Stacked conductors

Industry

CPC
H05K2201/0379

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0379Stacked conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground terminal and electronic device
- Patent number 11,881,333
- Issue date Jan 23, 2024
- Shenzhen Johan Material Technology Co., Ltd.
- Mujiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,728,258
- Issue date Aug 15, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,558,959
- Issue date Jan 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,523,517
- Issue date Dec 6, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and connecting structure of the same
- Patent number 11,470,728
- Issue date Oct 11, 2022
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board
- Patent number 11,406,024
- Issue date Aug 2, 2022
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive particles and test socket having the same
- Patent number 11,373,779
- Issue date Jun 28, 2022
- SNOW CO., LTD.
- Gyu Sun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,304,307
- Issue date Apr 12, 2022
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,289,400
- Issue date Mar 29, 2022
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with different surface finishes and method for ma...
- Patent number 11,284,511
- Issue date Mar 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Giordano Di Gregorio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,257,745
- Issue date Feb 22, 2022
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, method and apparatus for producing an electronic...
- Patent number 11,240,916
- Issue date Feb 1, 2022
- CRYOVAC, LLC
- James W. Blease
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board...
- Patent number 11,039,540
- Issue date Jun 15, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated circuit board
- Patent number 11,013,107
- Issue date May 18, 2021
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method of forming electrical interconnects
- Patent number 10,939,550
- Issue date Mar 2, 2021
- The Boeing Company
- Minas H. Tanielian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reduction of interfacial stress accumulation between dou...
- Patent number 10,923,621
- Issue date Feb 16, 2021
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Chun-Te Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode embedded member
- Patent number 10,750,611
- Issue date Aug 18, 2020
- NGK Spark Plug Co., Ltd.
- Atsushi Tsuchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transparent conductor and device
- Patent number 10,306,752
- Issue date May 28, 2019
- Kabushiki Kaisha Toshiba
- Katsuyuki Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming trenches in packages structures and structures f...
- Patent number 10,231,338
- Issue date Mar 12, 2019
- Intel Corporation
- Naga Sivakumar Yagnamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive component and electronic device including the same
- Patent number 9,955,577
- Issue date Apr 24, 2018
- Samsung Electronics Co., Ltd.
- Youngjin Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Magnetically aligned circuit
- Patent number 9,911,559
- Issue date Mar 6, 2018
- Microsoft Technology Licensing, LLC
- James David Holbery
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Transparent conductor and device
- Patent number 9,763,320
- Issue date Sep 12, 2017
- Kabushiki Kaisha Toshiba
- Katsuyuki Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, electronic module and method of manufacturin...
- Patent number 9,706,668
- Issue date Jul 11, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Da-Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having surface-mount blocking elements
- Patent number 9,620,462
- Issue date Apr 11, 2017
- Maxim Integrated Products, Inc.
- Ruben C. Zeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power chain on a circuit board
- Patent number 9,545,007
- Issue date Jan 10, 2017
- One Inventor Sweden AB
- Jan Berglund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless module and production method for wireless module
- Patent number 9,437,535
- Issue date Sep 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Maki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing antenna sheet
- Patent number 9,436,905
- Issue date Sep 6, 2016
- Toppan Printing Co., Ltd.
- Hiroyoshi Gotou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stud bump bonding in implantable medical devices
- Patent number 9,351,436
- Issue date May 24, 2016
- Cochlear Limited
- Milind Raje
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT MODULE
- Publication number 20240237211
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240179829
- Publication date May 30, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138066
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230413429
- Publication date Dec 21, 2023
- IBIDEN CO., LTD.
- Atsushi DEGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier assembly and method for producing a carrier assembly
- Publication number 20230354529
- Publication date Nov 2, 2023
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection of printed circuit boards with nanowires
- Publication number 20230319976
- Publication date Oct 5, 2023
- Klaus Haimlinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE
- Publication number 20230223200
- Publication date Jul 13, 2023
- Imagine TF, LLC
- Brian Edward Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING I...
- Publication number 20230115820
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230047768
- Publication date Feb 16, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220217843
- Publication date Jul 7, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20220173010
- Publication date Jun 2, 2022
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...
- Publication number 20220084927
- Publication date Mar 17, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PARTICLES AND TEST SOCKET HAVING THE SAME
- Publication number 20210319928
- Publication date Oct 14, 2021
- SNOW CO., LTD.
- Gyu Sun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210037660
- Publication date Feb 4, 2021
- IBIDEN CO., LTD.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20210028086
- Publication date Jan 28, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BOARD AND CONNECTING STRUCTURE OF THE SAME
- Publication number 20210022255
- Publication date Jan 21, 2021
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATED CIRCUIT BOARD
- Publication number 20210007217
- Publication date Jan 7, 2021
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER INTERFACE FEATURES FOR HIGH SPEED INTERCONNECT APPLICATIONS
- Publication number 20200315023
- Publication date Oct 1, 2020
- Intel Corporation
- Suddhasattwa NAD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...
- Publication number 20200258827
- Publication date Aug 13, 2020
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device, Method and Apparatus for Producing an Electronic...
- Publication number 20200107450
- Publication date Apr 2, 2020
- James W. Blease
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...
- Publication number 20180288867
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- RYO FUKUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
TRANSPARENT CONDUCTOR AND DEVICE
- Publication number 20170311441
- Publication date Oct 26, 2017
- Kabushiki Kaisha Toshiba
- Katsuyuki NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20170188456
- Publication date Jun 29, 2017
- Samsung Electronics Co., Ltd.
- Youngjin CHO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME
- Publication number 20160234930
- Publication date Aug 11, 2016
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Chan Woo PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20150380391
- Publication date Dec 31, 2015
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT CONDUCTOR AND DEVICE
- Publication number 20150257258
- Publication date Sep 10, 2015
- Kabushiki Kaisha Toshiba
- Katsuyuki NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20150245478
- Publication date Aug 27, 2015
- Shinko Electric Industries Co., Ltd.
- Satoshi MIYAZAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POWER CHAIN ON A CIRCUIT BOARD
- Publication number 20140338964
- Publication date Nov 20, 2014
- INCO INNOVATION
- Jan Berglund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stud Bump Bonding in Implantable Medical Devices
- Publication number 20140254124
- Publication date Sep 11, 2014
- Milind Raje
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...
- Publication number 20140185259
- Publication date Jul 3, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- YONG HA WOO
- H01 - BASIC ELECTRIC ELEMENTS

