | CN |
102383106 | Mar 2012 | CN |
102008052750 | Jun 2009 | DE |
2036600 | Mar 2009 | EP |
2426233 | Jul 2012 | EP |
03-044472 | Feb 1991 | JP |
04115531 | Apr 1992 | JP |
07-034936 | Aug 1995 | JP |
7-272694 | Oct 1995 | JP |
H07283149 | Oct 1995 | JP |
08-181135 | Jul 1996 | JP |
H08335558 | Dec 1996 | JP |
10-064696 | Mar 1998 | JP |
10-0261620 | Sep 1998 | JP |
2845163 | Jan 1999 | JP |
2001-15698 | Jan 2001 | JP |
2001342570 | Dec 2001 | JP |
2004014952 | Jan 2004 | JP |
2004091848 | Mar 2004 | JP |
2004134553 | Apr 2004 | JP |
2004294638 | Oct 2004 | JP |
2004310019 | Nov 2004 | JP |
2004538374 | Dec 2004 | JP |
2005507030 | Mar 2005 | JP |
2006186271 | Jul 2006 | JP |
3140111 | Mar 2008 | JP |
2008060304 | Mar 2008 | JP |
2008527748 | Jul 2008 | JP |
2008202107 | Sep 2008 | JP |
2009016815 | Jan 2009 | JP |
2009099938 | May 2009 | JP |
2010097834 | Apr 2010 | JP |
2010205967 | Sep 2010 | JP |
2010251444 | Oct 2010 | JP |
2012089837 | May 2012 | JP |
2012146939 | Aug 2012 | JP |
20100032812 | Mar 2010 | KR |
I226380 | Jan 2005 | TW |
200701301 | Jan 2007 | TW |
1998032893 | Jul 1998 | WO |
2004008827 | Jan 2004 | WO |
2004010467 | Jan 2004 | WO |
2006054854 | May 2006 | WO |
2006056091 | Jun 2006 | WO |
2006078666 | Jul 2006 | WO |
2006080782 | Aug 2006 | WO |
2006101857 | Sep 2006 | WO |
2007140376 | Dec 2007 | WO |
2009154889 | Dec 2009 | WO |
2010039363 | Apr 2010 | WO |
2010118051 | Jan 2011 | WO |
2011019950 | Feb 2011 | WO |
2013078065 | May 2013 | WO |
2013078066 | May 2013 | WO |
2014107290 | Jul 2014 | WO |
Entry |
---|
USPTO; Non-Final Office Action dated Apr. 1, 2010 in U.S. Appl. No. 12/357,174. |
USPTO; Final Office Action dated Sep. 1, 2010 in U.S. Appl. No. 12/357,174. |
USPTO; Notice of Allowance dated Dec. 13, 2010 in U.S. Appl. No. 12/357,174. |
USPTO; Non-Final Office Action dated Dec. 29, 2010 in U.S. Appl. No. 12/362,023. |
USPTO; Non-Final Office Action dated Jul. 26, 2011 in U.S. Appl. No. 12/416,809. |
USPTO; Final Office Action dated Dec. 6, 2011 in U.S. Appl. No. 12/416,809. |
USPTO; Notice of Allowance dated Oct. 1, 2010 in U.S. Appl. No. 12/467,017. |
USPTO; Non-Final Office Action dated Mar. 18, 2010 in U.S. Appl. No. 12/489,252. |
USPTO; Notice of Allowance dated Sep. 2, 2010 in U.S. Appl. No. 12/489,252. |
USPTO; Non-Final Office Action dated Dec. 15, 2010 in U.S. Appl. No. 12/553,759. |
USPTO; Final Office Action dated May 4, 2011 in U.S. Appl. No. 12/553,759. |
USPTO; Non-Final Office Action dated Sep. 6, 2011 in U.S. Appl. No. 12/553,759. |
USPTO; Notice of Allowance dated Jan. 24, 2012 in U.S. Appl. No. 12/553,759. |
USPTO; Non-Final Office Action dated Oct. 19, 2012 in U.S. Appl. No. 12/618,355. |
USPTO; Final Office Action dated May 8, 2013 in U.S. Appl. No. 12/618,355. |
USPTO; Non-Final Office Action dated Apr. 8, 2015 in U.S. Appl. No. 12/618,355. |
USPTO; Final Office Action dated Oct. 22, 2015 in U.S. Appl. No. 12/618,355. |
USPTO; Non-Final Office Action dated Feb. 16, 2012 in U.S. Appl. No. 12/618,419. |
USPTO; Final Office Action dated Jun. 22, 2012 in U.S. Appl. No. 12/618,419. |
USPTO; Non-Final Office Action dated Nov. 27, 2012 in U.S. Appl. No. 12/618,419. |
USPTO; Notice of Allowance dated Apr. 12, 2013 in U.S. Appl. No. 12/618,419. |
USPTO; Non-Final Office Action dated Dec. 6, 2011 in U.S. Appl. No. 12/718,731. |
USPTO; Notice of Allowance dated Mar. 16, 2012 in U.S. Appl. No. 12/718,731. |
USPTO; Final Office Action dated Aug. 12, 2015 in U.S. Appl. No. 12/754,223. |
USPTO; Non-Final Office Action dated Jan. 24, 2011 in U.S. Appl. No. 12/778,808. |
USPTO; Notice of Allowance dated May 9, 2011 in U.S. Appl. No. 12/778,808. |
USPTO; Notice of Allowance dated Oct. 12, 2012 in U.S. Appl. No. 12/832,739. |
USPTO; Non-Final Office Action dated Oct. 16, 2012 in U.S. Appl. No. 12/847,848. |
USPTO; Final Office Action dated Apr. 22, 2013 in U.S. Appl. No. 12/847,848. |
USPTO; Notice of Allowance dated Jan. 16, 2014 in U.S. Appl. No. 12/847,848. |
USPTO; Non-Final Office Action dated Jul. 11, 2012 in U.S. Appl. No. 12/875,889. |
USPTO; Notice of Allowance dated Jan. 4, 2013 in U.S. Appl. No. 12/875,889. |
USPTO; Notice of Allowance dated Jan. 9, 2012 in U.S. Appl. No. 12/901,323. |
USPTO; Non-Final Office Action dated Nov. 20, 2013 in U.S. Appl. No. 12/910,607. |
USPTO; Final Office Action dated Apr. 28, 2014 in U.S. Appl. No. 12/910,607. |
USPTO; Notice of Allowance dated Aug. 15, 2014 in U.S. Appl. No. 12/910,607. |
USPTO; Non-Final Office Action dated Oct. 24, 2012 in U.S. Appl. No. 12/940,906. |
USPTO; Final Office Action dated Feb. 13, 2013 in U.S. Appl. No. 12/940,906. |
