Claims
- 1. An optical exposure apparatus for forming an image on a photosensitive substrate, the apparatus comprising:
a) an illumination optical system having a light source for generating a light beam; b) a reticle having a pattern, said reticle disposed adjacent said illumination optical system; c) a projection lens disposed adjacent said reticle and opposite said illumination optical system, and adjacent the photosensitive substrate; d) a predetermined space within said illumination optical system and said projection lens; e) an exposure optical path through said predetermined space; and f) a deflection member removably arranged in said predetermined space so as to cause a deflection of said exposure optical path to a deflected optical path that differs from said exposure optical path.
- 2. An optical exposure apparatus according to claim 1, wherein said deflection member includes a rotatable deflection prism removably disposed between said illumination optical system and said reticle.
- 3. An exposure optical apparatus for forming an image on a photosensitive substrate, the apparatus comprising:
a) an illumination optical system having a light source and a light beam; b) a reticle having a pattern, said reticle disposed adjacent said illumination optical system; c) a projection lens disposed adjacent said reticle and opposite said illumination optical system, and adjacent the photosensitive substrate; d) a predetermined space within said illumination optical system and said projection lens; e) an exposure optical path through said predetermined space; and f) one or more optical components movably mounted in said predetermined space so as to cause a deflection in said exposure optical path to an optical path that differs from said exposure optical path.
- 4. An optical exposure apparatus according to claim 3, wherein said one or more optical components includes rotatable mirrors arranged in said illumination optical system.
- 5. An optical exposure apparatus according to claim 3, wherein said one or more optical components includes moveable lenses arranged in said illumination optical system.
- 6. An optical exposure apparatus according to claim 1, further including a shutter removably arranged between said projection lens and said photosensitive substrate.
- 7. An optical exposure apparatus according to claim 6, wherein said shutter has a surface that is reflective.
- 8. An optical exposure apparatus according to claim 1, further including:
(a) a transmitted light detector that measures an intensity of said light beam when transmitted through said projection lens; and b) a stage for holding the photosensitive substrate, wherein said light detector is provided on said stage.
- 9. An optical exposure apparatus according to claim 7, further including a reflected light detector that measures an intensity of said light beam when reflected by said reflective surface, wherein said reflected light detector is provided in one of said exposure optical path and said deflected optical path.
- 10. An optical exposure apparatus according to claim 9, further including an incident light detector that measures an intensity of said light beam when impinging thereon from a light source side of said projection lens, wherein said incident light detector is provided in one of said exposure optical path and said deflection optical path, on said light source side of said projection lens.
- 11. A method of photo-cleaning an optical exposure apparatus for forming an image on a photosensitive substrate, the optical exposure apparatus having an illumination optical system and a projection lens, the method comprising the steps of:
a) forming an exposure optical path in a predetermined space within the illumination optical system and the projection lens; b) preventing the photosensitive substrate from being in said exposure optical path; and c) changing said exposure optical path to an optical path that differs from said exposure optical path.
- 12. A method of photo-cleaning according to claim 11, wherein said step b) is performed by inserting a shutter adjacent the photosensitive substrate.
- 13. A method of photo-cleaning the optical components in an optical exposure apparatus for forming an image on a photosensitive substrate, the method comprising the steps of:
a) forming an exposure optical path in a predetermined space within the optical components; b) preventing the photosensitive substrate from being in said exposure optical path; and c) altering the position of one or more of the optical components so as to change said exposure optical path to an optical path that differs from said exposure optical path.
- 14. A semiconductor device manufacturing method comprising the steps of:
a) forming an exposure optical path in a predetermined space within an illumination optical system and a projection lens; b) providing a reticle with a pattern in said exposure optical path; c) disposing a photosensitive substrate in the exposure optical path at a projection lens image plane and exposing said photosensitive substrate with an image of said reticle pattern; d) preventing the photosensitive substrate from being in said exposure optical path; and e) changing the exposure optical path to an optical path that differs from said exposure optical path.
- 15. A semiconductor device manufacturing method comprising the steps of:
a) forming an exposure optical path in a predetermined space within an illumination optical system and a projection lens, each having one or more optical components; b) providing a reticle with a pattern in said exposure optical path; c) disposing a photosensitive substrate in said exposure optical path at a projection lens image plane and exposing said photosensitive substrate with an image of said reticle pattern; d) preventing the photosensitive substrate from being in said exposure optical path; and e) altering the position of one or more of said optical components so as to change said exposure optical path to an optical path that differs from said exposure optical path.
