Number | Name | Date | Kind |
---|---|---|---|
4334349 | Aoyama et al. | Jun 1982 | |
4353935 | Symersky | Oct 1982 | |
4895811 | Inoue | Jan 1990 | |
5219117 | Lin | Jun 1993 | |
5268068 | Cowell et al. | Dec 1993 |
Number | Date | Country |
---|---|---|
59-21045 | Feb 1984 | JPX |
60-120540 | Jun 1985 | JPX |
60-254752 | Dec 1985 | JPX |
2165633 | Jun 1990 | JPX |
41144191 | May 1992 | JPX |
629298 | Feb 1994 | JPX |
Entry |
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"Process for Forming a High-Aspecfratio Solder Wterconnection"; IBM TDB, vol. 32, No. 6B, Nov. 1989, p. 180. |
Motorola; C4 Product Design Manual; vol. 1: Chip and Wafer Design; Chapter 8--Bump Mask Design; pp. 8-1--8-2 (1992). |
R. Tummala, et al.; IBM; Microelectronics Packaging Handbook; Ch. 6.3: Controlled Collapse Chip Connection (C4); pp. 366-391 (1989). |