Claims
- 1. A method comprising:attaching a processor carrier to a motherboard by moving said processor carrier onto said motherboard in a direction having a component transverse to the surface of said motherboard; securing a DC-to-DC converter to the processor carrier in a direction having a component transverse to the surface of said motherboard; and resiliently clamping said converter and said carrier.
- 2. The method of claim 1 further including aligning said processor carrier and said converter using at least two alignment pins.
- 3. The method of claim 1 including providing substantially planar power and ground contacts on each one of said processor carrier and said converter.
- 4. The method of claim 3 including arranging said substantially planar power and ground contacts substantially parallel to the surface of said motherboard.
- 5. The method of claim 1 including sandwiching a resilient interconnect between said carrier and said converter, and causing electrical continuity to be maintained through said interconnect.
- 6. The method of claim 5 including forming conductive polymer contacts in said interconnect.
- 7. The method of claim 1 wherein resiliently clamping said converter and said carrier includes clamping a housing having a compression spring formed therein onto said converter.
- 8. The method of claim 6 including aligning contacts formed in said interconnect with contacts on said converter and said carrier.
- 9. The method of claim 8 including compressing said contacts between said carrier and said converter.
- 10. The method of claim 6 including aligning said interconnect to said carrier.
Parent Case Info
This is a division of prior application Ser. No. 09/676,238 filed Sep. 29, 2000 now U.S. Pat. No. 6,392,899.
Foreign Referenced Citations (3)
Number |
Date |
Country |
61-157932 |
Jul 1986 |
JP |
08-339242 |
Dec 1996 |
JP |
10-222255 |
Aug 1998 |
JP |