3347442

Information

• Patent Grant
• 3347442

• References
• Source

• Patent Number

  3,347,442

• Date Filed

  Not available

• Date Issued

  Tuesday, October 17, 1967
  57 years ago

• CPC

  • H01L21/67138 - Apparatus for wiring semiconductor or solid state device
  • H01L24/48 - of an individual wire connector
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01L24/85 - using a wire connector
  • H01L24/45 - of an individual wire connector
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48091 - Arched
  • H01L2224/4823 - connecting the wire to a pin of the item
  • H01L2224/48472 - the other connecting portion not on the bonding area also being a wedge bond
  • H01L2224/78313 - Wedge
  • H01L2224/78315 - of the pressing surface
  • H01L2224/85181 - connecting first on the semiconductor or solid-state body
  • H01L2224/85205 - Ultrasonic bonding
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • Y10T29/49162 - by using wire as conductive path
  • Y10T29/49169 - Assembling electrical component directly to terminal or elongated conductor
  • Y10T29/49179 - by metal fusion bonding

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working
  • 221 - Article dispensing
  • 257 - Active solid-state devices