3926746

Information

• Patent Grant
• 3926746

• References
• Source

• Patent Number

  3,926,746

• Date Filed

  Not available

• Date Issued

  Tuesday, December 16, 1975
  49 years ago

• CPC

  • C04B41/009 - characterised by the material treated
  • C04B41/5116 - Ag or Au
  • C04B41/88 - Metals
  • H01B5/14 - comprising conductive layers or films on insulating-supports
  • H01L21/4846 - Leads on or in insulating or insulated substrates
  • H01L23/49805 - the leads being also applied on the sidewalls or the bottom of the substrate
  • H05K3/403 - Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
  • H05K1/092 - Dispersed materials
  • H05K3/0052 - Depaneling
  • H05K3/242 - characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
  • H05K3/245 - Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
  • H05K3/3442 - having edge contacts
  • H05K3/4061 - for via connections in inorganic insulating substrates
  • H05K2203/0723 - Electroplating
  • Y10S148/069 - Green sheets
  • Y10T29/49799 - Providing transitory integral holding or handling portion

• US Classifications

  • 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions
  • 029 - Metal working
  • 148 - Metal treatment
  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 257 - Active solid-state devices
  • 361 - Electricity: electrical systems and devices
  • 427 - Coating processes
  • 438 - Semiconductor device manufacturing: process