USPTO; Notice of Allowance dated Apr. 23, 2013 in U.S. Appl. No. 12/940,906. |
USPTO; Non-Final Office Action dated Dec. 7, 2012 in U.S. Appl. No. 12/953,870. |
USPTO; Final Office Action dated Apr. 22, 2013 in U.S. Appl. No. 12/953,870. |
USPTO; Non-Final Office Action dated Sep. 19, 2012 in U.S. Appl. No. 13/016,735. |
USPTO; Final Office Action dated Feb. 11, 2013 in U.S. Appl. No. 13/016,735. |
USPTO; Notice of Allowance dated Apr. 24, 2013 in U.S. Appl. No. 13/016,735. |
USPTO; Non-Final Office Action dated Apr. 4, 2012 in U.S. Appl. No. 13/030,438. |
USPTO; Final Office Action dated Aug. 22, 2012 in U.S. Appl. No. 13/030,438. |
USPTO; Notice of Allowance dated Oct. 24, 2012 in U.S. Appl. No. 13/030,438. |
USPTO; Non-Final Office Action dated Dec. 3, 2012 in U.S. Appl. No. 13/040,013. |
USPTO; Notice of Allowance dated May 3, 2013 in U.S. Appl. No. 13/040,013. |
USPTO; Notice of Allowance dated Sep. 13, 2012 in U.S. Appl. No. 13/085,698. |
USPTO; Non-Final Office Action dated Mar. 29, 2013 in U.S. Appl. No. 13/094,402. |
USPTO; Final Office Action dated Jul. 17, 2013 in U.S. Appl. No. 13/094,402. |
USPTO; Notice of Allowance dated Sep. 30, 2013 in U.S. Appl. No. 13/094,402. |
USPTO; Non-Final Office Action dated Jul. 17, 2014 in U.S. Appl. No. 13/154,271. |
USPTO; Final Office Action dated Jan. 2, 2015 in U.S. Appl. No. 13/154,271. |
USPTO; Non-Final Office Action dated May 27, 2015 in U.S. Appl. No. 13/154,271. |
USPTO; Non-Final Office Action dated Oct. 27, 2014 in U.S. Appl. No. 13/169,951. |
USPTO; Final Office Action dated May 26, 2015 in U.S. Appl. No. 13/169,591. |
USPTO; Non-Final Office Action dated Sep. 1, 2015 in U.S. Appl. No. 13/169,951. |
USPTO; Non-Final Office Action dated Jun. 24, 2014 in U.S. Appl. No. 13/181,407. |
USPTO; Final Office Action dated Sep. 24, 2014 in U.S. Appl. No. 13/181,407. |
USPTO; Non-Final Office Action dated Jan. 2, 2015 in U.S. Appl. No. 13/181,407. |
USPTO; Final Office Action dated Apr. 8, 2015 in U.S. Appl. No. 13/181,407. |
USPTO; Non-Final Office Action dated Jan. 23, 2013 in U.S. Appl. No. 13/184,351. |
USPTO; Final Office Action dated Jul. 29, 2013 in U.S. Appl. No. 13/184,351. |
USPTO; Non-Final Office Action dated Jul. 16, 2014 in U.S. Appl. No. 13/184,351. |
USPTO; Final Office Action dated Feb. 17, 2015 in U.S. Appl. No. 13/184,351. |
USPTO; Non-Final Office Action dated Aug. 10, 2015 in U.S. Appl. No. 13/184,351. |
USPTO; Non-Final Office Action dated Oct. 1, 2012 in U.S. Appl. No. 13/191,762. |
USPTO; Final Office Action dated Apr. 10, 2013 in U.S. Appl. No. 13/191,762. |
USPTO; Notice of Allowance dated Aug. 15, 2013 in U.S. Appl. No. 13/191,762. |
USPTO; Non-Final Office Action dated Oct. 22, 2012 in U.S. Appl. No. 13/238,960. |
USPTO; Final Office Action dated May 3, 2013 in U.S. Appl. No. 13/238,960. |
USPTO; Non-Final Office Action dated Jun. 17, 2015 in U.S. Appl. No. 13/283,408. |
USPTO; Non-Final Office Action dated Apr. 26, 2013 in U.S. Appl. No. 13/250,721. |
USPTO; Notice of Allowance dated Sep. 11, 2013 in U.S. Appl. No. 13/250,721. |
USPTO; Non-Final Office Action dated Apr. 9, 2014 in U.S. Appl. No. 13/333,420. |
USPTO; Notice of Allowance dated Sep. 15, 2014 in U.S. Appl. No. 13/333,420. |
USPTO; Non-Final Office Action dated Oct. 10, 2012 in U.S. Appl. No. 13/406,791. |
USPTO; Final Office Action dated Jan. 31, 2013 in U.S. Appl. No. 13/406,791. |
USPTO; Non-Final Office Action dated Apr. 25, 2013 in U.S. Appl. No. 13/406,791. |
USPTO; Final Office Action dated Aug. 23, 2013 in U.S. Appl. No. 13/406,791. |
USPTO; Non-Final Office Action dated Dec. 4, 2013 in U.S. Appl. No. 13/406,791. |
USPTO; Final Office Action dated Apr. 21, 2014 in U.S. Appl. No. 13/406,791. |
USPTO; Non-Final Office Action dated Jan. 14, 2013 in U.S. Appl. No. 13/410,970. |
USPTO; Notice of Allowance dated Feb. 14, 2013 in U.S. Appl. No. 13/410,970. |
USPTO; Notice of Allowance dated Oct. 6, 2015 in U.S. Appl. No. 13/411,271. |
USPTO; Non-Final Office Action dated Apr. 11, 2013 in U.S. Appl. No. 13/450,368. |
USPTO; Notice of Allowance dated Jul. 17, 2013 in U.S. Appl. No. 13/450,368. |
USPTO; Non-Final Office Action dated Oct. 17, 2013 in U.S. Appl. No. 13/493,897. |
USPTO; Notice of Allowance dated Mar. 20, 2014 in U.S. Appl. No. 13/493,897. |
USPTO; Non-Final Office Action dated Sep. 11, 2013 in U.S. Appl. No. 13/550,419. |
USPTO; Final Office Action dated Jan. 27, 2014 in U.S. Appl. No. 13/550,419. |
USPTO; Notice of Allowance dated May 29, 2014 in U.S. Appl. No. 13/550,419. |
USPTO; Notice of Allowance dated Jun. 12, 2015 in U.S. Appl. No. 13/563,066. |
