Claims
- 1. A method for processing semiconductor wafers comprising:
providing a first load lock and a second load lock above the first load lock; providing a transport robot in a transport chamber; providing a processing chamber adjacent to the transport chamber; maintaining the transport chamber at a first pressure; providing an external robot outside of the transport chamber in an environment having a second pressure; adjusting the vertical position of the transport robot to select between the first load lock and the second load lock; removing at least one semiconductor wafer from the load lock selected by the transport robot and using the transport robot to transfer the semiconductor wafer to the processing chamber; and using the external robot to access the load lock that is not selected by the transport robot
- 2. The method of claim 1, wherein the step of removing at least one semiconductor wafer from the load lock selected by the transport robot further comprises removing at least two semiconductor wafers at a time from the load lock selected by the transport robot.
- 3. The method of claim 1, wherein the transport robot has a first arm and a second arm.
- 4. The method of claim 3, wherein the step of removing at least one semiconductor wafer from the load lock selected by the transport robot further comprises using the first arm to remove the at least one semiconductor wafer.
- 5. The method of claim 4, further comprising placing at least one semiconductor wafer in the load lock selected by the transport robot using the second arm.
- 6. The method of claim 3, wherein the step of removing at least one semiconductor wafer from the load lock selected by the transport robot further comprises removing at least two semiconductor wafers at a time using the first arm of the transport robot.
- 7. The method of claim 6, further comprising placing at least two semiconductor wafers at a time in the load lock selected by the transport robot using the second arm.
1. REFERENCE TO RELATED APPLICATIONS
[0001] The present application is a continuation of co-pending U.S. application Ser. No. 09/651,453, filed Aug. 30, 2000 which has been allowed and will issue Nov. 18, 2003 as U.S. Pat. No. 6,647,665, which is a divisional of U.S. Pat. No. 6,315,512, which claims priority from U.S. provisional application No. 60/067,299 filed Nov. 28, 1997, now abandoned. Provisional application No. 60/067,299 is hereby incorporated herein by reference in its entirety.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60067299 |
Nov 1997 |
US |
Divisions (1)
|
Number |
Date |
Country |
Parent |
09200660 |
Nov 1998 |
US |
Child |
09651453 |
Aug 2000 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09651453 |
Aug 2000 |
US |
Child |
10702998 |
Nov 2003 |
US |