Claims
- 1. A plasma reactor for processing a workpiece, said reactor comprising:a reactor enclosure defining a processing chamber; a base within said chamber for supporting said workpiece during processing thereof; a semiconductor window electrode overlying said base; a gas inlet system for admitting a plasma precursor gas into said chamber; an electrical terminal coupled to said semiconductor window electrode; an inductive antenna adjacent one side of said semiconductor window electrode opposite said base for coupling power into the interior of said chamber through said semiconductor window electrode.
- 2. The plasma reactor of claim 1 wherein said workpiece is a planar substrate, said semiconductor window electrode comprises a ceiling portion of said reactor enclosure generally parallel to and overlying said planar substrate, and said inductive antenna overlies said ceiling portion and faces said planar substrate through said semiconductor window electrode.
- 3. The plasma reactor of claim 1 wherein said semiconductor workpiece is a planar substrate, said semiconductor window electrode comprises a sidewall portion of said reactor enclosure generally perpendicular to and surrounding a periphery of said substrate and said inductive antenna is adjacent said sidewall portion.
- 4. The plasma reactor of claim 2 wherein said inductive antenna overlying said ceiling portion comprises an arcuately extending elongate conductor disposed generally parallel to the plane of said planar substrate.
- 5. The plasma reactor of claim 4 wherein said inductive antenna is planar.
- 6. The plasma reactor of claim 4 wherein said inductive antenna is dome-shaped.
- 7. The plasma reactor of claim 3 wherein said inductive antenna adjacent said sidewall portion comprises a conductive coil wound around said sidewall portion.
- 8. The plasma reactor of claim 2 further comprising a bias RF power source coupled to said substrate, said electrical terminal of said semiconductor window electrode being connected so as to enable said semiconductor window electrode to be a counter electrode to the bias RF power source coupled to said substrate.
- 9. The plasma reactor of claim 8 wherein said electrical terminal of said semiconductor window electrode is connected to ground to provide a ground plane parallel to and over said planar substrate.
- 10. The reactor of claim 2 further comprising a power splitter having one output coupled to said semiconductor window electrode and another output coupled to said substrate and an input for receiving power from a common source.
- 11. The reactor of claim 2 further comprising a first power source coupled to said semiconductor window electrode and a second power source coupled to said planar substrate.
- 12. The reactor of claim 2 wherein said inductive antenna comprises an inner antenna portion overlying a center of said planar substrate and an outer antenna portion overlying a periphery of said planar substrate and electrically separated from said inner antenna portion said reactor further comprising:a first power source node coupled to said inner antenna portion; and a second power source node coupled to said outer antenna portion.
- 13. The reactor of claim 2 further comprising a power splitter having one output coupled to said semiconductor window electrode and another output coupled to said inductive antenna and an input for receiving power from a common source.
- 14. The reactor of claim 2 further comprising a power splitter having one output coupled to said planar substrate and another output coupled to said inductive antenna and an input for receiving power from a common source.
- 15. The plasma reactor of claim 3 further comprising a bias RF power source coupled to said planar substrate, said electrical terminal of said semiconductor electrode being connected so as to enable said semiconductor window electrode to be a counter electrode to the bias RF power source coupled to said planar substrate.
- 16. The reactor of claim 3 further comprising a power splitter having one output coupled to said semiconductor window electrode and another output coupled to said planar substrate and an input for receiving power from a common source.
- 17. The reactor of claim 3 further comprising a power splitter having one output coupled to said semiconductor window electrode and another output coupled to said inductive antenna and an input for receiving power from a common source.
- 18. The reactor of claim 3 further comprising a power splitter having one output coupled to said planar substrate and another output coupled to said inductive antenna and an input for receiving power from a common source.
- 19. The reactor of claim 2 further comprising:a side semiconductor window electrode plate comprising a sidewall portion of said reactor enclosure generally perpendicular to and surrounding a periphery of said substrate; and a side inductive antenna element adjacent said sidewall portion.
- 20. The reactor of claim 1 wherein:said inductive antenna is outside said chamber; and said semiconductor window electrode comprises a ceiling portion of said reactor enclosure.
- 21. The reactor of claim 1 wherein:said reactor enclosure comprises a ceiling portion overlying said base; said semiconductor window electrode is inside said chamber under said ceiling portion; and said inductive antenna is inside said chamber on a side of said semiconductor window electrode opposite said base.
Parent Case Info
This is a continuation, division, continuation -in-part, of application Ser. No. 08/521,668, filed Aug. 31, 1995, now abandoned.
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Continuations (1)
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Number |
Date |
Country |
Parent |
08/521668 |
Aug 1995 |
US |
Child |
08/936028 |
|
US |