3656228

Information

• Patent Grant
• 3656228

• References
• Source

• Patent Number

  3,656,228

• Date Filed

  Not available

• Date Issued

  Tuesday, April 18, 1972
  52 years ago

• CPC

  • H01L24/01 - Means for bonding being attached to, or being formed on, the surface to be connected
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/308 - using masks
  • H01L23/488 - consisting of soldered or bonded constructions
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01057 - Lanthanum [La]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/10253 - Silicon [Si]
  • H01L2924/12036 - PN diode
  • Y10S148/054 - Flat sheets-substrates
  • Y10S438/978 - forming tapered edges on substrate or adjacent layers

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment
  • 257 - Active solid-state devices