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Kiyoshi Nikawa
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Non-destructive inspection method
Patent number
6,593,156
Issue date
Jul 15, 2003
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Device and method for nondestructive inspection on semiconductor de...
Patent number
6,444,895
Issue date
Sep 3, 2002
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Parasitic MIM structural spot analysis method for semiconductor dev...
Patent number
6,320,396
Issue date
Nov 20, 2001
NEC Corporation
Kiyoshi Nikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inspection method and wiring current observation method for semicon...
Patent number
6,160,407
Issue date
Dec 12, 2000
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Method and device of testing semiconductor integrated circuit chip...
Patent number
6,137,304
Issue date
Oct 24, 2000
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Method and device of testing a semiconductor integrated circuit chi...
Patent number
6,084,423
Issue date
Jul 4, 2000
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Method and device of testing semiconductor integrated circuit chip...
Patent number
6,072,327
Issue date
Jun 6, 2000
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Inspection method and wiring current observation method for semicon...
Patent number
6,066,956
Issue date
May 23, 2000
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device evaluation system using optical fiber
Patent number
6,028,435
Issue date
Feb 22, 2000
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Method and device of testing semiconductor integrated circuit chip...
Patent number
5,815,002
Issue date
Sep 29, 1998
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Method and system for testing an interconnection in a semiconductor...
Patent number
5,804,980
Issue date
Sep 8, 1998
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Dynamic fault imaging system using electron beam and method of anal...
Patent number
5,548,211
Issue date
Aug 20, 1996
NEC Corporation
Tohru Tujide
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor integrated circuit fault analyzing apparatus and meth...
Patent number
5,521,516
Issue date
May 28, 1996
NEC Corporation
Yasuko Hanagama
G01 - MEASURING TESTING
Information
Patent Grant
Apparatus for diagnosing interconnections of semiconductor integrat...
Patent number
5,422,498
Issue date
Jun 6, 1995
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device having improved structure of multi-wiring layers
Patent number
4,734,754
Issue date
Mar 29, 1988
NEC Corporation
Kiyoshi Nikawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Device and method for nondestructive inspection on semiconductor de...
Publication number
20020106820
Publication date
Aug 8, 2002
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Application
Device and method for nondestructive inspection on semiconductor de...
Publication number
20020105577
Publication date
Aug 8, 2002
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING
Information
Patent Application
Non-destructive inspection method
Publication number
20020052055
Publication date
May 2, 2002
NEC Corporation
Kiyoshi Nikawa
G01 - MEASURING TESTING