USPTO; Notice of Allowance dated Jul. 16, 2015 in U.S. Appl. No. 13/563,066. |
USPTO; Non-Final Office Action dated Nov. 7, 2013 in U.S. Appl. No. 13/565,564. |
USPTO; Final Office Action dated Feb. 28, 2014 in U.S. Appl. No. 13/565,564. |
USPTO; Non-Final Office Action dated Jul. 2, 2014 in U.S. Appl. No. 13/565,564. |
USPTO; Notice of Allowance dated Nov. 3, 2014 in U.S. Appl. No. 13/565,564. |
USPTO; Non-Final Office Action dated Aug. 30, 2013 in U.S. Appl. No. 13/570,067. |
USPTO; Notice of Allowance dated Jan. 6, 2014 in U.S. Appl. No. 13/570,067. |
USPTO; Notice of Allowance dated Aug. 28, 2015 in U.S. Appl. No. 13/597,043. |
USPTO; Non-Final Office Action dated Dec. 8, 2015 in U.S. Appl. No. 13/597,108. |
USPTO; Notice of Allowance dated Mar. 27, 2014 in U.S. Appl. No. 13/604,498. |
USPTO; Non-Final Office Action dated Apr. 15, 2015 in U.S. Appl. No. 13/646,403. |
USPTO; Final Office Action dated Oct. 15, 2015 in U.S. Appl. No. 13/646,403. |
USPTO; Non-Final Office Action dated May 15, 2014 in U.S. Appl. No. 13/646,471. |
USPTO; Final Office Action dated Aug. 18, 2014 in U.S. Appl. No. 13/646,471. |
USPTO; Non-Final Office Action dated Dec. 16, 2014 in U.S. Appl. No. 13/646/,471. |
USPTO; Final Office Action dated Apr. 21, 2015 in U.S. Appl. No. 13/646,471. |
USPTO; Non-Final Office Action dated Aug. 19, 2015 in U.S. Appl. No. 13/646,471. |
USPTO; Final Office Action dated Nov. 19, 2015 in U.S. Appl. No. 13/651,144. |
USPTO; Non-Final Office Action dated Jun. 18, 2015 in U.S. Appl. No. 13/665,366. |
USPTO; Notice of Allowance dated Aug. 24, 2015 in U.S. Appl. No. 13/677,133. |
USPTO; Non-Final Office Action dated Aug. 20, 2013 in U.S. Appl. No. 13/679,502. |
USPTO; Final Office Action dated Feb. 25, 2014 in U.S. Appl. No. 13/679,502. |
USPTO; Notice of Allowance dated May 2, 2014 in U.S. Appl. No. 13/679,502. |
USPTO; Non-Final Office Action dated Jul. 21, 2015 in U.S. Appl. No. 13/727,324. |
USPTO; Non-Final Office Action dated Oct. 24, 2013 in U.S. Appl. No. 13/749,878. |
USPTO; Non-Final Office Action dated Jun. 18, 2014 in U.S. Appl. No. 13/749,878. |
USPTO; Final Office Action dated Dec. 10, 2014 in U.S. Appl. No. 13/749,878. |
USPTO; Notice of Allowance dated Mar. 13, 2015 dated in U.S. Appl. No. 13/749,878. |
USPTO; Non-Final Office Action dated Dec. 19, 2013 in U.S. Appl. No. 13/784,388. |
USPTO; Notice of Allowance dated Jun. 4, 2014 in U.S. Appl. No. 13/784,388. |
USPTO; Non-Final Office Action dated Oct. 26, 2015 in U.S. Appl. No. 13/791,246. |
USPTO; Non-Final Office Action dated Nov. 6, 2015 in U.S. Appl. No. 13/791,339. |
USPTO; Non-Final Office Action dated Mar. 21, 2014 in U.S. Appl. No. 13/799,708. |
USPTO; Notice of Allowance dated Oct. 31, 2014 in U.S. Appl. No. 13/799,708. |
USPTO; Notice of Allowance dated Apr. 10, 2014 in U.S. Appl. No. 13/901,341. |
USPTO; Notice of Allowance dated Jun. 6, 2014 in U.S. Appl. No. 13/901,341. |
USPTO; Non-Final Office Action dated Jan. 2, 2015 in U.S. Appl. No. 13/901,372. |
USPTO; Final Office Action dated Apr. 16, 2015 in U.S. Appl. No. 13/901,372. |
USPTO; Non-Final Office Action dated Jul. 8, 2015 in U.S. Appl. No. 13/901,400. |
USPTO; Notice of Allowance dated Aug. 5, 2015 in U.S. Appl. No. 13/901,372. |
USPTO; Non-Final Office Action dated Apr. 24, 2014 in U.S. Appl. No. 13/912,666. |
USPTO; Final Office Action dated Sep. 25, 2014 in U.S. Appl. No. 13/912,666. |
USPTO; Non-Final Office Action dated Jan. 26, 2015 in U.S. Appl. No. 13/912,666. |
USPTO; Notice of Allowance dated Jun. 25, 2015 in U.S. Appl. No. 13/912,666. |
USPTO; Non-Final Office Action dated Dec. 16, 2014 in U.S. Appl. No. 13/915,732. |
USPTO; Final Office Action dated Apr. 10, 2015 in U.S. Appl. No. 13/915,732. |
USPTO; Notice of Allowance dated Jun. 19, 2015 in U.S. Appl. No. 13/915,732. |
USPTO; Notice of Allowance dated Mar. 17, 2015 in U.S. Appl. No. 13/923,197. |
USPTO; Non-Final Office Action dated Jul. 30, 2015 in U.S. Appl. No. 13/941,216. |
USPTO; Non-Final Office Action dated Jun. 29, 2015 in U.S. Appl. No. 13/966,782. |
USPTO; Notice of Allowance dated Oct. 7, 2015 in U.S. Appl. No. 13/973,777. |
USPTO; Non-Final Office Action dated Feb. 20, 2015 in U.S. Appl. No. 14/018,231. |
USPTO; Notice of Allowance dated Jul. 20, 2015 in U.S. Appl. No. 14/018,231. |
USPTO; USPTO; Final Office Action dated Sep. 14, 2015 in U.S. Appl. No. 14/018,345. |
USPTO; Non-Final Office Action dated Mar. 26, 2015 in U.S. Appl. No. 14/031,982. |
USPTO; Final Office Action dated Aug. 28, 2015 in U.S. Appl. No. 14/031,982. |
USPTO; Notice of Allowance dated Nov. 17, 2015 in U.S. Appl. No. 14/031,982. |