Stacked conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board and method for manufacturing the same

Method of manufacturing bonded body for insulation circuit substrat...

Ground terminal and electronic device

Electroless metal-defined thin pad first level interconnects for li...

Printed circuit board

Circuit board and method for manufacturing the same

Multilayer board and connecting structure of the same

Multi-layer circuit board with traces thicker than a circuit board

Conductive particles and test socket having the same

Printed wiring board and method for manufacturing printed wiring board

Method of manufacturing bonded body for insulation circuit substrat...

Component carrier with different surface finishes and method for ma...

Electroless metal-defined thin pad first level interconnects for li...

Electronic device, method and apparatus for producing an electronic...

Multi-layer circuit board with traces thicker than a circuit board...

Insulated circuit board

System and method of forming electrical interconnects

Method for reduction of interfacial stress accumulation between dou...

Electrode embedded member

Transparent conductor and device

Methods of forming trenches in packages structures and structures f...

Conductive component and electronic device including the same

Magnetically aligned circuit

Transparent conductor and device

Printed circuit board, electronic module and method of manufacturin...

Integrated circuit package having surface-mount blocking elements

Power chain on a circuit board

Wireless module and production method for wireless module

Method for manufacturing antenna sheet

Stud bump bonding in implantable medical devices

Patents Applicationslast 30 patents

CIRCUIT MODULE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT MODULE

WIRING SUBSTRATE

Carrier assembly and method for producing a carrier assembly

Interconnection of printed circuit boards with nanowires

PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE

METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING I...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...

CONDUCTIVE PARTICLES AND TEST SOCKET HAVING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

MULTILAYER BOARD AND CONNECTING STRUCTURE OF THE SAME

INSULATED CIRCUIT BOARD

COPPER INTERFACE FEATURES FOR HIGH SPEED INTERCONNECT APPLICATIONS

ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...

Electronic Device, Method and Apparatus for Producing an Electronic...

SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...

TRANSPARENT CONDUCTOR AND DEVICE

CONDUCTIVE COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME

STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...

TRANSPARENT CONDUCTOR AND DEVICE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE

POWER CHAIN ON A CIRCUIT BOARD

Stud Bump Bonding in Implantable Medical Devices

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAG...