Testing steps

Industry

CPC
Y10S148/162

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S148/00Metal treatment

Current Industry

Y10S148/162Testing steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor devices using gate insulator thickn...
- Patent number 6,228,663
- Issue date May 8, 2001
- Advanced Micro Devices, Inc.
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer evaluation method
- Patent number 6,225,137
- Issue date May 1, 2001
- Oki Electric Industry Co., Ltd.
- Liu Guo Lin
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for preventing chip breakage during semiconduc...
- Patent number 6,171,873
- Issue date Jan 9, 2001
- International Business Machines Corporation
- Ronald Lee Mendelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensitive technique for metal-void detection
- Patent number 6,100,101
- Issue date Aug 8, 2000
- Advanced Micro Devices Inc.
- Amit P. Marathe
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer evaluating method and semiconductor device manu...
- Patent number 5,946,543
- Issue date Aug 31, 1999
- Mitsubishi Denki Kabushiki
- Yasuhiro Kimura
- G01 - MEASURING TESTING
Information Patent Grant
Stress migration evaluation method
- Patent number 5,930,587
- Issue date Jul 27, 1999
- Lucent Technologies
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for preventing chip breakage during semiconduc...
- Patent number 5,888,838
- Issue date Mar 30, 1999
- International Business Machines Corporation
- Ronald Lee Mendelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a real time ion implantation metal silicide monitor
- Patent number 5,451,529
- Issue date Sep 19, 1995
- Taiwan Semiconductor Manufacturing Company
- Shun-Liang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method of rapid testing of semiconductor componen...
- Patent number 5,410,162
- Issue date Apr 25, 1995
- Texas Instruments Incorporated
- Howard L. Tigelaar
- G01 - MEASURING TESTING
Information Patent Grant
Method of reducing dice testing with on-chip identification
- Patent number 5,360,747
- Issue date Nov 1, 1994
- Xilinx, Inc.
- Sheldon O. Larson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for testing semiconductor devices
- Patent number 5,298,433
- Issue date Mar 29, 1994
- Kabushiki Kaisha Toshiba
- Tohru Furuyama
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing a semiconductor device including wafer agi...
- Patent number 5,219,765
- Issue date Jun 15, 1993
- Hitachi, Ltd.
- Toru Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array spreading resistance probe (ASRP) method for profile extracti...
- Patent number 5,217,907
- Issue date Jun 8, 1993
- National Semiconductor Corporation
- Constantin Bulucea
- G01 - MEASURING TESTING
Information Patent Grant
Method of making electrostatic discharge protection for semiconduct...
- Patent number 5,166,089
- Issue date Nov 24, 1992
- Texas Instruments Incorporated
- Kueing D. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the smooth fine classification of varactor diodes
- Patent number 5,102,818
- Issue date Apr 7, 1992
- Deutsche ITT Industries GmbH
- Klaus Paschke
- G01 - MEASURING TESTING
Information Patent Grant
Forming a physical structure on an integrated circuit device and de...
- Patent number 5,082,792
- Issue date Jan 21, 1992
- LSI Logic Corporation
- Nicholas F. Pasch
- G01 - MEASURING TESTING
Information Patent Grant
Method of producing a semiconductor laser adapted for use in an ana...
- Patent number 5,034,334
- Issue date Jul 23, 1991
- AT&T Bell Laboratories
- Edward J. Flynn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of monitoring semiconductor manufacturing processes and test...
- Patent number 4,963,500
- Issue date Oct 16, 1990
- Sera Solar Corporation
- George W. Cogan
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication of large power semiconductor composite by wafer interco...
- Patent number 4,816,422
- Issue date Mar 28, 1989
- General Electric Company
- Alexander J. Yerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Purging: a reliability assurance technique for semiconductor lasers...
- Patent number 4,573,255
- Issue date Mar 4, 1986
- AT&T Bell Laboratories
- Eugene I. Gordon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 4,137,122
- Issue date Jan 30, 1979
- U.S. Philips Corporation
- Gerard A. Acket
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming deposits from reactive gases
- Patent number 4,132,818
- Issue date Jan 2, 1979
- International Business Machines Corporation
- Ronald E. Chappelow
- C30 - CRYSTAL GROWTH
Information Patent Grant
3846167
- Patent number 3,846,167
- Issue date Nov 5, 1974
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3810796
- Patent number 3,810,796
- Issue date May 14, 1974
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3774088
- Patent number 3,774,088
- Issue date Nov 20, 1973
- G01 - MEASURING TESTING
Information Patent Grant
3725148
- Patent number 3,725,148
- Issue date Apr 3, 1973
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3676229
- Patent number 3,676,229
- Issue date Jul 11, 1972
- G01 - MEASURING TESTING
Information Patent Grant
3674995
- Patent number 3,674,995
- Issue date Jul 4, 1972
- G01 - MEASURING TESTING
Information Patent Grant
3666573
- Patent number 3,666,573
- Issue date May 30, 1972
- G01 - MEASURING TESTING
Information Patent Grant
3647581
- Patent number 3,647,581
- Issue date Mar 7, 1972
- H01 - BASIC ELECTRIC ELEMENTS

Testing steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming semiconductor devices using gate insulator thickn...

Semiconductor wafer evaluation method

Method and apparatus for preventing chip breakage during semiconduc...

Sensitive technique for metal-void detection

Semiconductor wafer evaluating method and semiconductor device manu...

Stress migration evaluation method

Method and apparatus for preventing chip breakage during semiconduc...

Method of making a real time ion implantation metal silicide monitor

Apparatus for and method of rapid testing of semiconductor componen...

Method of reducing dice testing with on-chip identification

Method for testing semiconductor devices

Method for manufacturing a semiconductor device including wafer agi...

Array spreading resistance probe (ASRP) method for profile extracti...

Method of making electrostatic discharge protection for semiconduct...

Method for the smooth fine classification of varactor diodes

Forming a physical structure on an integrated circuit device and de...

Method of producing a semiconductor laser adapted for use in an ana...

Method of monitoring semiconductor manufacturing processes and test...

Fabrication of large power semiconductor composite by wafer interco...

Purging: a reliability assurance technique for semiconductor lasers...

Method of manufacturing a semiconductor device

Method of forming deposits from reactive gases

3846167

3810796

3774088

3725148

3676229

3674995

3666573

3647581