Claims
- 1. A multi-layer structure comprising:a barrier layer on a predetermined region of an insulating layer; a metal seed layer made of a metal which is different in substance from said barrier layer, said metal seed layer extending not only on an entire surface of said barrier layer but also a peripheral region positioned outside said predetermined region of said insulating layer; and a metal plating layer made of the same metal as said seed layer, and said metal layer being adhered on said metal seed layer so that said metal plating layer is separated from said barrier layer and also from said insulating layer.
- 2. The multi-layer structure as claimed in claim 1, wherein said barrier layer comprises a TiN barrier layer, and said metal seed layer and said metal plating layer are made of copper.
- 3. The multi-layer structure as claimed in claim 1, wherein said multi-layer structure is formed in at least one of a trench groove in an inter-layer insulator as said insulating layer and a through hole also formed in said inter-layer insulator.
- 4. A multi-layer structure comprising:a barrier layer formed on a predetermined region of an insulating layer; a metal seed layer made of a metal which is different in substance from said barrier layer, said metal seed layer formed on, and completely encompassing said barrier layer and also a peripheral region positioned outside said predetermined region of said insulating layer; and a metal plating layer made of the same metal as said seed layer, and said metal layer being adhered on said metal seed layer so that said metal plating layer is separated from said barrier layer and also from said insulating layer.
- 5. The multi-layer structure as claimed in claim 4, wherein said barrier layer comprises a TiN barrier layer, and said metal seed layer and said metal plating layer are made of copper.
- 6. The multi-layer structure as claimed in claim 4, wherein said multi-layer structure is formed in at least one of a trench groove in an inter-layer insulator as said insulating layer and a through hole also formed in said inter-layer insulator.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-96502 |
Apr 1998 |
JP |
|
Parent Case Info
This is a division of application Ser. No. 09/288,265, filed Apr. 8, 1999 now U.S. Pat. No. 6,372,114.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
5968333 |
Nogami et al. |
Oct 1999 |
A |
5969422 |
Ting et al. |
Oct 1999 |
A |
6022808 |
Nogami et al. |
Feb 2000 |
A |
6249055 |
Dubin |
Jun 2001 |
B1 |
Foreign Referenced Citations (1)
Number |
Date |
Country |
08264538 |
Oct 1996 |
JP |