Claims
- 1. A surface mount device for mounting on a printed circuit board, said surface mount device comprising:
- a mechanically unyielding substrate;
- mechanically unyielding terminations partially covering a surface of said substrate and extending inconsequentially from said surface;
- spacers integral to said surface mount device for holding said terminations a defined and reproducible distance from said printed circuit board; and
- solder barriers formed from said substrate between adjacent terminations.
- 2. The surface mount device of claim 1 wherein said solder barriers are comprised by bump-like protrusions extending from said surface.
- 3. The surface mount device of claim 1 wherein said solder barriers are comprised by grooves extending into said surface of said substrate.
- 4. The surface mount device of claim 3 further comprising a resistor network formed upon said substrate.
- 5. The surface mount device of claim 3 wherein said substrate is comprised by a ceramic composition.
- 6. The surface mount device of claim 5 wherein said terminations are comprised by a cermet glaze.
- 7. An electrical device comprising:
- a resistor network having a plurality of resistors carried upon a mechanically unyielding network substrate, said resistors terminated through mechanically unyielding network terminations formed upon said network substrate in coplanar relation and separated therebetween by isolation means;
- a carrier substrate having a pattern of electrical connectors electrically interconnected to said resistor network terminations through a solder composition;
- said resistor network further comprising integral spacers protruding from said network substrate maintaining a defined and reproducible spacing between said resistor network terminations and said carrier substrate;
- said solder composition forming controlled fillets from said network to said carrier substrate and deforming elastically on differing motion between said resistor network and said carrier substrate;
- said isolation means enhancing electrical and physical isolation between adjacent fillets.
- 8. The electrical device of claim 7 wherein said network terminations are composed of a cermet glaze.
- 9. The electrical device of claim 8 wherein said network substrate is composed of a ceramic material.
- 10. The electrical device of claim 7 wherein said network substrate is composed of a ceramic material.
- 11. The electrical device of claim 7 wherein said isolation means provide spaces that separate said terminations and further allow visual inspection and cleaning therebetween.
- 12. The electrical device of claim 7 further comprised by resistor network terminations forming two parallel lines, said isolation means formed along lines perpendicular to and parallel to said network terminations.
- 13. The electrical device of claim 7 wherein said solder composition is fluent when in a molten state and otherwise substantially non-fluent.
Parent Case Info
This application is a file-wrapper continuation of application Ser. No. 08/074,039 filed Jun. 1, 1993, now abandoned; which is a file-wrapper continuation of application Ser. No. 08/603,912 filed Oct. 25, 1990, now abandoned.
US Referenced Citations (25)
Foreign Referenced Citations (5)
Number |
Date |
Country |
2223262 |
Nov 1972 |
DEX |
59-45985 |
Mar 1984 |
JPX |
2-30169 |
Jan 1990 |
JPX |
2-177464 |
Jul 1990 |
JPX |
2249746 |
May 1992 |
GBX |
Non-Patent Literature Citations (2)
Entry |
IBM Technical Disclosure Bulletin "Solderless Multi-Chip Module Attachment In Vertical Fashion" vol. 33 No. 4 Sep. 1990. |
IBM Disclosure Bulletin "Pin-Brazing Apparatus with Thermal Gas Pin-Preloading System" by Balder et al. vol. 26 No. 8 Jan. 1984. |
Continuations (2)
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Number |
Date |
Country |
Parent |
74039 |
Jun 1993 |
|
Parent |
603912 |
Oct 1990 |
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