USPTO; Notice of Allowance dated Sep. 11, 2015 in U.S. Appl. No. 14/040,196. |
USPTO; Non-Final Office Action dated Dec. 15, 2014 in U.S. Appl. No. 14/065,114. |
USPTO; Final Office Action dated Jun. 19, 2015 in U.S. Appl. No. 14/065,114. |
USPTO; Non-Final Office Action dated Oct. 7, 2015 in U.S. Appl. No. 14/065,114. |
USPTO; Non-Final Office Action dated Nov. 14, 2014 in U.S. Appl. No. 14/069,244. |
USPTO; Notice of Allowance dated Mar. 25, 2015 in U.S. Appl. No. 14/069,244. |
USPTO; Non-Final Office Action dated Sep. 9, 2015 in U.S. Appl. No. 14/090,750. |
USPTO; Final Office Action dated Sep. 1, 2015 in U.S. Appl. No. 14/079,302. |
USPTO; Notice of Allowance dated Sep. 3, 2015 in U.S. Appl. No. 14/166,462. |
USPTO; Non-Final Office Action dated Nov. 17, 2015 in U.S. Appl. No. 14/172,220. |
USPTO; Final Office Action dated Jul. 10, 2015 in U.S. Appl. No. 14/183,187. |
USPTO; Non-Final Office Action dated Oct. 8, 2015 in U.S. Appl. No. 14/218,374. |
USPTO; Non-Final Office Action dated Sep. 22, 2015 in U.S. Appl. No. 14/219,839. |
USPTO; Non-Final Office Action dated Nov. 25, 2015 in U.S. Appl. No. 14/219,879. |
USPTO; Non-Final Office Action dated Sep. 18, 2015 in U.S. Appl. No. 14/244,689. |
USPTO; Non-Final Office Action dated Nov. 20, 2015 in U.S. Appl. No. 14/260,701. |
USPTO; Non-Final Office Action dated Aug. 19, 2015 in U.S. Appl. No. 14/268,348. |
USPTO; Non-Final Office Action dated Oct. 20, 2015 in U.S. Appl. No. 14/281,477. |
USPTO; Final Office Action dated Jul. 14, 2015 in U.S. Appl. No. 14/457,058. |
USPTO; Non-Final Office Action dated Nov. 6, 2015 in U.S. Appl. No. 14/457,058. |
USPTO; Non-Final Office Action dated Apr. 10, 2015 in U.S. Appl. No. 14/505,290. |
USPTO; Notice of Allowance dated Aug. 21, 2015 in U.S. Appl. No. 14/505,290. |
USPTO; Final Office Action dated Jul. 16, 2015 in U.S. Appl. No. 14/563,044. |
USPTO; Notice of Allowance dated Dec. 2, 2015 in U.S. Appl. No. 14/563,044. |
USPTO; Non-Final Office Action dated Oct. 1, 2015 in U.S. Appl. No. 14/571,126. |
USPTO; Non-Final Office Action dated Nov. 19, 2015 in U.S. Appl. No. 14/659,437. |
USPTO; Notice of Allowance dated Nov. 26, 2014 in U.S. Appl. No. 29/481,301. |
USPTO; Notice of Allowance dated Feb. 17, 2015 in U.S. Appl. No. 29/481,308. |
USPTO; Notice of Allowance dated Jan. 12, 2015 in U.S. Appl. No. 29/481,312. |
USPTO; Notice of Allowance dated Apr. 30, 2015 in U.S. Appl. No. 29/481,315. |
USPTO; Notice of Allowance dated May 11, 2015 in U.S. Appl. No. 29/511,011. |
USPTO; Notice of Allowance dated May 11, 2015 in U.S. Appl. No. 29/514,153. |
Bhatnagar et al., “Copper Interconnect Advances to Meet Moore's Law Milestones,” Solid State Technology, 52, 10 (2009). |
Buriak, “Organometallic Chemistry on Silicon and Germanium Surfaces,” Chemical Reviews, 102, 5 (2002). |
Cant et al., “Chemisorption Sites on Porous Silica Glass and on Mixed-Oxide Catalysis,” Can. J. Chem. 46, 1373 (1968). |
Chen et al., “A Self-Aligned Airgap Interconnect Scheme,” IEEE International Interconnect Technology Conference, vol. 1-3, 146-148 (2009). |
Choi et al., “Improvement of Silicon Direct Bonding using Surfaces Activated by Hydrogen Plasma Treatement,” Journal of the Korean Physical Society, 37, 6, 878-881 (2000). |
Choi et al., “Low Temperature Formation of Silicon Oxide Thin Films by Atomic Layer Deposition Using NH3/O2 Plasma,” ECS Solid State Letters, 2(12) p. 114-p. 116 (2013). |
Cui et al., “Impact of Reductive N2/H2 Plasma on Porous Low-Dielectric Constant SiCOH Thin Films,” Journal of Applied Physics 97, 113302, 1-8 (2005). |
Dingemans et al., “Comparison Between Aluminum Oxide Surface Passivation Films Deposited with Thermal Aid,” Plasma Aid and Pecvd, 35th IEEE PVCS, Jun. (2010). |
Drummond et al., “Hydrophobic Radiofrequency Plasma-Deposited Polymer Films: Dielectric Properties and Surface Forces,” Colloids and Surfaces A, 129-130, 117-129 (2006). |
Easley et al., “Thermal Isolation of Microchip Reaction Chambers for Rapid Non-Contact DNA Amplification,” J. Micromech. Microeng. 17, 1758-1766 (2007). |
Ge et al., “Carbon Nanotube-Based Synthetic Gecko Tapes,” Department of Polymer Science, PNAS, 10792-10795 (2007). |
George et al., “Atomic Layer Deposition: An Overview,” Chem. Rev. 110, 111-131 (2010). |
Grill et al., “The Effect of Plasma Chemistry on the Damage Induced Porous SiCOH Dielectrics,” IBM Research Division, RC23683 (W0508-008), Materials Science, 1-19 (2005). |
Heo et al., “Structural Characterization of Nanoporous Low-Dielectric Constant SiCOH Films Using Organosilane Precursors,” NSTI-Nanotech, vol. 4, 122-123 (2007). |
