3291578

Information

• Patent Grant
• 3291578

• References
• Source

• Patent Number

  3,291,578

• Date Filed

  Not available

• Date Issued

  Tuesday, December 13, 1966
  58 years ago

• CPC

  • H01L24/83 - using a layer connector
  • B22F7/062 - involving the connection or repairing of preformed parts
  • C03C17/06 - with metals
  • C04B35/632 - Organic additives
  • C04B35/63432 - Polystyrenes
  • C04B35/653 - Processes involving a melting step
  • C04B37/006 - consisting of metals or metal salts
  • C04B37/008 - by means of an interlayer consisting of an organic adhesive
  • C04B37/028 - by means of an interlayer consisting of an organic adhesive
  • C04B41/009 - characterised by the material treated
  • C04B41/5138 - with a composition mainly composed of Mn and Mo
  • C04B41/52 - Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
  • C04B41/88 - Metals
  • C04B41/89 - for obtaining at least two superposed coatings having diffferent compositions
  • C22C27/04 - Alloys based on tungsten or molybdenum
  • C22C32/00 - Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds
  • H01B1/00 - Conductors or conductive bodies characterised by the conductive materials Selection of materials as conductors
  • H01L24/26 - Layer connectors
  • H01L24/81 - using a bump connector
  • B22F2998/00 - Supplementary information concerning processes or compositions relating to powder metallurgy
  • C03C2217/263 - Metals other than noble metals, Cu or Hg
  • C03C2218/17 - from a solid phase
  • C04B2111/00844 - for electronic applications
  • C04B2237/12 - Metallic interlayers
  • C04B2237/122 - based on refractory metals
  • C04B2237/125 - based on noble metals
  • C04B2237/128 - The active component for bonding being silicon
  • C04B2237/16 - Silicon interlayers
  • C04B2237/32 - Ceramic
  • C04B2237/343 - Alumina or aluminates
  • C04B2237/52 - Pre-treatment of the joining surfaces
  • C04B2237/555 - on a substrate not containing an interlayer coating, leading to the formation of an interlayer coating
  • C04B2237/68 - Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size
  • C04B2237/72 - Forming laminates or joined articles comprising at least two interlayers directly next to each other
  • C04B2237/86 - Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not
  • H01L2224/81801 - Soldering or alloying
  • H01L2224/8319 - Arrangement of the layer connectors prior to mounting
  • H01L2224/8385 - using a polymer adhesive
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01025 - Manganese [Mn]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01051 - Antimony [Sb]
  • H01L2924/01052 - Tellurium [Te]
  • H01L2924/01072 - Hafnium [Hf]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/0132 - Binary Alloys
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/01327 - Intermediate phases
  • H01L2924/014 - Solder alloys
  • H01L2924/07802 - not being an ohmic electrical conductor
  • H01L2924/15787 - Ceramics
  • Y10S428/936 - Chemical deposition
  • Y10S428/939 - Molten or fused coating
  • Y10T428/12056 - Entirely inorganic
  • Y10T428/12083 - Nonmetal in particulate component
  • Y10T428/12139 - Nonmetal particles in particulate component
  • Y10T428/12528 - Semiconductor component
  • Y10T428/12618 - Plural oxides
  • Y10T428/1266 - O, S, or organic compound in metal component

• US Classifications

  • 428 - Stock material or miscellaneous articles
  • 075 - Specialized metallurgical processes, compositions for use therein, consolidated metal powder compositions, and loose metal particulate mixtures
  • 257 - Active solid-state devices