Claims
- 1. A method for mounting a thin IC chip, comprising the steps of:providing a plurality of IC chips attached to a tape, the plurality of IC chips having a thickness in a range of from 0.1 μm to 110 μm and completely separated from each other; providing a substrate having a wiring formed thereon; providing one IC chip, of said plurality of IC chips, as it is attached to said tape, to face said substrate; fixing said one IC chip onto the surface of said substrate via an adhesive layer applied on the whole surface of said one IC chip, by press-contacting said one IC chip onto the surface of said substrate via said adhesive layer, using a heating head having a flat head surface having an approximately same surface area as that of said one IC chip; and, separating said one IC chip from said tape.
- 2. A method for mounting a thin IC chip according to claim 1, wherein said tape is held with a frame.
- 3. A method for mounting a thin IC chip according to claim 2, wherein said frame is disposed at a side of said tape in which said plurality of IC chips are attached to said tape.
- 4. A method for mounting a thin IC chip, comprising the steps of:providing a plurality of IC chips attached to a tape, the plurality of IC chips having a thickness in a range of from 0.1 μm to 110 μm and completely separated from each other, and said plurality of IC chips being individually confirmed whether it belongs in non-distractive IC chips or distractive IC chips; providing a substrate having a wiring formed thereon; providing one of the non-distractive IC chips, as it is attached to said tape, to face said substrate; fixing said one of the non-distractive IC chips onto the surface of said substrate via an adhesive layer applied on the whole surface of said one of the non-distractive IC chips, by press-contacting said one of the non-distractive IC chips onto the surface of said substrate via said adhesive layer, using a heating head having a flat head surface having an approximately same surface area as that of said one of the non-distractive IC chips; and, separating said one of the non-distractive IC chips from said tape.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-120236 |
May 1995 |
JP |
|
Parent Case Info
This application is a Continuation application of Ser. No. 09/729,191, filed Dec. 12, 2000, now U.S. Pat. No. 6,514,796, which is a Continuation application of Ser. No. 09/289,658, filed Apr. 12, 1999, now U.S. Pat. No. 6,162,701, which is a Continuation application of Ser. No. 08/952,344, filed Nov. 18, 1997, now U.S. Pat. No. 5,893,746, the contents of which are incorporated herein by reference in their entirety, which is an application under 35 USC 371 of PCT/JP96/01263, filed May 14, 1996.
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Continuations (2)
|
Number |
Date |
Country |
Parent |
09/289658 |
Apr 1999 |
US |
Child |
09/729191 |
|
US |
Parent |
08/952344 |
|
US |
Child |
09/289658 |
|
US |