Jung et al., “Double Patterning of Contact Array with Carbon Polymer,” Proc. Of SPIE, 6924, 69240C, 1-10 (2008). |
Katamreddy et al., “ALD and Characterization of Aluminum Oxide Deposited on Si(100) using Tris(diethylamino) Aluminum and Water Vapor,” Journal of The Electrochemical Society, 153 (10) C701-C706(2006). |
Kim et al., “Passivation Effect on Low-k S/OC Dielectrics by H2 Plasma. Treatment,” Journal of the Korean Physical Society, 40, 1, 94-98 (2002). |
Kim et al., “Characteristics of Low Temperaure High Quality Silicon Oxide by Plasma. Enhanced Atomic Layer Deposition with In-Situ Plasma Densification Process,” The Electrochemical Society, ECS Transactions, College of Information and Communication Engineerign, Sungkvunkwan Universitv, 53(1). |
King, Plasma Enhanced Atomic Layer Deposition of SiNx: H and SiO2, J. Vac. Sci. Technol., A29(4) (2011). |
Koo et al., “Characteristics of Al2O3 Thin Films Deposited Using Dimethylaluminum Isopropoxide and Trimethylaluminum Precursors by the Plasma-Enhanced Atomic-Layer Deposition Method,” Journal of Physical Society, 48, 1, 131-136 (2006). |
Kurosawa et al., “Synthesis and Characterization of Plasma-Polymerized Hexamethyldisiloxane Films,” Thin Solid Films, 506-507, 176-179 (2006). |
Lieberman, et al., “Principles of Plasma Discharges and Materials Processing,” Second Edition, 368-381. |
Lim et al., “Low-Temperature Growth of SiO2 Films by Plasma-Enhanced Atomic Layer Deposition,” ETRI Journal, 27 (1), 118-121 (2005). |
Liu et al., “Research, Design, and Experimen of End Effector for Wafer Transfer Robot,” Industrial Robot: An International Journal, 79-91 (2012). |
Mackus et al., “Optical Emission Spectroscopy as a Tool for Studying Optimizing, and Monitoring Plasma-Assisted Atomic Layer Deposition Processes,” Journal of Vacuum Science and Technology, 77-87 (2010). |
Maeno, “Gecko Tape Using Carbon Nanotubes,” Nitto Denko Gihou, 47, 48-51. |
Marsik et al., “Effect of Ultraviolet Curing Wavelength on Low-k Dielectric Material Proerties and Plasma Damage Resistance,” Sciencedirect.com, 519, 11, 3619-3626 (2011). |
Morishige et al., “Thermal Desorption and Infrared Studies of Ammonia Amines and Pyridines Chemisorbed on Chromic Oxide,” J.Chem. Soc., Faraday Trans. 1, 78, 2947-2957 (1982). |
Mukai et al., “A Study of CD Budget in Spacer Patterning Technology,” Proc. Of SPIE, 6924, 1-8 (2008). |
Nogueira et al., “Production of Highly Hydrophobic Films Using Low Frequency and High Density Plasma,” Revista Brasileira de Aplicacoes de Vacuo, 25(1), 45-53 (2006). |
Schmatz et al., “Unusual Isomerization Reactions in 1.3-Diaza-2-Silcyclopentanes,” Organometallics, 23, 1180-1182 (2004). |
Scientific and Technical Information Center EIC 2800 Search Report dated Feb. 16, 2012. |
Shamma et al., “PDL Oxide Enabled Doubling,” Proc. Of SPIE, 6924, 69240D, 1-10 (2008). |
Wirths, et al, “SiGeSn Growth tudies Using Reduced Pressure Chemical Vapor Deposition Towards Optoeleconic Applications,” This Soid Films, 557, 183-187 (2014). |
Yun et al., “Behavior of Various Organosilicon Molecules in PECVD Processes for Hydrocarbon-Doped Silicon Oxide Films,” Solid State Phenomena, vol. 124-126, 347-350 (2007). |
USPTO; Final Office Action dated Apr. 15, 2015 in U.S. Appl. No. 13/187,300. |
USPTO; Final Office Action dated Mar. 20, 2015 in U.S. Appl. No. 13/312,591. |
USPTO; Notice of Allowance dated May 14, 2015 in U.S. Appl. No. 13/312,591. |
USPTO; Final Office Action dated Mar. 13, 2015 in U.S. Appl. No. 13/597,043. |
USPTO; Final Office Action dated Jun. 1, 2015 in U.S. Appl. No. 13/597,108. |
USPTO; Non-Final Office Action dated May 28, 2015 in U.S. Appl. No. 13/651,144. |
USPTO; Non-Final Office Action dated Apr. 3, 2015 in U.S. Appl. No. 13/677,133. |
USPTO; Final Office Action dated Mar. 25, 2015 in U.S. Appl. No. 13/791,246. |
USPTO; Notice of Allowance dated Mar. 10, 2015 in U.S. Appl. No. 13/874,708. |
USPTO; Restriction Requirement dated Apr. 30, 2015 in U.S. Appl. No. 13/941,216. |
USPTO; Non-Final Office Action dated Apr. 7, 2015 in U.S. Appl. No. 14/018,345. |
USPTO; Non-Final Office Action dated Apr. 28, 2015 in U.S. Appl. No. 14/040,196. |
USPTO; Non-Final Office Action dated Mar. 19, 2015 in U.S. Appl. No. 14/079,302. |
USPTO; Non-Final Office Action dated Mar. 19, 2015 in U.S. Appl. No. 14/166,462. |
USPTO; Non-Final Office Action dated Mar. 16, 2015 in U.S. Appl. No. 14/183,187. |
USPTO; Non-Final Office Action dated Mar. 16, 2015 in U.S. Appl. No. 29/447,298. |
Bearzotti, et al., “Fast Humidity Response of a Metal Halide-Doped Novel Polymer,” Sensors and Actuators B, 7, pp. 451-454, (1992). |