- 16. An optical exposure apparatus for forming an image on a photosensitive substrate, the apparatus comprising:
a) an illumination optical system having a light source and a light beam; b) a reticle having a pattern disposed adjacent said illumination optical system; c) a projection lens disposed adjacent said reticle and opposite said illumination optical system, and adjacent the photosensitive substrate; d) a predetermined space within said illumination optical system and said projection lens; e) an optical exposure path through said predetermined space; and f) an optical path scanning system removably arranged in said predetermined space so as to cause a deflection in said exposure optical path to an optical path that differs from said exposure optical path.
- 17. A method of photo-cleaning an optical exposure apparatus for forming an image on a photosensitive substrate, the optical exposure apparatus having an illumination optical system and a projection lens, the method comprising the steps of:
a) forming an exposure optical path in a predetermined space within the illumination optical system and the projection lens; b) changing said exposure optical path to a second optical path that differs from said exposure optical path; and c) scanning said second optical path.
- 18. A semiconductor device manufacturing method comprising the steps of:
a) forming an exposure optical path in a predetermined space within an illumination optical system and a projection lens; b) changing said exposure optical path to a second optical path that differs from said exposure optical path; and c) scanning said second optical path.
- 19. An optical exposure apparatus for forming an image on a photosensitive substrate, the apparatus comprising:
a) an illumination optical system having a light source for forming an exposure light beam; b) a reticle having a pattern, said reticle disposed adjacent said illumination optical system; c) a projection lens disposed adjacent said reticle and opposite said illumination optical system, and adjacent the photosensitive substrate; d) a predetermined space within said illumination optical system and said projection lens; e) wherein said illumination optical system provides an exposure light beam through said predetermined space; and f) a light diffusing member removably arranged in said predetermined space so as to create a second light beam that is larger than said exposure light beam.
- 20. An optical exposure apparatus according to claim 19, further including apparatus for removing said reticle and replacing it with said light diffusing member.
- 21. An optical exposure apparatus according to claim 19, further including a shutter removably arranged between said projection lens and said photosensitive substrate.
- 22. An optical exposure apparatus according to claim 21, wherein said shutter has a surface facing said projection lens that is reflective.
- 23. An optical exposure apparatus according to claim 22, wherein said shutter is tiltably mounted so that said surface has a normal that is variable.
- 24. An optical exposure apparatus according to claim 19, further including:
a) a transmitted light detector that measures an intensity of said exposure light beam when transmitted through said projection lens, and b) a stage that holds the photosensitive substrate, wherein said transmitted light detector is provided on said stage.
- 25. An optical exposure apparatus according to claim 22, further including a reflected light detector that measures an intensity of one of said exposure light beam and said second light beam, wherein said reflected light detector is positioned to detect said one of said exposure light beam and said second light beam after reflection from said reflective surface .
- 26. An optical exposure apparatus according to claim 25, further including an incident light detector that measures an intensity of said exposure light beam when impinging thereon from a light source side of said projection lens is provided in one of said exposure optical path and said deflection optical path, on said light source side of said projection lens.
- 27. A method of photo-cleaning an optical exposure apparatus for forming an image on a photosensitive substrate, the optical exposure apparatus having an illumination optical system and a projection lens, the method comprising the steps of:
a) forming an exposure light beam in a predetermined space within the illumination optical system and the projection lens; b) preventing the photosensitive substrate from being in said exposure light beam; and c) changing said exposure light beam size to create a second light beam that is larger in size than said exposure light beam.
- 28. A method of photo-cleaning an optical exposure apparatus for forming an image on a photosensitive substrate, the optical exposure apparatus having an illumination optical system and a projection lens, the method comprising the steps of:
a) forming an exposure light beam in a predetermined space within the illumination optical system and the projection lens; and b) changing said exposure light beam to a second optical path that is larger in size than said exposure light beam.
- 29. A semiconductor device manufacturing method comprising the steps of:
a) forming an exposure light beam in a predetermined space within an illumination optical system and a projection lens; b) exposing a photosensitive substrate; and c) changing the exposure optical path to a second optical path that differs from said exposure optical path.
- 30. An optical exposure apparatus comprising:
a) a light source having a predetermined wavelength; b) an optical system having a plurality of optical elements; c) a measuring system for measuring one of (i) transmittance and (ii) reflectance of at least one of said plurality of optical elements; d) a photo-cleaning unit for increasing one of (i) said transmittance and (ii) said reflectance of said at least one of said plurality of optical elements; and e) a control system connected to said photo-cleaning unit and said measuring system.
- 31. An optical exposure apparatus according to claim 30, wherein said optical system includes an illumination optical system.
