3888639

Information

• Patent Grant
• 3888639

• References
• Source

• Patent Number

  3,888,639

• Date Filed

  Not available

• Date Issued

  Tuesday, June 10, 1975
  49 years ago

• CPC

  • H05K3/363 - by soldering
  • H05K3/3447 - Lead-in-hole components
  • H05K3/28 - Applying non-metallic protective coatings
  • H05K3/305 - Affixing by adhesive
  • H05K3/3468 - Applying molten solder
  • H05K3/4038 - Through-connections or via connections
  • H05K3/4046 - using auxiliary conductive elements
  • H05K3/4611 - by laminating two or more circuit boards
  • H05K2201/0305 - Solder used for other purposes than connections between PCB or components
  • H05K2201/041 - Stacked PCBs
  • H05K2201/096 - Vertically aligned vias, holes or stacked vias
  • H05K2201/09845 - Stepped hole, via, edge, bump or conductor
  • H05K2201/10477 - Inverted
  • H05K2201/10939 - Lead of component used as a connector
  • H05K2201/10977 - Encapsulated connections
  • Y10T29/49126 - Assembling bases

• US Classifications

  • 029 - Metal working
  • 174 - Electricity: conductors and insulators
  • 228 - Metal fusion bonding
  • 361 - Electricity: electrical systems and devices