Patent Application
20100015409
The present invention relates to a method and apparatus for photoimaging. More particularly, the present invention relates to a method and apparatus for photoimaging a substrate covered with a wet curable photopolymer, wherein the photoimaged substrate is used to form images such as electrical circuits.
Although prior techniques exist in the art for producing thin lines suitable for forming PCBs, many of these techniques suffer from a number of significant disadvantages. For example, many previous techniques suffer from poor resolution. Moreover, techniques which do provide high resolution usually require complex apparatus such as sophisticated laser equipment. A further problem is that previous techniques have required the use of partially cured dry films of photopolymer which are usually supported on a polyester (e.g. Mylar) film. The thickness of these dry films has a detrimental effect on the resolution and/or definition of photoimaged surfaces as this allows unwanted undercutting (i.e. light shadowing) to occur during the photoimaging process. There are also problems in adhering partially cured dry films to substrates and contamination problems which once again causes problems in the photoimaging process. Partially cured dry films are also expensive when used in large quantities. Such systems are described in U.S. Pat. No. 4,888,270 and U.S. Pat. No. 4,954,421, which are incorporated herein by reference.
It is an object of at least one aspect of the present invention to obviate or mitigate at least one or more of the aforementioned problems.
It is a further object of at least one aspect of the present invention to provide an improved method for photoimaging surfaces.
It is a yet further object of at least one aspect of the present invention to provide a cost efficient method for producing electrical circuits with high resolution and small track widths (i.e. fine lines).
It is a further object of at least one aspect of the present invention to provide a cost efficient method for producing high density electrical circuits suitable for PCBs.
It is a further object of at least one aspect of the present invention to provide an improved method for photoimaging surfaces with high resolution and small track widths over a large area.
It is a further object of at least one aspect of the present invention to provide a method for imaging an ink jet deposit of conductive material.
According to a first aspect of the present invention there is provided a method for photoimaging a substrate, said method comprising:
providing a substrate with a cladding;
depositing a liquid photoresist polymer on at least part of the cladding to form a film of photoresist polymer with a thickness of less than about 178 μm (0.007 inch);
positioning a phototool onto the liquid photoresist polymer; and
applying radiation to the liquid photoresist polymer to cure the photoresist layer in exposed areas through the phototool.
The present invention therefore relates to a method of photoimaging a substrate covered with a wet curable photopolymer, wherein the photoimaged substrate may be used to form electrical circuits such as PCBs and flat panel displays. The present invention may also relate to forming dielectric images on dielectrics.
The cladding may be made from or comprises any appropriate material or composite and may, for example, be metallic or non-metallic. In particular embodiments, there may therefore be metallic cladding and in alternative embodiments there may be non-metallic cladding.
The cladding may extend at least partially around or fully around the substrate. Alternatively, the substrate may comprise a first and second side and the cladding may extend over one or both of the first and second sides of the substrate. The substrate may therefore be laminated with the cladding over one or both of the first and second sides of the substrate. The cladding may be in the form of a film or layer which is attached and/or adhered to the substrate.
Typically, the metal cladding may comprise or consist of conductive material. The substrate which may, for example, be a dielectric material which may therefore be fully or at least substantially encapsulated by the metal cladding. The metal cladding may comprise or consist of conducting material such as any suitable metal material. Suitable metals may, for example, be copper, silver, gold and the like.
In embodiments where the cladding is non-metallic, the cladding may comprise or consist of dielectric material.
The substrate with the cladding may be substantially flat and may range in size up to about 1 m×1 m. The present invention has the advantage in that there is, in effect, no size limitation on the substrate apart from the apparatus actually performing the photoimaging process.
The liquid photoresist polymer is in a wet form. The physical properties of the liquid photoresist polymer may be matched to the required curing properties.
Typically, the liquid photoresist polymer may be deposited with a thickness of less than about 150 μm, 125 μm, 100 μm, 75 μm, 50 μm, 25 μm, 10 μm, 5 μm, 1 μm, 0.5 μm or 0.1 μm. Alternatively, the liquid photoresist polymer may be deposited with a thickness ranging from about 177 μm to about 0.1 μm, about 125 μm to about 0.1 μm, about 100 μm to about 0.1 μm, about 75 μm to about 0.1 μm, about 50 μm to about 0.1 μm, about 25 μm to about 0.1 μm or about 10 μm to about 0.1 μm. Preferably, the liquid photoresist polymer may have a thickness of about 5 μm.
The liquid photoresist polymer may be applied to both the first and second sides of the substrate wherein both the first and second sides of the substrate comprise cladding.