Crowell, “Chemical methods of thin film deposition: Chemical vapor deposition, atomic layer deposition, and related technologies,” Journal of Vacuum Science & Technology A 21.5, (2003): S88-S95. |
Varma, et al., “Effect of Metal Halides on Thermal, Mechanical, and Electrical Properties of Polypyromelitimide Films,” Journal of Applied Polymer Science, vol. 32, pp. 3987-4000, (1986). |
USPTO; Notice of Allowance dated May 23, 2016 in U.S. Appl. No. 12/754,223. |
USPTO; Non-Final Office Action dated Apr. 7, 2016 in U.S. Appl. No. 13/187,300. |
USPTO; Notice of Allowance dated Mar. 28, 2016 in U.S. Appl. No. 13/283,408. |
USPTO; Final Office Action dated Jun. 2, 2016 in U.S. Appl. No. 13/597,108. |
USPTO; Non-Final Office Action dated May 10, 2016 in U.S. Appl. No. 13/651,144. |
USPTO; Final Office Action dated Apr. 20, 2016 in U.S. Appl. No. 13/791,246. |
USPTO; Final Office Action dated Apr. 12, 2016 in U.S. Appl. No. 13/791,339. |
USPTO; Notice of Allowance dated Mar. 17, 2016 in U.S. Appl. No. 14/018,345. |
USPTO; Restriction Requirement dated May 20, 2016 in U.S. Appl. No. 14/218,690. |
USPTO; Final Office Action dated Mar. 25, 2016 in U.S. Appl. No. 14/219,839. |
USPTO; Notice of Allowance dated Jun. 2, 2016 in U.S. Appl. No. 14/260,701. |
USPTO; Final Office Action dated Apr. 5, 2016 in U.S. Appl. No. 14/498,036. |
USPTO; Final Office Action dated May 26, 2016 in U.S. Appl. No. 14/508,296. |
USPTO; Notice of Allowance dated Jun. 2, 2016 in U.S. Appl. No. 14/571,126. |
USPTO; Non-Final Office Action dated Mar. 21, 2016 in U.S. Appl. No. 14/659,152. |
USPTO; Final Office Action dated Mar. 17, 2016 in U.S. Appl. No. 14/659,437. |
USPTO; Notice of Allowance dated May 31, 2016 in U.S. Appl. No. 14/659,437. |
USPTO; Notice of Allowance dated Mar. 25, 2016 in U.S. Appl. No. 14/693,138. |
USPTO; Non-Final Office Action dated Mar. 30, 2016 in U.S. Appl. No. 14/808,979. |
USPTO; Non-Final Office Action dated Mar. 22, 2016 in U.S. Appl. No. 14/987,420. |
Kobayshi, et al., “Temperature Dependence of SiO2 Film Growth with Plasma-Enhanced Atomic Layer Deposition,” regarding Thin Solid Films, published by Elsevier in the International Journal on the Science and Technology of Condensed Matter, in vol. 520, No. 11, 3994-3998 (2012). |
H.J. Yun et al., “Comparison of Atomic Scale Etching of Poly-Si in Inductively Coupled Ar and He Plasmas”, Korean Journal of Chemical Engineering, vol. 24, year 2007, pp. 670-673. |
Krenek et al. “Ir Laser Cvd of Nanodisperse Ge—Si—Sn Alloys Obtained by Dielectric Breakdown of GeH4/SiH4/SnH4 Mixtures”, NanoCon Nov. 5-7, 2014, Brno, Czech Republic, EU. |
Moeen, “Design, Modelling and Characterization of Si/SiGe Structures for IR Bolometer Applications,” KTH Royal Institute of Technology. Stockholm Information and Communication Technology, Department of Integrated Devices and Circuits, Sweden 2015. |
Presser, et al., “Effect of Pore Size on Carbon Dioxide Sorption by Carbide Derived Carbon,” Energy & Environmental Science 4.8, 3059-3066 (2011). |
Radamson et al. “Growth of Sn-alloyed Group IV Materials for Photonic and Electronic Applications”, Chapter 5 pp. 129-144, Manufacturing NanoStructures. |
S.D. Athavale and D.J. Economou, “Realization of Atomic Layer Etching of Silicon”, Journal of Vacuum Science and Technology B, vol. 14, year 1996, pp. 3702-3705. |
USPTO; Notice of Allowance dated Aug. 4, 2015 in U.S. Appl. No. 13/677,133. |
USPTO; Notice of Allowance dated Jul. 6, 2015 in U.S. Appl. No. 29/447,298. |
USPTO; Notice of Allowance dated Jan. 27, 2015 in U.S. Appl. No. 12/763,037. |
USPTO; Final Office Action dated Jan. 29, 2015 in U.S. Appl. No. 13/283,408. |
USPTO; Notice of Allowance dated Feb. 11, 2015 in U.S. Appl. No. 13/284,642. |
USPTO; Final Office Action dated Jan. 16, 2015 in U.S. Appl. No. 13/411,271. |
USPTO; Final Office Action dated Feb. 12, 2015 in U.S. Appl. No. 13/563,066. |
USPTO; Non-Final Office Action dated Feb. 12, 2015 in U.S. Appl. No. 13/597,108. |
USPTO; Notice of Allowance dated Feb. 26, 2015 in U.S. Appl. No. 13/677,151. |
USPTO; Notice of Allowance dated Jan. 20, 2015 in U.S. Appl. No. 13/941,134. |
USPTO; Non-Final Office Action dated Feb. 12, 2015 in U.S. Appl. No. 14/457,058. |
USPTO; Non-Final Office Action dated Jan. 16, 2015 in U.S. Appl. No. 14/563,044. |
Chinese Patent Office; Office Action dated Jan. 12, 2015 in Application No. 201080015699.9. |
Chinese Patent Office; Notice on the Third Office Action dated Feb. 9, 2015 in Application No. 201110155056. |
Japanese Patent Office; Office Action dated Dec. 1, 2014 in Application No. 2012-504786. |