- 32. A method of forming a reticle pattern on a photosensitive substrate with an optical system having a plurality of elements, the method comprising:
a) measuring one of (i) transmittance and (ii) reflectance of at least one of the plurality of optical elements; b) increasing said one of (i) said transmittance and (ii) said reflectance; and c) exposing the reticle pattern onto the photosensitive substrate using the optical system.
- 33. A method according to claim 32, further including the step of determining whether at least one of said step b) and said step c) is carried out, based on said step a).
- 34. A method of fabricating semiconductor devices comprising the steps of:
a) providing an optical system having a plurality of elements, including a reticle with a pattern; b) measuring on of (i) transmittance and (ii) reflectance of at least one of said plurality of optical elements; c) increasing said one of (i) said transmittance and (ii) said reflectance; and d) exposing said reticle pattern onto a photosensitive substrate using said optical system.
- 35. A method according to claim 34, further including the step of determining whether at least one of said step c) and step d)is carried out or step d) is carried out, based on said step b).
- 36. An optical exposure apparatus comprising:
a) a light source emitting light of a predetermined wavelength; b) an optical system comprising a plurality of optical elements, said optical system disposed adjacent said light source; and c) a photo-cleaning unit disposed between said light source and said optical system for improving of (i) transmittance and (ii) reflectance of at least one of said plurality of optical elements.
- 37. An optical exposure apparatus according to claim 36, wherein said optical system includes an illumination optical system and a projection lens.
- 38. A projection exposure apparatus comprising:
a) an illumination optical system having a light source, a light beam, a variable aperture for controlling a numerical aperture if said illumination optical system, and an illumination optical system transmittance; b) a reticle having a pattern, said reticle disposed adjacent said illumination optical system; c) a projection lens, disposed adjacent said reticle and opposite said illumination optical system, and adjacent the photosensitive substrate, and having a projection lens transmittance; d) a transmittance measurement system for measuring at least one of said illumination optical system transmittance and said projection lens transmittance; and e) a control system connected to said transmittance measurement system and said variable aperture for changing said variable aperture so as to change said numerical aperture.
- 39. A projection exposure apparatus according to claim 38, wherein said illumination optical system has a numerical aperture NAI, said projection lens has a numerical aperture NAP and which satisfies the condition
- 40. A method of exposing a pattern on a reticle onto a plurality of photosensitive substrates using an optical exposure apparatus having an illumination optical system that generates light, and a projection lens, the method comprising the steps of:
a) performing n (n≧0) exposures of one of the plurality of photosensitive substrates by illuminating the pattern on the reticle with the light from the illumination optical system and projecting an image of the pattern with the projection lens having an optimum transmittance onto one of the plurality of photosensitive substrates; and b) after performing n exposures but before performing an n+1 exposure, irradiating said projection lens with the light from the illumination optical system so as to restore said optimum transmittance of said projection lens.
- 41. A method according to claim 40, further including the step of:
c) controlling the illumination optical system so that it has a numerical aperture NAI2 in said step b) during said irradiating process, and a numerical aperture NAI1 in said step a) while performing said n exposures, and so that: NAI1≧NAI2.
- 42. A method according to claim 41, wherein said projection lens has a numerical aperture NAP, further wherein in said step c) said controlling is performed so that:
- 43. A semiconductor manufacturing method of exposing a pattern on a reticle onto a plurality of photosensitive substrates, the optical exposure apparatus having an illumination optical system that generates light, and a projection lens, the method comprising the steps of:
a) performing n (n≧0) exposures of one of the plurality of photosensitive substrates by illuminating the pattern on the reticle with the light from the illumination optical system and projecting an image of the pattern with the projection lens having an optimum transmittance onto the photosensitive substrate; and b) after performing n exposures but before performing an n+1 exposure, irradiating said projection lens with the light from the illumination optical system so as to restore said optimum transmittance of said projection lens.
- 44. A semiconductor manufacturing method according to claim 43, further including the step of:
c) controlling the illumination optical system so that it has a numerical aperture NAI2 in said step b) during said irradiating process, and a numerical aperture NAI1 in said step a) while performing said n exposures, so that: NAI1≧NAI2.
- 45. A semiconductor manufacturing method according to claim 44, wherein said projection lens has a numerical aperture NAP, further wherein in said step c) said controlling is performed so that:
- 46. A semiconductor manufacturing method according to claim 43, wherein said projection lens has a plurality of optical components with a plurality of spaces there between, and said irradiating process in step b) further includes the step of injecting an inert gas into said projection lens into said plurality of spaces, and then discharging said inert gas from said plurality of spaces.
- 47. A semiconductor manufacturing method according to claim 43, wherein said step of injecting an inert gas includes introducing an active gas into said inert gas, and said step of discharging said inert gas includes discharging said active gas.
