Claims
- 1. A micro-dimensional coupling conductor, comprising:
- a first conductive material layer having a rectangularly shaped cross-section; and
- a second conductive material layer disposed on said first layer having a cross-sectional width that narrows as a function of distance from the interface between said first and second layers, wherein the cross-sectional width of said second layer is equal to the cross-sectional width of said first layer at the interface between said first and second layers.
- 2. The conductor of claim 1 wherein said first and second layer are made of a common material.
- 3. An electronic package, comprising:
- an electrical device,
- a housing for holding said electrical device,
- an external lead extending from said housing, and
- a coupling conductor for electrically connecting said electrical device to said external lead,
- said coupling conductor comprising a first conductive material layer having a rectangularly shaped cross-section and a second conductive material layer disposed on said first layer having a cross-sectional width that narrows as a function of distance form the interface between said first and second layers,
- wherein the cross-sectional width of said second layer is equal to the cross-sectional width of said first layer at the interface between said first and second layers.
- 4. The package of claim 3, wherein said first and second layers are made of a common material.
Parent Case Info
This is a division of application Ser. No. 08/448,903 filed May 24, 1995, now U.S. Pat. No. 5,663,095.
US Referenced Citations (3)
Non-Patent Literature Citations (1)
Entry |
D. V. Morgan and K. Board, An Introduction to Semiconductor Microtechnology (Second Edition), John Wiley & Sons, Chichester (1990), pp. 111-114. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
448903 |
May 1995 |
|