Claims
- 1. A process of depositing and simultaneously polishing and planarizing a high quality conductive layer on a surface of a substrate, comprising:
loading a substrate on a holder; applying electrical power to the surface of the said substrate; introducing a plating solution comprising an oxidizer on an abrasive polishing pad; pressing the abrasive polishing pad against the surface of said substrate; contacting the plating solution with the surface of the substrate and a second electrode; applying a potential difference between the surface of the substrate and the second electrode; depositing a conductive layer on the surface of the substrate; and moving the abrasive pad and the surface of the substrate with respect to each other, thereby simultaneously polishing and planarizing the conductive layer on said substrate.
- 2. A process according to claim 1, wherein the conductive layer comprises copper.
- 3. A process according to claim 1, wherein the plating solution comprises an acidic copper plating solution.
- 4. A process according to claim 3, wherein the acidic copper plating solution has a pH value of less than 4.
- 5. A process according to claim 1, wherein said oxidizer is selected from the group consisting of an inorganic oxidizer, an organic oxidizer, and mixtures thereof.
- 6. A process according to claim 5, wherein the oxidizer is an organic nitrite.
- 7. A process according to claim 6, wherein the nitrite is selected from the group consisting of alkyl nitrites, aromatic nitrites, and polyaromatic nitrites.
- 8. A process according to claim 7, wherein the organic nitrite is an alkyl nitrite.
- 9. A process according to claim 8, wherein the alkyl nitrite is butyl nitrite.
- 10. A process according to claim 1, wherein the oxidizer is an organic nitrate.
- 11. A process according to claim 1, wherein the substrate comprises surface features having a width of about 10-100 microns.
- 12. A modified plating solution for simultaneous polishing and planarization of a substrate, comprising:
a solvent; an ionic species of a conductive material; and an oxidizer.
- 13. A modified plating solution according to claim 12, wherein said oxidizer is selected from the group consisting of an inorganic oxidizer, an organic oxidizer, and mixtures thereof.
- 14. A modified plating solution according to claim 12, wherein said oxidizer is an organic nitrite selected from the group consisting of alkyl nitrites, aromatic nitrites, and polyaromatic nitrites.
- 15. A modified plating solution according to claim 12, wherein said solution has a pH value of less than 4.
- 16. A modified plating solution according to claim 12, wherein said oxidizer is present in an amount of more than 500 ppm.
- 17. A modified plating solution according to claim 12, wherein said oxidizer is present in an amount of 0.01 to 10 wt. % of said solution.
- 18. A modified plating solution according to claim 12, wherein said conductive metal is Cu.
- 19. A modified plating solution according to claim 12, wherein said conductive metal is selected from the group consisting of W, Au, Ni, Pt, Pd, Ag, Co, Sn, Pb and their alloys.
- 20. A modified plating solution according to claim 12, further comprising at least one additive selected from the group consisting of levelers, brighteners, grain refiners, wetting agents, and stress-reducing agents.
Parent Case Info
[0001] This application claims the priority of provisional application Ser. No. 60/182,100, filed Feb. 11, 2000, the entire disclosure of which is incorporated by reference herein. Reference is hereby made to related application Ser. No. 09/472,523, filed Dec. 27, 1999, entitled WORK PIECE CARRIER HEAD FOR PLATING AND POLISHING, and Ser. No. 09/511,278, filed Feb. 23, 2000, entitled PAD DESIGNS AND STRUCTURES FOR A VERSATILE MATERIALS PROCESSING APPARATUS.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60182100 |
Feb 2000 |
US |
Divisions (1)
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Number |
Date |
Country |
Parent |
09544558 |
Apr 2000 |
US |
Child |
10042244 |
Jan 2002 |
US |