- 48. A projection lens manufacturing method comprising the steps of:
a) assembling a projection lens so as to be suitable for patterning a photosensitive substrate at an exposure wavelength at a projection lens transmittance; and b) irradiating the projection lens with light of said exposure wavelength so as to increase said projection lens transmittance.
- 49. A projection lens manufacturing method according to claim 48, wherein said exposure wavelength is less than 200 nanometers.
- 50. A projection lens manufacturing method according to claim 48, wherein said projection lens has a plurality of optical components with a plurality of spaces there between, and said photo-cleaning process in step b) further includes the step of injecting an inert gas into said projection lens into said plurality of spaces, and then discharging said inert gas from said plurality of spaces.
- 51. A projection lens manufacturing method according to claim 48, wherein said step of injecting an inert gas includes introducing an active gas into said inert gas, and said step of discharging said inert gas includes discharging said active gas.
- 52. A projection lens manufacturing method according to claim 48, wherein the projection lens has a numerical aperture NAP, and in said step b), said irradiating is performed using an illumination optical system having a numerical aperture NAI1, wherein
- 53. A photo-cleaning apparatus for use with an optical exposure apparatus having optical components with an exposure optical path, the apparatus comprising:
a) a light deflector capable of deflecting light from the exposure optical path to portions of the optical components not traversed by the exposure optical path; and b) a control system connected to said light deflector for controlling operation of said light deflector so as to achieve such deflection of light from the exposure optical path.
- 54. A photo-cleaning apparatus according to claim 53, wherein said light deflector is one chosen from the group consisting of: rotating prism, diffusion plate, movable refractive optical element, and movable reflective optical element.
- 55. An optical exposure apparatus comprising:
a) a light source supplying light of a predetermined wavelength and light energy; b) an exposure optical system disposed in a predetermined position where the light is received so as to illuminate a mask having a predetermined pattern with the light and expose the pattern on the mask onto a substrate, said exposure optical system comprising a plurality of optical elements; and c) a measuring unit for measuring a change in said light energy passing through at least one of said plurality of optical elements; and a compensating unit for compensating said change in light energy.
- 56. A method of photo-cleaning a projection lens having an object plane, comprising:
a) providing an illumination light beam along an optical axis; b) providing and inserting a photo-cleaning optical member having refractive power into said illumination light beam; and c) refracting said illumination light beam with said photo-cleaning optical member so as to illuminate lens surfaces of one or more lenses included in the projection lens so as to photo-clean said lens surfaces.
- 57. A photo-cleaning method according to claim 56, wherein:
a) said providing and inserting step b) includes providing one of a positive lens and negative lens having a focal length f as said photo-cleaning optical member and inserting said one of a positive lens and a negative lens at the object plane, said focal length satisfying the equation: |f|≦d/[tan{sin−1(NAP)}−tan{sin−1(NAI)}]wherein NAI is a numerical aperture of said illumination light beam, NAP is a numerical aperture of the projection lens, and d is a distance between said optical axis and an illumination beam principal ray farthest from said optical axis as measured at the object plane.
- 58. An optical exposure apparatus capable of imaging a pattern present on a mask onto a photosensitive substrate, the apparatus comprising:
a) an illumination optical system with a light source for generating a light beam; b) a projection lens having an object plane and disposed adjacent said illumination optical system; and c) a photo-cleaning optical member removably provided between said illumination optical system and said projection lens and within said light beam so as to refract said light beam to impinge said projection lens.
- 59. An optical exposure apparatus according to claim 58, wherein said photo-cleaning optical member comprises one of a positive lens and a negative lens arranged at said object plane, said optical member having a focal length f satisfying the condition:
- 60. An optical exposure apparatus according to claim 58, further including:
a) a first detector for measuring a first quantity of light in said light beam impinging said projection lens; b) a second detector for measuring a second quantity of light in said light beam exiting from said projection lens; c) transmittance calculating means for calculating a transmittance of said projection lens based on said first and second quantity of light measurements: and d) controlling means operatively engaged with said photo-cleaning optical member for controlling insertion and removal of said photo-cleaning optical member based on said transmittance.
- 61. An optical exposure apparatus according to claim 58, further including a support apparatus for selectively arranging one of the mask and said photo-cleaning optical member at said object plane.
