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3184830
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Information
Patent Grant
3184830
References
Source
Patent Number
3,184,830
Date Filed
Not available
Date Issued
Tuesday, May 25, 1965
59 years ago
CPC
H05K3/3447 - Lead-in-hole components
H01R12/716 - Coupling device provided on the PCB
H05K3/3468 - Applying molten solder
H05K3/4038 - Through-connections or via connections
H05K3/4046 - using auxiliary conductive elements
H05K3/4611 - by laminating two or more circuit boards
H05K2201/0305 - Solder used for other purposes than connections between PCB or components
H05K2201/096 - Vertically aligned vias, holes or stacked vias
H05K2201/09845 - Stepped hole, via, edge, bump or conductor
H05K2201/10189 - Non-printed connector
H05K2201/10303 - Pin-in-hole mounted pins
H05K2201/10939 - Lead of component used as a connector
H05K2203/044 - Solder dip coating, i.e. coating printed conductors
H05K2203/045 - Solder filled PTH during processing
Y10T29/49149 - by metal fusion bonding
US Classifications
029 - Metal working
174 - Electricity: conductors and insulators
228 - Metal fusion bonding
439 - Electrical connectors
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