Claims
- 1. A method for connecting a vertically stacked plurality of primary integrated circuit packages, each primary integrated circuit package having a plurality of outer leads and having a plurality of sides, comprising:providing a substrate having a plurality of circuits thereon; providing a semi-continuous flexible tape of non-conductive polymeric material having a width to encompass the outer leads of each primary integrated circuit package of said stacked plurality of primary integrated circuit packages; forming a plurality of spaced transverse conductive buses on said non-conductive polymeric material, at least one conductive buses of said plurality of conductive buses having one end for connection to an electrically conductive pad of said substrate; connecting said at least one bus of said plurality of spaced transverse conductive buses to at least one lead of said outer leads of said stacked plurality of primary integrated circuit packages and to at least one circuit of said plurality of circuits of said substrate; providing a cage enclosing at least two sides of said plurality of sides of each primary integrated circuit package of said stacked plurality of primary integrated circuit packages; and attaching said cage to said substrate, said cage connecting at least one outer lead of said outer leads of said stacked plurality of primary integrated circuit packages to at least one conductive bus of said plurality of spaced transverse conductive buses.
- 2. The method of claim 1, wherein said flexible non-conductive polymeric material comprises polyimide.
- 3. The method of claim 1, wherein said at least one bus of said plurality of spaced transverse conductive buses comprises one of a round, a semi-round and a rectangular wire portion attached to said non-conductive polymeric material by a non-conductive polymeric adhesive.
- 4. The method of claim 1, wherein said at least one bus of said plurality of spaced transverse conductive buses comprises a wire portion having projections for locking attachment to said non-conductive polymeric material by a non-conductive polymeric adhesive.
- 5. The method of claim 1, wherein the width of said semi-continuous tape includes at least four primary packages.
- 6. The method of claim 1, further comprising:providing a cage enclosing more than at least two sides of said plurality of sides of each primary integrated circuit package of said stacked plurality of primary integrated circuit packages; and attaching said cage to said substrate, said cage connecting at least one outer lead of said outer leads of said stacked plurality of primary integrated circuit packages to at least one conductive bus of said plurality of spaced transverse conductive buses.
- 7. The method of claim 6, wherein a portion of said semi-continuous tape is located within said cage, and a portion of at least one conductive bus of said plurality of spaced transverse conductive buses contacts at least one outer lead of said outer leads of said stacked plurality of primary integrated circuit packages and at least one conductive bus of said plurality of spaced transverse conductive buses.
- 8. A method for connecting a vertically stacked plurality of primary integrated circuit packages, each primary integrated circuit package having a plurality of outer leads and having a plurality of sides, comprising:providing a substrate having a plurality of circuits thereon; providing a semi-continuous flexible tape of non-conductive polymeric material having a width to encompass the outer leads of each primary integrated circuit package of said stacked plurality of primary integrated circuit packages; forming a plurality of spaced transverse conductive buses on said non-conductive polymeric material, at least one conductive buses of said plurality of conductive buses having one end for connection to an electrically conductive pad of said substrate; connecting said at least one bus of said plurality of spaced transverse conductive buses to at least one lead of said outer leads of said stacked plurality of primary integrated circuit packages and to at least one circuit of said plurality of circuits of said substrate; providing a cage enclosing at least two sides of said plurality of sides of each primary integrated circuit package of said stacked plurality of primary integrated circuit packages; and attaching said cage to said substrate, said cage connecting at least one outer lead of said outer leads of said stacked plurality of primary integrated circuit packages to at least one conductive bus of said plurality of spaced transverse conductive buses.
- 9. A method for connecting a vertically stacked plurality of primary integrated circuit packages, each primary integrated circuit package having a plurality of outer leads and having a plurality of sides, comprising:providing a substrate having a plurality of circuits thereon; providing a semi-continuous flexible tape of non-conductive polymeric material having a width to encompass the outer leads of each primary integrated circuit package of said stacked plurality of primary integrated circuit packages; forming a plurality of spaced transverse conductive buses on said non-conductive polymeric material, at least one conductive buses of said plurality of conductive buses having one end for connection to an electrically conductive pad of said substrate; connecting said at least one bus of said plurality of spaced transverse conductive buses to at least one lead of said outer leads of said stacked plurality of primary integrated circuit packages and to at least one circuit of said plurality of circuits of said substrate; providing a cage enclosing at least two sides of said plurality of sides of each primary integrated circuit package of said stacked plurality of primary integrated circuit packages; and attaching said cage to said substrate, said cage connecting at least one outer lead of said outer leads of said stacked plurality of primary integrated circuit packages to at least one conductive bus of said plurality of spaced transverse conductive buses, a portion of said semi-continuous tape located within said cage.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation of application Ser. No. 09/349,522, filed Jul. 8, 1999, which is a continuation of application Ser. No. 09/138,372, filed Aug. 21, 1998, now U.S. Pat. No. 6,153,929, issued Nov. 28, 2000.
US Referenced Citations (45)
Foreign Referenced Citations (2)
Number |
Date |
Country |
4-243173 |
Aug 1992 |
JP |
6-061404 |
Mar 1994 |
JP |
Continuations (2)
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Number |
Date |
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Parent |
09/349522 |
Jul 1999 |
US |
Child |
09/792771 |
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US |
Parent |
09/138372 |
Aug 1998 |
US |
Child |
09/349522 |
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US |