This is a Division of application Ser. No. 08/159,448, filed Nov. 30, 1993, now U.S. Pat. No. 5,658,828, which is a continuation-in-part of Ser. No. 08/124,836, filed Sep. 21, 1993, titled METHOD FOR FABRICATING INTERLEVEL CONTACTS, which is a continuation of Ser. No. 07/443,898, filed Nov. 30, 1989, and of Ser. No. 08/146,825, filed Nov. 1, 1993, titled METHOD FOR FORMING A METAL CONTACT, which is a continuation of Ser. No. 07/835,731, filed Feb. 2, 1992, which is a continuation of Ser. No. 07/609,883, filed November 5, 1990, now U.S. Pat. No. 5,108,951 and of Ser. No. 07/948,690, filed Sep. 22, 1992, titled METHOD FOR FORMING A METAL CONTACT. The present application also contains subject matter in common with Ser. No. 08/160,686, filed on even date herewith, titled INTEGRATED CIRCUIT STRUCTURE AND METHOD, the disclosure of which is hereby expressly incorporated by reference. All of the applications stated above are owned by the assignee of the present application, and are hereby expressly incorporated by reference.
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Number | Date | Country | |
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146825 | Nov 1993 | ||
948690 | Sep 1992 |
Number | Date | Country | |
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Parent | 159448 | Nov 1993 |
Number | Date | Country | |
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Parent | 443898 | Nov 1989 | |
Parent | 835731 | Feb 1992 | |
Parent | 609883 | Nov 1990 |
Number | Date | Country | |
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Parent | 124836 | Sep 1993 |