Tsubosaki Kunihiro

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe semiconductor integrated circuit device using the same, a...
- Patent number RE43443
- Issue date Jun 5, 2012
- Renesas Electronics Corporation
- Yujiro Kajihara
- 257 - Active solid-state devices
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,678,706
- Issue date Mar 16, 2010
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,420,284
- Issue date Sep 2, 2008
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,247,576
- Issue date Jul 24, 2007
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film semiconductor device and a method...
- Patent number 7,202,570
- Issue date Apr 10, 2007
- Renesas Technology Corp.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,091,620
- Issue date Aug 15, 2006
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 6,989,334
- Issue date Jan 24, 2006
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded type semiconductor device and fabrication process th...
- Patent number 6,943,456
- Issue date Sep 13, 2005
- Hitachi ULSI Systems Co., Ltd.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,919,622
- Issue date Jul 19, 2005
- Renesas Technology Corp.
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,803,258
- Issue date Oct 12, 2004
- Renesas Technology Corp.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film, semiconductor device, and a meth...
- Patent number 6,791,194
- Issue date Sep 14, 2004
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,759,272
- Issue date Jul 6, 2004
- Renesas Technology Corp.
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,720,208
- Issue date Apr 13, 2004
- Renesas Technology Corporation
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic molded type semiconductor device and fabrication process th...
- Patent number 6,692,989
- Issue date Feb 17, 2004
- Renesas Technology Corporation
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device having improved heat radiatio...
- Patent number 6,673,655
- Issue date Jan 6, 2004
- Hitachi, Ltd.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,670,215
- Issue date Dec 30, 2003
- Renesas Technology Corporation
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,664,616
- Issue date Dec 16, 2003
- Hitachi, Ltd.
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ball grid array type semiconductor package
- Patent number 6,664,135
- Issue date Dec 16, 2003
- Renesas Technology Corporation
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,642,083
- Issue date Nov 4, 2003
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,639,323
- Issue date Oct 28, 2003
- Hitachi, Ltd.
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 6,610,561
- Issue date Aug 26, 2003
- Hitachi, Ltd.
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a thin semiconductor device
- Patent number 6,589,818
- Issue date Jul 8, 2003
- Hitachi Ltd.
- Mitsuo Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing semiconductor wafer and producing IC card, an...
- Patent number 6,589,855
- Issue date Jul 8, 2003
- Hitachi, Ltd.
- Toshio Miyamoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of processing semiconductor wafer and producing IC card, an...
- Patent number 6,573,158
- Issue date Jun 3, 2003
- Hitachi, Ltd.
- Toshio Miyamoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plastic molded type semiconductor device and fabrication process th...
- Patent number 6,558,980
- Issue date May 6, 2003
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,531,760
- Issue date Mar 11, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,521,981
- Issue date Feb 18, 2003
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a thin semiconductor device
- Patent number 6,514,796
- Issue date Feb 4, 2003
- Hitachi, Ltd.
- Mitsuo Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with elastic structure and wiring
- Patent number 6,515,371
- Issue date Feb 4, 2003
- Hitachi, Ltd.
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,472,727
- Issue date Oct 29, 2002
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20070298545
- Publication date Dec 27, 2007
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060261494
- Publication date Nov 23, 2006
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20060049499
- Publication date Mar 9, 2006
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing metthod thereof
- Publication number 20050212142
- Publication date Sep 29, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050200019
- Publication date Sep 15, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit tape having adhesive film semiconductor device and a method...
- Publication number 20040224149
- Publication date Nov 11, 2004
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic molded type semiconductor device and fabrication process th...
- Publication number 20040159922
- Publication date Aug 19, 2004
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040155323
- Publication date Aug 12, 2004
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20040126932
- Publication date Jul 1, 2004
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040061220
- Publication date Apr 1, 2004
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030207557
- Publication date Nov 6, 2003
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030207572
- Publication date Nov 6, 2003
- Miyaki Yoshinori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufactuiring method thereof
- Publication number 20030162326
- Publication date Aug 28, 2003
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030127712
- Publication date Jul 10, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plastic molded type semiconductor device and fabrication process th...
- Publication number 20030124770
- Publication date Jul 3, 2003
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for mounting a thin semiconductor device
- Publication number 20030027376
- Publication date Feb 6, 2003
- Mitsuo Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and flip chip bonding method therein
- Publication number 20030001286
- Publication date Jan 2, 2003
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020192871
- Publication date Dec 19, 2002
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20020180010
- Publication date Dec 5, 2002
- KUNIHIRO TSUBOSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit tape having adhesive film, semiconductor device, and a meth...
- Publication number 20020160185
- Publication date Oct 31, 2002
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame and semiconductor package formed using it
- Publication number 20020153596
- Publication date Oct 24, 2002
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020137262
- Publication date Sep 26, 2002
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020137261
- Publication date Sep 26, 2002
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020070461
- Publication date Jun 13, 2002
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020066181
- Publication date Jun 6, 2002
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020068380
- Publication date Jun 6, 2002
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020064901
- Publication date May 30, 2002
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20020050636
- Publication date May 2, 2002
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of processing semiconductor wafer and producing IC card, an...
- Publication number 20020048907
- Publication date Apr 25, 2002
- Hitachi, Ltd.
- Toshio Miyamoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20020047215
- Publication date Apr 25, 2002
- Yukiharu Akiyama
- H01 - BASIC ELECTRIC ELEMENTS

Tsubosaki Kunihiro

Person

Patents Grantslast 30 patents

Leadframe semiconductor integrated circuit device using the same, a...

Method of manufacturing a semiconductor device

Semiconductor device and manufacturing method thereof

Method of manufacturing a semiconductor device

Circuit tape having adhesive film semiconductor device and a method...

Semiconductor device and manufacturing method thereof

Manufacturing method of a semiconductor device

Plastic molded type semiconductor device and fabrication process th...

Semiconductor device

Semiconductor device

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor device and manufacturing method thereof

Semiconductor device

Plastic molded type semiconductor device and fabrication process th...

Method of making semiconductor device having improved heat radiatio...

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Method of manufacturing a ball grid array type semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor device and its manufacturing method

Method of fabricating a semiconductor device

Method for mounting a thin semiconductor device

Methods of processing semiconductor wafer and producing IC card, an...

Methods of processing semiconductor wafer and producing IC card, an...

Plastic molded type semiconductor device and fabrication process th...

Semiconductor device

Semiconductor device and manufacturing method thereof

Method for mounting a thin semiconductor device

Semiconductor device with elastic structure and wiring

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method thereof

Semiconductor device and its manufacturing method

Semiconductor device and manufacturing metthod thereof

Semiconductor device and manufacturing method thereof

Circuit tape having adhesive film semiconductor device and a method...

Plastic molded type semiconductor device and fabrication process th...

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and its manufacturing method

Semiconductor device and its manufacturing method

Semiconductor device and manufactuiring method thereof

Semiconductor device

Plastic molded type semiconductor device and fabrication process th...

Method for mounting a thin semiconductor device

Semiconductor package and flip chip bonding method therein

Semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Circuit tape having adhesive film, semiconductor device, and a meth...

Lead frame and semiconductor package formed using it

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and its manufacturing method

Methods of processing semiconductor wafer and producing IC card, an...

Semiconductor device and its manufacturing method