The liquid photoresist polymer may be deposited in a substantially even and continuous manner using any suitable technique. For example, the liquid photoresist layer may be deposited using a spray, a brush and/or a roller system.
Prior to application of the liquid photoresist polymer, the substrate comprising the cladding may be cleaned using a contact cleaning process to remove debris and/or contamination from the surface of the cladding.
Once the liquid photoresist polymer has been applied to the substrate with the cladding, the phototool may be positioned onto the substrate. A compressive force may then be applied to the deposited liquid photoresist polymer. By applying a compressive force, the liquid photoresist polymer may be spread out and/or squeezed so that a substantially even, continuous film of photoresist may be achieved with a substantially even thickness. In particular embodiments, a roller based system may be used to apply a compressive rolling force and may therefore be used to spread the liquid photoresist polymer. Typically, a rubber cylindrical roller may be rolled over the phototool which applies the compressive to the liquid photoresist polymer. The spreading out and/or squeezing may occur on both sides of the substrate at substantially the same time. A particular function of the spreading out and/or squeezing is that this helps to ensure that no air and therefore oxygen is trapped underneath the liquid photoresist polymer. This overcomes the need to have complex light systems and also provides significant improvements to the speed of the process as trapped oxygen slows down the photoimaging (i.e. curing) process.
A phototool is used in the photoimaging process. The phototool may be a negative or positive image of desired electrical circuitry and may allow light to pass through some parts of the phototool but not others. The phototool may be made from flexible plastics material and may be connected to a mechanism which correctly positions the phototool on the substrate on at least one or both sides of the substrate. The phototool may be tensioned and wound around rollers. In particular embodiments, the phototool may also comprise a protective layer which may facilitate the phototool being peeled off the substrate after the imaging has taken place. The protective layer may be any suitable non-stick material.
The radiation used may be any suitable radiation which cures the liquid photoresist polymer. In particular embodiments, UV radiation may be used to polymerise and/or harden and/or set the exposed liquid photoresist polymer. The UV radiation may have a wavelength of about 200-400 nm and may have an intensity matched to cure the photopolymer being used. A particularly preferred UV light source may be UV LEDs as they produce very small amounts of heat, have a long lamp life, start up immediately, have substantially no fall-off in power output, are low maintenance and can produce high levels of light intensity. LEDs may therefore be used to print fine lines in an inexpensive photoimaging process according to the present invention. An alternative light source may be a laser light source.
In particular embodiments of the present invention, the radiation may be collimated to improve the quality and/or resolution and/or definition of the photoimaging process.
At least one or both phototools may be accurately lined up using a registration system on one or both sides of the substrate. The substrate may be positioned substantially vertically as at least one or both phototools are applied.
The photoimaging apparatus of the present invention may be used to process about one panel of substrate about every ten seconds.
After applying the radiation of the photoimaging process, liquid photoresist polymer which has not been exposed to radiation may be removed using standard wash off processes.
The method of the present invention may also be self-contained in a mini-clean room which therefore provides significant cost savings in the photoimaging process as large industrial clean rooms are not required.
Using the method as described in the present invention, high definition fine lines suitable for electrical circuitry may be obtained. The fine lines may be less than about 70 μm, 60 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm or 5 μm. The fine lines may be used in PCBs and other electrical components such as flat screen displays.
The method of the present invention may have the added advantage in that all steps may occur in a single pass through apparatus according to the present invention. For example, the depositing of a liquid photoresist polymer on at least one or both sides of the substrate, the positioning of phototool(s) over the liquid photoresist polymer on at least one or both sides of the substrate, the application of a compressive force to the deposited liquid photoresist polymer to form a film of photoresist polymer, and the application of radiation to the liquid photoresist polymer to cure the photoresist layer may all occur in a single pass through photoimaging apparatus of the present invention. This therefore increases the throughput of photoimaged substrates through the apparatus.
According to a second aspect of the present invention there is provided photoimaged circuits formed according to the first aspect.
Typically, the photoimaged circuits are electrical circuits which may be used in the manufacture of, for example, PCBs and flat panel displays.
According to a third aspect of the present invention there is provided dielectric images on dielectrics formed according to the first aspect.
According to a fourth aspect of the present invention there is provided apparatus for photoimaging a substrate, said apparatus comprising:
at least one phototool capable of being positioned onto a liquid photoresist polymer on at least one side of a substrate with a cladding;
a roller capable of applying a compressive force to the liquid photoresist polymer on the substrate with the cladding to form a film of photoresist polymer with a thickness of less than about 178 μm (0.007 inch); and
a radiation source capable of curing the liquid photoresist polymer.