- 62. An optical exposure apparatus capable of imaging a pattern present on a mask onto a photosensitive substrate, the apparatus comprising:
a) an illumination optical system having a numerical aperture NAI and a light source for generating a light beam along an optical axis; b) a projection lens arranged adjacent said illumination optical system and having a numerical aperture NAP and an object plane; c) a photo-cleaning optical member comprising one of a positive lens and a negative lens capable of being removably arranged in said object plane and having a focal length f satisfying the condition |f|≦d/[tan{sin−1(NAP)}−tan{sin−1(NAI)}]wherein d is a distance between said optical axis and an illumination beam principal ray farthest from said optical axis as measured at said object plane; and d) a lens moving apparatus for selectively arranging one of said one of a positive lens and a negative lens and the mask at said object plane.
- 63. A method of photo-cleaning an optical exposure apparatus having a projection lens with a plurality of lens surfaces and capable of forming an image of a mask having a pattern on a photosensitive substrate with an exposure light beam from an exposure light source, the method comprising the steps of:
a) providing a photo-cleaning light beam from a photo-cleaning light source; and b) irradiating the plurality of lens surfaces with said photo-cleaning light beam prior to the exposing the mask with the exposure light beam.
- 64. A method of photo-cleaning according to claim 63, wherein said photo-cleaning light source is said exposure light source.
- 65. A photo-cleaning method according to claim 63, wherein said irradiating step b) further includes:
a) providing and inserting an optical member having refractive power between the projection lens and the exposure light source and within said photo-cleaning light beam; and b) refracting said photo-cleaning light beam so as to irradiate the plurality of lens surfaces.
- 66. A photo-cleaning method according to claim 63, further including the steps, after said irradiating step b), of:
a) measuring a transmittance value of the projection lens; and b) ceasing said irradiating of the plurality of lens surfaces when said measured transmittance value of said projection lens exceeds a predetermined transmittance value.
- 67. A method of exposing a photosensitive substrate with an optical exposure apparatus having an illumination system for providing exposure light and a projection lens with an object plane and a plurality of lens surfaces, the method comprising the steps of:
a) storing, in a storage unit, a time-varying exposure light transmittance characteristic of the projection lens; b) providing and inserting into the object plane a mask having a pattern; c) exposing said mask with a first amount of exposure light from the illumination optical system, thereby providing a second amount of exposure light exiting the projection lens; d) determining an exposure light transmittance of the projection lens by comparing said first and second amounts of exposure light; and e) controlling said second amount of exposure light exiting the projection lens and incident the photosensitive substrate by varying said first amount of exposure light based on said measured exposure light transmittance and said stored time-varying exposure light transmittance characteristic.
- 68. An exposure method according to claim 67, further including the steps of:
a) determining a non-uniformity in said second amount of exposure light based on said determined transmittance in said step d) and comparing said non-uniformity to a predetermined value; b) ceasing said exposing of said mask in said step c) when said determined non-uniformity exceeds said predetermined value; c) providing and inserting a photo-cleaning optical member in place of said mask; and d) photo-cleaning the plurality of lens surfaces in the projection lens by refracting the exposure light to impinge the plurality of lens surfaces.
- 69. An optical exposure apparatus for exposing a mask having a pattern onto a photosensitive substrate, the apparatus comprising:
a) illumination means for generating an exposure light beam for exposing the mask; b) projection means for projecting the mask pattern, when the mask is exposed by said exposure light beam, onto the photosensitive substrate, said projection means including a plurality of lens surfaces; c) a photo-cleaning optical member capable of being removably provided between said illumination means and said projection means in place of the mask so as to refract said exposure light beam through said plurality of lens surfaces; d) detection means for detecting a transmittance of said projection means; e) calculating means for calculating a non-uniformity in said exposure light beam upon passing through said projection means, based on said transmittance detected by said detection means; f) storage means for storing a time-varying exposure light transmittance characteristic of said projection means; and g) control means for controlling a cumulative amount of exposure light incident the photosensitive substrate, based on said transmittance detected by said detection means and said time-varying exposure light transmittance characteristic, and for removably providing said photo-cleaning optical member between said illumination means and said projection means for performing photo-cleaning of said plurality of lens surfaces when said exposure light beam non-uniformity exceeds a predetermined value.
Priority Claims (4)
Number |
Date |
Country |
Kind |
09-106487 |
Apr 1997 |
JP |
|
09-155855 |
May 1997 |
JP |
|
09-155856 |
May 1997 |
JP |
|
09-334470 |
Dec 1997 |
JP |
|
Parent Case Info
[0001] This is a continuation-in-part of application Ser. No. 09/064,335, filed Apr. 22, 1998.
Divisions (1)
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Number |
Date |
Country |
Parent |
09195880 |
Nov 1998 |
US |
Child |
09870718 |
Jun 2001 |
US |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09064335 |
Apr 1998 |
US |
Child |
09195880 |
Nov 1998 |
US |