Claims
- 1. A method of increasing the fatigue life of solder interconnections between a semiconductor device and a supporting substrate comprising attaching said device to said substrate by a plurality of solder connections that extend from the supporting substrate to electrodes on said semiconductor device to form a gap between said supporting substrate and said semiconductor device;
- filling said gap with a composition that contains:
- A. binder selected from the group of a cycloaliphatic epoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 1,000 centipoise;
- B. filler having a maximum particle size of 31 microns and being free of alpha particle emissions; wherein the amount of A is about 60 to about 25 percent by weight of the total of A and B, and correspondingly the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B; and curing said composition.
- 2. The method of claim 1 wherein said gap is about 25 to about 160 microns wide.
- 3. The method of claim 1 wherein said binder is a polyepoxide selected from the group of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate and vinyl cyclohexane diepoxide.
- 4. The method of claim 1 wherein said binder includes 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate.
- 5. The method of claim 1 wherein the viscosity of said binder at 25.degree. C. is about 35 to about 500 centipoise.
- 6. The method of claim 1 wherein said filler is an inorganic filler selected from the group of silica, quartz and fused silica.
- 7. The method of claim 1 wherein said filler has emission rate of less than 0.01 alpha particles/cm.sup.2 -hr.
- 8. The method of claim 1 wherein said filler has particle sizes of about 0.5 to about 20 micrometers.
- 9. The method of claim 1 wherein said amount of said binder is about 43% by weight and said amount of said filler is correspondingly about 57% by weight.
- 10. The method of claim 1 wherein said composition includes an anhydride of an organic carboxylic acid hardener.
- 11. The method of claim 10 wherein said hardener includes hexahydrophthalic anhydride or methyl hexahydrophthalic anhydride or mixtures thereof.
- 12. The method of claim 10 wherein the amount of the hardener is about 89 to about 110 phr.
- 13. The method of claim 1 wherein the viscosity at 25.degree. C. of said composition is about 3,000 to about 17,000 centipoise.
- 14. The method of claim 1 wherein said composition also includes a catalyst.
- 15. The method of claim 1 wherein said composition also includes ethylene glycol in an amount of about 0.5 to about 2 phr.
- 16. The method of claim 1 wherein said composition is free of unreactive organic solvents.
- 17. The method of claim 1 wherein said composition also includes an adhesion promoter.
- 18. The method of claim 1 wherein said substrate is an organic, inorganic or a composite material.
- 19. The method of claim 1 wherein said binder is a cyanate ester.
- 20. The method of claim 1 wherein said cyanate ester is 4,4'-ethylidene bisphenol dicyanate.
Parent Case Info
This is a divisional of Ser. No. 07/493,126, filed on Mar. 14, 1990, now U.S. Pat. No. 4,999,699 issued 3-12-91.
US Referenced Citations (4)
Foreign Referenced Citations (2)
Number |
Date |
Country |
61-158151 |
Jul 1986 |
JPX |
10-11125 |
Jan 1989 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Chemical Abstracts, vol. 82, No. 164236a, (1975). |
Divisions (1)
|
Number |
Date |
Country |
Parent |
493126 |
Mar 1990 |
|