Cleaning the bonding area

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H01L2224/8001

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8001Cleaning the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Technologies for plasma oxidation protection during hybrid bonding...
- Patent number 12,125,818
- Issue date Oct 22, 2024
- Tokyo Electron Limited
- Jack Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for bonding chips
- Patent number 11,990,463
- Issue date May 21, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,978,719
- Issue date May 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system and bonding method
- Patent number 11,817,338
- Issue date Nov 14, 2023
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,798,913
- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 11,791,241
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding of chips
- Patent number 11,764,198
- Issue date Sep 19, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable hybrid bonded apparatus
- Patent number 11,742,314
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 11,742,315
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED arrays including optical elements configured to t...
- Patent number 11,715,730
- Issue date Aug 1, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating semiconductor device with re-fill layer
- Patent number 11,646,292
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared detector having a directly bonded silicon substrate presen...
- Patent number 11,587,971
- Issue date Feb 21, 2023
- L3HARRIS CINCINNATI ELECTRONICS CORPORATION
- Steven Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Left and right projectors for display device
- Patent number 11,508,700
- Issue date Nov 22, 2022
- Meta Platforms Technologies, LLC
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,495,557
- Issue date Nov 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Jhao-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,495,569
- Issue date Nov 8, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded structure
- Patent number 11,437,422
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,417,619
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-efficiency red micro-LED with localized current aperture
- Patent number 11,362,237
- Issue date Jun 14, 2022
- Facebook Technologies, LLC
- Berthold Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED structure contacts and substrate contacts
- Patent number 11,329,034
- Issue date May 10, 2022
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a MEMS device by first hybrid bonding a CM...
- Patent number 11,279,615
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Integrated Inspection for Enhanced Hybrid Bonding Yield in Advanced...
- Publication number 20240363446
- Publication date Oct 31, 2024
- Venkatakaushik VOLETI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, CLEANING DEVICE, CLE...
- Publication number 20240321818
- Publication date Sep 26, 2024
- Resonac Corporation
- Toshiaki SHIRASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
- Publication number 20240312951
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20240304593
- Publication date Sep 12, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240234215
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20240234154
- Publication date Jul 11, 2024
- Disco Corporation
- Kai MINAMIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and Processes for Void-Free Hybrid Bonding
- Publication number 20240222313
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING REPAIR DEVICES
- Publication number 20240222319
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE
- Publication number 20240196530
- Publication date Jun 13, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PROCESS FLOWS FOR HYBRID BONDING
- Publication number 20240170443
- Publication date May 23, 2024
- Ruiping WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING OF CHIPS
- Publication number 20240170474
- Publication date May 23, 2024
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20240136193
- Publication date Apr 25, 2024
- Disco Corporation
- Kai MINAMIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240136231
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240107740
- Publication date Mar 28, 2024
- ChangXin Memory Technologies, Inc.
- Huihui GUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION
- Publication number 20240071984
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING SYSTEM
- Publication number 20240047257
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240030169
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Woon Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20240021573
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20240021572
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240006301
- Publication date Jan 4, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...
- Publication number 20230395545
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230389339
- Publication date Nov 30, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE SURFACE TREATMENT APPARATUS AND DIE BONDING SYSTEM INCLUDING TH...
- Publication number 20230343740
- Publication date Oct 26, 2023
- SEMES CO., LTD.
- Min Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SHAPE CONTROL FOR W2W BONDING
- Publication number 20230326767
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20230275062
- Publication date Aug 31, 2023
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING
- Publication number 20230260955
- Publication date Aug 17, 2023
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS

Cleaning the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Technologies for plasma oxidation protection during hybrid bonding...

Bonded structures

Method for fabricating hybrid bonded structure

Device for bonding chips

Metal-dielectric bonding method and structure

Bond enhancement structure in microelectronics for trapping contami...

MEMS device having a metallization structure embedded in a dielectr...

Semiconductor device and method of manufacturing

Conductive barrier direct hybrid bonding

Bonding system and bonding method

Metal-dielectric bonding method and structure

Front-to-back bonding with through-substrate via (TSV)

Method and device for bonding of chips

Reliable hybrid bonded apparatus

Die processing

Direct-bonded LED arrays including optical elements configured to t...

Bonded structures

Method for fabricating semiconductor device with re-fill layer

Infrared detector having a directly bonded silicon substrate presen...

Semiconductor device, fabrication method for a semiconductor device...

Left and right projectors for display device

Semiconductor device and method of manufacturing the same

Metal-dielectric bonding method and structure

Hybrid bonded structure

Package and manufacturing method thereof

High-efficiency red micro-LED with localized current aperture

Semiconductor device and method of manufacturing

Direct-bonded LED structure contacts and substrate contacts

Bond enhancement structure in microelectronics for trapping contami...

Method for manufacturing a MEMS device by first hybrid bonding a CM...

Patents Applicationslast 30 patents

Integrated Inspection for Enhanced Hybrid Bonding Yield in Advanced...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, CLEANING DEVICE, CLE...

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

DIRECT BONDING METHODS AND STRUCTURES

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

APPARATUS FOR MEASURING AN ADHESION FORCE

METHOD OF PROCESSING WAFER

Structures and Processes for Void-Free Hybrid Bonding

DEBONDING REPAIR DEVICES

MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE

INTEGRATED PROCESS FLOWS FOR HYBRID BONDING

METHOD AND DEVICE FOR BONDING OF CHIPS

METHOD OF PROCESSING WAFER

APPARATUS FOR MEASURING AN ADHESION FORCE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION

BONDING SYSTEM

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

RELIABLE HYBRID BONDED APPARATUS

DIE PROCESSING

SEMICONDUCTOR PACKAGE

MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

BONDED STRUCTURES

DIE SURFACE TREATMENT APPARATUS AND DIE BONDING SYSTEM INCLUDING TH...

WAFER SHAPE CONTROL FOR W2W BONDING

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING