Claims
- 1. A method for the fabrication of a conductive electronic feature on a substrate, comprising the steps of:
(a) providing a substrate having a recessed feature; (b) depositing a silver metal precursor composition into at least a portion of said recessed feature; and (c) heating said conductor precursor composition to a temperature of not greater than about 400° C. to convert said conductor precursor composition to a conductive feature having a resistivity of not greater than 10 times the resistivity of the bulk metal.
- 2. A method as recited in claim 1, wherein said recessed feature has a depth of not greater than 10 μm and a minimum feature size of not greater than 50 μm.
- 3. A method as recited in claim 1, wherein said recessed feature has a depth of not greater than 100 μm and a minimum feature size of not greater than 50 μm.
- 4. A method as recited in claim 1, wherein said recessed features are vias.
- 5. A method as recited in claim 1, wherein said substrate is a polymer.
- 1. A method as recited in claim 1, wherein said substrate is selected from the group consisting of polyfluorinated compounds, polyimides, epoxies (including glass-filled epoxy), polycarbonate, acetate, polyester, polyethylene, polypropylene, polyvinyl chloride and acrylonitrile, butadiene (ABS).
- 6. A method as recited in claim 1, wherein said substrate is a glass.
- 7. A method as recited in claim 1, wherein said conductor precursor composition comprises a silver metal carboxylate compound.
- 8. A method as recited in claim 1, wherein said conductor precursor composition comprises a molecular precursor compound and metallic particles.
- 9. A method as recited in claim 1, wherein said depositing step comprises applying said precursor composition over said substrate and using a doctor blade to force said precursor composition into said recessed feature.
- 10. A method as recited in claim 1, wherein said depositing step comprises applying said precursor composition into said recessed features using a syringe.
- 11. A method as recited in claim 1, wherein said depositing step comprises applying said precursor composition into said recessed features using an ink-jet device.
- 12. A method as recited in claim 1, wherein said depositing step comprises applying said precursor composition into said recessed features using an aerosol jet.
- 13. A method as recited in claim 1, further comprising the step of modifying the surface of said recessed feature to modify the surface energy of said recessed feature.
- 14. A method as recited in claim 1, wherein said precursor composition wets said recessed feature.
- 15. A method as recited in claim 1, wherein said heating step comprises heating to a temperature of not greater than about 300° C.
- 16. A method as recited in claim 1, wherein said heating step comprises heating to a temperature of not greater than about 200° C.
- 17. A method as recited in claim 1, wherein said heating step comprises heating to a temperature of not greater than about 150° C.
- 18. A method as recited in claim 1, wherein said conductive feature has a resistivity of not greater than about 6 times the resistivity of bulk silver.
- 19. A method as recited in claim 1, wherein said conductive feature on said substrate is patterned to form a printed circuit board.
- 20. A method as recited in claim 1, wherein said conductive feature on said substrate is patterned to form a high density interconnect.
- 21. A method as recited in claim 1, wherein said conductive feature on said substrate is patterned to form bus lines for a flat panel display.
- 22. A method as recited in claim 1, wherein said conductive feature on said substrate is patterned to form under bump metallization.
- 23. A method for the fabrication of a dielectric electronic feature on a substrate, comprising the steps of:
(a) providing a substrate having a recessed feature; (b) depositing a dielectric precursor composition comprising at least a molecular precursor to a dielectric compound into at least a portion of said recessed feature; and (c) heating said dielectric precursor composition to a temperature of not greater than about 350° C. to convert said dielectric precursor composition to a dielectric feature.
- 24. A method as recited in claim 23, wherein said substrate is a polymer.
- 2. A method as recited in claim 23, wherein said substrate is selected from the group consisting of polyfluorinated compounds, polyimides, epoxies (including glass-filled epoxy), polycarbonate, -acetate, polyester, polyethylene, polypropylene, polyvinyl chloride, acrylonitrile and butadiene (ABS).
- 25. A method as recited in claim 23, wherein said heating step comprises heating to a temperature of not greater than about 300° C.
- 26. A method as recited in claim 23, wherein said substrate is a glass.
- 27. A method as recited in claim 23, wherein said dielectric precursor composition comprises glass particles.
- 28. A method as recited in claim 23, wherein said dielectric precursor composition comprises dielectric particles having a dielectric constant of at least about 40.
- 29. A method as recited in claim 23, wherein said depositing step comprises applying said precursor composition over said substrate and using a doctor blade to force said precursor composition into said recessed feature.
- 30. A method as recited in claim 23, further comprising the step of modifying the surface of said recessed feature to modify the surface energy of said recessed feature.
- 31. A method for the fabrication of an inorganic resistor on a substrate, comprising the steps of:
(a) providing a substrate having a recessed feature; (b) depositing a resistor precursor composition into at least a portion of said recessed feature, said resistor precursor composition comprising at least a molecular precursor compound to a metal or a metal oxide; and (c) heating said resistor precursor composition to a temperature of not greater than about 350° C. to convert said resistor precursor composition to an inorganic resistor.
- 32. A method as recited in claim 31, wherein said substrate is a polymer.
- 33. A method as recited in claim 31, wherein said substrate is selected from the group consisting of polyfluorinated compounds, polyimides, epoxies (including glass-filled epoxy), polycarbonate, cellulose-based materials (i.e. wood or paper), acetate, polyester, polyethylene, polypropylene, polyvinyl chloride, acrylonitrile and butadiene (ABS).
- 34. A method as recited in claim 31, wherein said substrate is a glass.
- 35. A method as recited in claim 31, wherein said resistor precursor composition comprises glass particles.
- 36. A method as recited in claim 31, wherein said depositing step comprises applying said precursor composition using a doctor blade to force said precursor composition into said recessed feature.
- 37. A method as recited in claim 31, further comprising the step of modifying the surface of said recessed feature to modify the surface energy of said recessed feature.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. Provisional Patent Application No. 60/338,797 filed November 22, 2001 and U.S. Provisional Patent Application No. 60/327,621 filed October 5, 2001. The disclosure of each of these applications is incorporated herein by reference in its entirety.
Provisional Applications (2)
|
Number |
Date |
Country |
|
60338797 |
Nov 2001 |
US |
|
60327621 |
Oct 2001 |
US |