Taiwan Patent Office; Office Action dated Dec. 30, 2014 in Application No. 099114330. |
Taiwan Patent Office; Office Action dated Dec. 19, 2014 in Application No. 099127063. |
USPTO; Office Action dated Aug. 27, 2010 in U.S. Appl. No. 12/118,596. |
USPTO; Office Action dated Feb. 15, 2011 in U.S. Appl. No. 12/118,596. |
USPTO; Notice of Allowance dated Aug. 4, 2011 in U.S. Appl. No. 12/118,596. |
USPTO; Notice of Allowance dated Jun. 16, 2011 in U.S. Appl. No. 12/430,751. |
USPTO; Notice of Allowance dated Jul. 27, 2011 in U.S. Appl. No. 12/430,751. |
USPTO; Restriction Requirement dated Jan. 15, 2013 in U.S. Appl. No. 12/754,223. |
USPTO; Office Action dated Feb. 26, 2013 in U.S. Appl. No. 12/754,223. |
USPTO; Final Office Action dated Jun. 28, 2013 in U.S. Appl. No. 12/754,223. |
USPTO; Office Action dated Feb. 25, 2014 in U.S. Appl. No. 12/754,223. |
USPTO; Final Office Action dated Jul. 14, 2014 in U.S. Appl. No. 12/754,223. |
USPTO; Office Action dated Apr. 23, 2013 in U.S. Appl. No. 12/763,037. |
USPTO; Final Office Action dated Oct. 21, 2013 in U.S. Appl. No. 12/763,037. |
USPTO; Office Action dated Oct. 8, 2014 in U.S. Appl. No. 12/763,037. |
USPTO; Restriction Requirement dated Sep. 25, 2012 in U.S. Appl. No. 12/854,818. |
USPTO; Office Action dated Dec. 6, 2012 in U.S. Appl. No. 12/854,818. |
USPTO; Final Office Action dated Mar. 13, 2013 in U.S. Appl. No. 12/854,818. |
USPTO; Office Action dated Aug. 30, 2013 in U.S. Appl. No. 12/854,818. |
USPTO; Final Office Action dated Mar. 26, 2014 in U.S. Appl. No. 12/854,818. |
USPTO; Office Action dated Jun. 3, 2014 in U.S. Appl. No. 12/854,818. |
USPTO; Restriction Requirement dated May 8, 2013 in U.S. Appl. No. 13/102,980. |
USPTO; Office Action dated Oct. 7, 2013 in U.S. Appl. No. 13/102,980. |
USPTO; Final Office Action dated Mar. 25, 2014 in U.S. Appl. No. 13/102,980. |
USPTO; Notice of Allowance dated Jul. 3, 2014 in U.S. Appl. No. 13/102,980. |
USPTO; Non-Final Office Action dated Sep. 17, 2014 in U.S. Appl. No. 13/187,300. |
USPTO; Non-Final Office Action dated Jul. 2, 2014 in U.S. Appl. No. 13/283,408. |
USPTO; Restriction Requirement dated Dec. 16, 2013 in U.S. Appl. No. 13/284,642. |
USPTO; Restriction Requirement dated Apr. 21, 2014 in U.S. Appl. No. 13/284,642. |
USPTO; Office Action dated Jul. 30, 2014 in U.S. Appl. No. 13/284,642. |
USPTO; Office Action dated Jan. 28, 2014 in U.S. Appl. No. 13/312,591. |
USPTO; Final Office Action dated May 14, 2014 in U.S. Appl. No. 13/312,591. |
USPTO; Non-Final Office Action dated Nov. 26, 2014 in U.S. Appl. No. 13/312,591. |
USPTO; Office Action dated Jan. 10, 2013 in U.S. Appl. No. 13/339,609. |
USPTO; Office Action dated Feb. 11, 2013 in U.S. Appl. No. 13/339,609. |
USPTO; Final Office Action dated May 17, 2013 in U.S. Appl. No. 13/339,609. |
USPTO; Office Action dated Aug. 29, 2013 in U.S. Appl. No. 13/339,609. |
USPTO; Final Office Action dated Dec. 18, 2013 in U.S. Appl. No. 13/339,609. |
USPTO; Notice of Allowance dated Apr. 7, 2014 in U.S. Appl. No. 13/339,609. |
USPTO; Office Action dated Feb. 13, 2014 in U.S. Appl. No. 13/411,271. |
USPTO; Office Action dated Jul. 31, 2014 in U.S. Appl. No. 13/411,271. |
USPTO; Restriction Requirement dated Oct. 29, 2013 in U.S. Appl. No. 13/439,528. |
USPTO; Office Action dated Feb. 4, 2014 in U.S. Appl. No. 13/439,528. |
USPTO; Final Office Action dated Jul. 8, 2014 in U.S. Appl. No. 13/439,528. |
UPPTO; Notice of Allowance dated Oct. 21, 2014 in U.S. Appl. No. 13/439,528. |
USPTO; Office Action dated May 23, 2013 in U.S. Appl. No. 13/465,340. |
USPTO; Final Office Action dated Oct. 30, 2013 in U.S. Appl. No. 13/465,340. |
USPTO; Notice of Allowance dated Feb. 12, 2014 in U.S. Appl. No. 13/465,340. |
USPTO; Office Action dated Dec. 20, 2013 in U.S. Appl. No. 13/535,214. |
USPTO; Final Office Action dated Jun. 18, 2014 in U.S. Appl. No. 13/535,214. |
USPTO; Notice of Allowance dated Oct. 23, 2014 in U.S. Appl. No. 13/535,214. |
USPTO; Non-Final Office Action dated Aug. 8, 2014 in U.S. Appl. No. 13/563,066. |
USPTO; Non-Final Office Action dated Oct. 15, 2014 in U.S. Appl. No. 13/597,043. |
USPTO; Office Action dated Nov. 15, 2013 in U.S. Appl. No. 13/612,538. |
USPTO; Office Action dated Jul. 10, 2014 in U.S. Appl. No. 13/612,538. |
USPTO; Office Action dated Jun. 2, 2014 in U.S. Appl. No. 13/677,151. |
USPTO; Final Office Action dated Nov. 14, 2014 in U.S. Appl. No. 13/677,151. |
USPTO; Office Action dated Apr. 24, 2014 in U.S. Appl. No. 13/784,362. |
USPTO; Notice of Allowance dated Aug. 13, 2014 in U.S. Appl. No. 13/784,362. |
USPTO; Restriction Requirement dated Jun. 26, 2014 in U.S. Appl. No. 13/874,708. |
