Claims
- 1. A solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate comprising
- a plurality of solder connections that extend from the carrier substrate to electrodes on said semiconductor device to form a gap between said carrier substrate and the semiconductor device, wherein said gap is filled with a composition obtained from curing a composition containing:
- A. a binder selected from the group of cycloaliphatic polyepoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 1,000 centipoise;
- B. filler having a maximum particle size of 31 microns and being substantially free of alpha particle emissions; wherein the amount of A is about 60 to about 25% by weight of the total of A and B and correspondingly, the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B, and C a surfaeta.
- 2. The solder interconnection of claim 1 wherein said gap is about 50 to about 160 microns wide.
- 3. The solder interconnection of claim 1 wherein said binder is a polyepoxide selected from the group of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate and vinyl cyclohexane diepoxide.
- 4. The solder interconnection of claim 1 wherein said binder is a polyepoxide that includes 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate.
- 5. The solder interconnection of claim 1 wherein the viscosity of said binder at 25.degree. C. is about 35 to about 500 centipoise.
- 6. The solder interconnection of claim 1 wherein said filler is an inorganic filler selected from the group of silica, quartz and fused silica, optionally treated with coupling agents.
- 7. The solder interconnection of claim 1 wherein said filler has emission rate of less than 0.01 alpha particles/cm.sup.2 -hr.
- 8. The solder interconnection of claim 1 wherein said filler has particle sizes of about 0.5 to about 20 micrometers.
- 9. The solder interconnection of claim 1 wherein said amount of said binder is about 43% by weight and said amount of said filler is correspondingly about 57% by weight.
- 10. The solder interconnection of claim 1 wherein said composition also includes an anhydride of an organic carboxylic acid hardener.
- 11. The solder interconnection of claim 10 wherein said hardener includes hexahydrophthalic anhydride or methyl hexahydrophthalic anhydride or mixtures thereof.
- 12. The solder interconnection of claim 10 wherein the amount of the hardener is about 89 to about 110 phr.
- 13. The solder interconnection of claim 1 wherein the viscosity at 25.degree. C. of said composition is about 3,000 to about 17,000 centipoise.
- 14. The solder interconnection of claim 1 wherein said composition also includes a catalyst.
- 15. The solder interconnection of claim 1 wherein said composition also includes ethylene glycol in an amount of about 0.5 to about 2 phr.
- 16. The solder interconnection of claim 1 wherein said composition is free of unreactive organic solvents.
- 17. The solder interconnection of claim 1 wherein said composition also includes an adhesion promoter.
- 18. The solder interconnection of claim 1 wherein said substrate is an organic, inorganic or a composite material.
- 19. The solder interconnection of claim 1 wherein said binder is a cyanate ester.
- 20. The solder interconnection of claim 19 wherein said syanate ester is 4,4'-ethylidene bisphenol dicyanate.
- 21. The solder interconnection of claim 1 wherein the amount of said surfactant is about 0.5% to about 3% by weight of the composition.
- 22. The solder interconnection of claim 1 wherein the amount of said surfactant is about 1.2% to about 1.6% by weight of the composition.
- 23. The solder interconnection of claim 1 wherein said surfactant is a silane.
- 24. The solder interconnection of claim wherein said surfactant is a non-ionic surface active agent.
CROSS REFERENCE TO RELATED APPLICATIONS
This is a continuation of co-pending application Ser. No. 07/624,973 filed Dec. 10, 1990 now U.S. Pat. No. 5,089,440, which in turn is a divisional application of Ser. No. 07/493,126 filed Mar. 14, 1991 which is now U.S. Pat. No. 4,999,699.
US Referenced Citations (9)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0111125 |
Jan 1989 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Chemical Abstracts, 164236A, vol. 82, 1975, p. 573. |
Divisions (1)
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Number |
Date |
Country |
Parent |
493126 |
Mar 1990 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
624973 |
Dec 1990 |
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