Yih-Shung Lin

Person

Carrollton, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating interlevel contacts of aluminum/refractory m...
- Patent number 6,617,242
- Issue date Sep 9, 2003
- STMicroelectronics, Inc.
- Fusen E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum contact structure for integrated circuits
- Patent number 6,433,435
- Issue date Aug 13, 2002
- STMicroelectronics, Inc.
- Yih-Shung Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit with improved contact barrier
- Patent number 6,291,344
- Issue date Sep 18, 2001
- STMicroelectronics, Inc.
- De-Dul Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel contact including aluminum-refractory metal alloy formed...
- Patent number 6,242,811
- Issue date Jun 5, 2001
- STMicroelectronics, Inc.
- Fusen E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an integrated circuit with improved contact b...
- Patent number 6,191,033
- Issue date Feb 20, 2001
- STMicroelectronics, Inc.
- De-Dui Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced planarization technique for an integrated circuit
- Patent number 5,986,330
- Issue date Nov 16, 1999
- STMicroelectronics, Inc.
- Alex Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an aluminum contact
- Patent number 5,976,969
- Issue date Nov 2, 1999
- STMicroelectronics, Inc.
- Yih-Shung Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a metal contact
- Patent number 5,930,673
- Issue date Jul 27, 1999
- STMicroelectronics, Inc.
- Fusen E. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor contact via structure
- Patent number 5,841,195
- Issue date Nov 24, 1998
- STMicroelectronics, Inc.
- Yih-Shung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced planarization technique for an integrated circuit
- Patent number 5,837,613
- Issue date Nov 17, 1998
- STMicroelectronics, Inc.
- Alex Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an aluminum contact through an insulating layer
- Patent number 5,658,828
- Issue date Aug 19, 1997
- SGS-Thomson Microelectronics, Inc.
- Yih-Shung Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit with a titanium nitride contact barrier having o...
- Patent number 5,652,464
- Issue date Jul 29, 1997
- SGS-Thomson Microelectronics, Inc.
- De-Dui Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with enhanced planarization
- Patent number 5,633,534
- Issue date May 27, 1997
- SGS-Thomson Microelectronics, Inc.
- Alex Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of removing polymers in semiconductor vias
- Patent number 5,597,983
- Issue date Jan 28, 1997
- SGS-Thomson Microelectronics, Inc.
- Loi N. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with a titanium nitride contact barrier having o...
- Patent number 5,514,908
- Issue date May 7, 1996
- SGS-Thomson Microelectronics, Inc.
- De-Dul Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for planarization of an integrated circuit
- Patent number 5,485,035
- Issue date Jan 16, 1996
- SGS-Thomson Microelectronics, Inc.
- Yih-Shung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local interconnect process for integrated circuits
- Patent number RE35111
- Issue date Dec 5, 1995
- SGS-Thomson Microelectronics, Inc.
- Fu-Tai Liou
- 437 -
Information Patent Grant
Enhanced planarization technique for an integrated circuit
- Patent number 5,435,888
- Issue date Jul 25, 1995
- SGS-Thomson Microelectronics, Inc.
- Alex Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of removing polymers in semiconductor vias
- Patent number 5,412,868
- Issue date May 9, 1995
- SGS-Thomson Microelectronics, Inc.
- Loi N. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact via structure and method
- Patent number 5,246,883
- Issue date Sep 21, 1993
- SGS-Thomson Microelectronics, Inc.
- Yih-Shung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metal contact
- Patent number 5,108,951
- Issue date Apr 28, 1992
- SGS-Thomson Microelectronics, Inc.
- Fusen E. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Local interconnect for integrated circuits
- Patent number 5,075,761
- Issue date Dec 24, 1991
- SGS-Thomson Microelectronics, Inc.
- Fu-Tai Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local interconnect process for integrated circuits
- Patent number 4,978,637
- Issue date Dec 18, 1990
- SGS-Thomson Microelectronics, Inc.
- Fu-Tai Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing the surface reflectance of a metal layer during...
- Patent number 4,933,304
- Issue date Jun 12, 1990
- SGS-Thomson Microelectronics, Inc.
- Fusen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING AN ALUMINUM CONTACT
- Publication number 20020000653
- Publication date Jan 3, 2002
- YIH-SHUNG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Yih-Shung Lin

Person

Patents Grantslast 30 patents

Method for fabricating interlevel contacts of aluminum/refractory m...

Aluminum contact structure for integrated circuits

Integrated circuit with improved contact barrier

Interlevel contact including aluminum-refractory metal alloy formed...

Method of fabricating an integrated circuit with improved contact b...

Enhanced planarization technique for an integrated circuit

Method for forming an aluminum contact

Method for forming a metal contact

Semiconductor contact via structure

Enhanced planarization technique for an integrated circuit

Method for forming an aluminum contact through an insulating layer

Integrated circuit with a titanium nitride contact barrier having o...

Integrated circuit with enhanced planarization

Process of removing polymers in semiconductor vias

Integrated circuit with a titanium nitride contact barrier having o...

Method for planarization of an integrated circuit

Local interconnect process for integrated circuits

Enhanced planarization technique for an integrated circuit

Process of removing polymers in semiconductor vias

Semiconductor contact via structure and method

Method for forming a metal contact

Local interconnect for integrated circuits

Local interconnect process for integrated circuits

Method for reducing the surface reflectance of a metal layer during...

Patents Applicationslast 30 patents

METHOD FOR FORMING AN ALUMINUM CONTACT