USPTO; Non-Final Office Action dated Oct. 9, 2014 in U.S. Appl. No. 13/874,708. |
USPTO; Restriction Requirement dated May 8, 2014 in U.S. Appl. No. 13/791,246. |
USPTO; Non-Final Office Action dated Sep. 19, 2014 in U.S. Appl. No. 13/791,246. |
USPTO; Non-Final Office Action dated Sep. 12, 2014 in U.S. Appl. No. 13/941,134. |
USPTO; Restriction Requirement dated Sep. 16, 2014 in U.S. Appl. No. 13/948,055. |
USPTO; Non-Final Office Action dated Oct. 30, 2014 in U.S. Appl. No. 13/948,055. |
USPTO; Office Action dated May 29, 2014 in U.S. Appl. No. 14/183,187. |
USPTO; Final Office Action dated Nov. 7, 2014 in U.S. Appl. No. 14/183,187. |
PCT; International Search Report and Written Opinion dated Nov. 12, 2010 in Application No. PCT/US2010/030126. |
PCT; International Preliminary Report on Patentability dated Oct. 11, 2011 Application No. PCT/US2010/030126. |
PCT; International Search Report and Written Opinion dated Jan. 12, 2011 in Application No. PCT/US2010/045368. |
PCT; International Search Report and Written Opinion dated Feb. 6, 2013 in Application No. PCT/US2012/065343. |
PCT; International Search Report and Written Opinion dated Feb. 13, 2013 in Application No. PCT/US2012/065347. |
Chinese Patent Office; Office Action dated Jan. 10, 2013 in Application No. 201080015699.9. |
Chinese Patent Office; Notice on the First Office Action dated May 24, 2013 in Application No. 201080036764.6. |
Chinese Patent Office; Notice on the Second Office Action dated Jan. 2, 2014 in Application No. 201080036764.6. |
Chinese Patent Office; Notice on the Third Office Action dated Jul. 1, 2014 in Application No. 201080036764.6. |
Chinese Patent Office; Notice on the First Office Action dated Feb. 8, 2014 in Application No. 201110155056. |
Chinese Patent Office; Notice on the Second Office Action dated Sep. 16, 2014 in Application No. 201110155056. |
Japanese Patent Office; Office Action dated Jan. 25, 2014 in Application No. 2012-504786. |
Taiwan Patent Office; Office Action dated Jul. 4, 2014 in Application No. 099110511. |
Chang et al. Small-Subthreshold-Swing and Low-Voltage Flexible Organic Thin-Film Transistors Which Use HfLaO as the Gate Dielectric; IEEE Electron Device Letters; Feb. 2009; 133-135; vol. 30, No. 2; IEEE Electron Device Society. |
Koutsokeras et al. Texture and Microstructure Evolution in Single-Phase TixTa1-xN Alloys of Rocksalt Structure. Journal of Applied Physics, 110, pp. 043535-1-043535-6, (2011). |
Maeng et al. Electrical properties of atomic layer disposition Hf02 and Hf0xNy on Si substrates with various crystal orientations, Journal of the Electrochemical Society, Apr. 2008, p. H267-H271, vol. 155, No. 4, Department of Materials Science and Engineering, Pohang University of Science and Technology, Pohang, Korea. |
Novaro et al. Theoretical Study on a Reaction Pathway of Ziegler-Natta-Type Catalysis, J. Chem. Phys. 68(5), Mar. 1, 1978 p. 2337-2351. |
USPTO; Final Office Action dated Sep. 23, 2016 in U.S. Appl. No. 13/187,300. |
USPTO; Non-Final Office Action dated Sep. 15, 2016 in U.S. Appl. No. 13/597,108. |
USPTO; Notice of Allowance dated Sep. 13, 2016 in U.S. Appl. No. 13/941,216. |
USPTO; Final Office Action dated Sep. 20, 2016 in U.S. Appl. No. 13/651,144. |
USPTO; Final Office Action dated Aug. 25, 2016 in U.S. Appl. No. 14/188,760. |
USPTO; Non Final Office Action dated Aug. 12, 2016 in U.S. Appl. No. 14/246,969. |
USPTO; Non-Final Office Action dated Sep. 8, 2016 in U.S. Appl. No. 14/508,296. |
USPTO; Final Office Action dated Sep. 29, 2016 in U.S. Appl. No. 14/568,647. |
USPTO; Non-Final Office Action dated Sep. 9, 2016 in U.S. Appl. No. 14/829,565. |
USPTO; Non-Final Office Action dated Jul. 29, 2016 in U.S. Appl. No. 14/884,695. |
USPTO; Non-Final Office Action dated Aug. 12, 2016 in U.S. Appl. No. 14/981,434. |
USPTO; Non-Final Office Action dated Sep. 23, 2016 in U.S. Appl. No. 15/048,422. |
Becker et al., “Atomic Layer Deposition of Insulating Hafnium and Zirconium Nitrides,” Chem. Mater., 16, 3497-3501 (2004). |
Nigamananda et al., “Low-Temperature (<200oC) Plasma Enhanced Atomic Deposition of Dense Titanium Nitride Thin Films.” |
Potts et al., “Low Temperature Plasma-Enhanced Atomic Layer Deposition of metal Oxide Thin Films,” Journal of the Electrochemical Society, 157, 66-74 (2010). |
Yun et al., “Effect of Plasma on Characteristics of Zirconium Oxide Films Deposited by Plasma-Enhanced Atomic Layer Deposition,” Electrochemical and Solid State Letters, 8(11) F47-F50 (2005). |
Number | Date | Country | |
---|---|---|---|
20160051964 A1 | Feb 2016 | US |