The cladding may be made from or comprises any appropriate material or composite and may, for example, be metallic or non-metallic.
The apparatus may be used to form fine lines of less than about 70 μm, 60 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm or 5 μm. The fine lines may be used in PCBs and other electrical components such as flat screen displays.
Typically, the compressive force may be applied onto at least one or both phototools whereupon the phototool(s) applies the compressive force to the liquid photoresist polymer.
The apparatus may also comprise collimating means to collimate radiation emitting from the radiation source.
In particular embodiments, the radiation source may comprise LEDs and/or a laser light source. Preferably, the radiation source may be capable of emitting UV radiation.
The apparatus may also comprise positioning means to locate the at least one phototool on the substrate.
According to a fifth aspect of the present invention there is provided a method for producing tracks and/or electrical circuitry on a substrate, said method comprising:
providing a substrate;
providing ink jet deposits on at least one side of the substrate, said ink jet deposits comprising conductive particles;
depositing a liquid photoresist polymer on at least one side of the substrate comprising the ink jet deposits;
positioning a phototool onto the liquid photoresist polymer on at least one side of the substrate;
applying a compressive force to the deposited liquid photoresist polymer to form a film of photoresist polymer with a thickness less than about 178 μm (0.007 inch); and
applying radiation to the liquid photoresist polymer to cure the photoresist layer in exposed areas through the phototool.
Typically, the ink jet deposits may comprise conductive particles such as silver, gold and/or copper.
The ink jet deposits may have a width of about 50 μm-500 μm or typically about 100 μm. The ink jet deposits may therefore be modified using the photoimaging concept described in the present invention. For example, the ink jet deposits may be formed on a substrate of, for example, a plastics sheeting. The ink jet deposits may form an approximate required track on the plastics sheeting. Typically, at least one or multiple tracks may then be formed within the ink jet deposits using the photoimaging concept described in the present invention.
Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings in which:
a and 4b are representations of an alternative photoimaging process according to a further embodiment of the present invention.
The photoresist layer 114 is first of all deposited in a substantially even and continuous or at least substantially continuous manner using any suitable technique onto the laminated structure 100. For example, the photoresist layer 114 is applied using a spray, a brush and/or a roller system.
Once the photoresist layer 114 has been applied to the laminated structure 100, a phototool 116 is applied to the photoresist layer 114. The phototool 116 is a negative (or positive) image of a desired electrical circuitry and allows light to pass through some parts of the phototool 116 but not others. The phototool is made from flexible plastics material.
As shown in
Although not shown, a registration system is used to accurately line up the phototools 116 on both sides of the laminate structure.
The photoimaging apparatus can be used to process about one panel of laminated structure 100 every ten seconds. Once the photoimaging has occurred, the phototools 116 are removed from the laminated structure 100 using any suitable mechanical means. The photoimaging process is extremely quick as no air and oxygen is trapped under the liquid photoresist layer 114. This therefore provides a drying time of less than about 5 seconds or preferably less than 1 second for the photoresist layer 114.
After the photoimaging process, liquid photoresist 114 which has not been exposed to UV radiation is removed using, for example, an aqueous alkali solution via a washing procedure. A standard chemical etching process may then be used. For example, acid or alkali may be used to produce a dielectric substrate containing the required metal (e.g. copper) circuitry covered by polymerised photoresist. The polymerised photoresist can then be removed to yield a substrate with the required electrical conductive circuitry.
The apparatus as described in the present invention can also be fully contained in a mini-clean room which therefore provides significant cost savings in the photoimaging process.
Using the method as described in the present invention high definition fine lines suitable for electrical circuitry are obtained. The fine lines obtained are less than about 70 μm, 60 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm or 5 μm. The fine lines are used in PCBs and other electrical components such as flat screen displays.
Whilst specific embodiments of the present invention have been described above, it will be appreciated that departures from the described embodiments may still fall within the scope of the present invention. For example, any suitable type of substrate may be used. The cladding may also be metallic or non-metallic. Moreover, any suitable liquid photoresist polymer or combinations thereof may be used. Any mechanical means may also be used to apply a compressive force to the deposited liquid photoresist polymer to form a thin film of material with no trapped air and oxygen underneath. The radiation used may be of any appropriate wavelength which is capable of curing the liquid photoresist polymer.
| Number | Date | Country | Kind |
|---|---|---|---|
| 0813196.3 | Jul 2008 | GB | national |
