Circuit Board Structure Having Capacitor Array and Embedded Electronic Component and Method for Fabricating the Same

Abstract

A circuit board structure having a capacitor array and an embedded electronic component and a method for fabricating the same are proposed. Two carrier boards and a high dielectric constant material layer are provided, wherein the carrier boards have electronic components embedded therein and one surface of each carrier board has a plurality of electrode plates. The two carrier boards are laminated with the dielectric constant material layer interposed between them. The electrode plates on the surfaces of the carrier boards are opposite to each other across the high dielectric constant material layer to constitute a capacitor array. Therefore, the capacitor assembly for design of electronic devices is provided.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading the following detailed description of the preferred embodiments, with reference made to the accompanying drawings, wherein: FIG. 1 (PRIOR ART) is a schematic diagram showing a passive component being disposed in a region outside the chip-mounting region on the circuit board in a prior art.

FIGS. 2A and 2B are schematic cross-sectional views showing a method of forming a circuit board having a capacitor array and embedded electronic components of the present invention;

FIG. 3 is a schematic diagram showing a capacitor array in the circuit board having a capacitor array and embedded electronic components of the invention; and

FIG. 4 is a schematic cross-sectional view showing a circuit board having a capacitor array and embedded electronic components in accordance with another preferred embodiment of the invention.

Claims

1. A method of forming a circuit board having a capacitor array and embedded electronic components, comprising the steps of: providing two carrier boards and a high dielectric constant material layer, in which the carrier boards have embedded electronic components therein and a plurality of electrode plates on one surface of the carrier boards; andlaminating the carrier boards having high dielectric constant material layer interposed in between in a way that the electrode plates on the surface of one carrier board are facing towards the electrode plates on the other carrier board separated by the high dielectric constant material layer, so as to form a capacitor array.

2. The method of forming a circuit board having a capacitor array and embedded electronic components of claim 1, wherein a circuit build-up structure is formed on the other side of the carrier board, allowing the circuit build-up structure to be electrically conductive to the electronic components and electrode plates of the carrier boards and the outermost surface of the circuit build-up structure has electrically conductive pads.

3. The method of forming a circuit board having a capacitor array and embedded electronic components of claim 2, wherein the circuit build-up structure comprises dielectric layers, circuit layers formed on the dielectric layers and conductive structures formed in the dielectric layers.

4. The method of forming a circuit board having a capacitor array and embedded electronic components of claim 3 further comprising forming a insulating protection layer on the surface of the circuit build-up structure, wherein the insulating protection layer has openings to expose the electrically conductive pads thereto.

5. The method of forming a circuit board having a capacitor array and embedded electronic components of claim 2 further comprising forming a plurality of plated through hole in the carrier boards, high dielectric constant material layers and circuit build-up structure allowing the carrier boards to be electrically conductive to the circuit build-up structure.

6. The method of forming a circuit board having a capacitor array and embedded electronic components of claim 1, wherein the electrode plates are electrically conductive to each other by the conductive structures in the carrier boards.

7. The method of forming a circuit board having a capacitor array and embedded electronic components of claim 6, wherein the conductive structures are conductive vias or plated through holes.

8. The method of forming a circuit board having a capacitor array and embedded electronic components of claim 6, wherein the conductive structures act as positive/negative electrodes of the capacitors, allowing the capacitors to be electrically conductive to each other in parallel or in series.

9. The method of forming a circuit board having a capacitor array and embedded electronic components of claim 1, wherein the high dielectric constant material is selected from a material selected from a group comprising polymer, ceramic material, ceramic filled polymer or similar material.

10. A circuit board having a capacitor array and embedded electronic components, comprising: a high dielectric constant material layer; andcarrier boards formed on the top and bottom surface of the high dielectric constant material layer, in which a plurality of electrode plates are formed on one surface thereof, and the electrode plates on one carrier board are facing towards the electrode plates on the other carrier board, separated by the high dielectric constant material layer, so as to form a capacitor array.

11. The circuit board having a capacitor array and embedded electronic components of claim 10, wherein a circuit build-up structure is formed on the other side of the carrier board, allowing the circuit build-up structure to be electrically conductive to the electronic components and electrode plates of the carrier boards and the outermost surface of the circuit build-up structure has electrically conductive pads.

12. The circuit board having a capacitor array and embedded electronic components of claim 11, wherein the circuit build-up structure comprises dielectric layers, circuit layers formed on the dielectric layers and conductive structures formed in the dielectric layers.

13. The circuit board having a capacitor array and embedded electronic components of claim 12 further comprising forming an insulating protection layer on the surface of the circuit build-up structure, wherein the insulating protection layer has openings to expose the electrically conductive pads thereto.

14. The circuit board having a capacitor array and embedded electronic components of claim 11 further comprising forming a plurality of plated through hole in the carrier boards, high dielectric constant material layers and circuit build-up structure allowing the carrier boards to be electrically conductive to the circuit build-up structure.

15. The circuit board having a capacitor array and embedded electronic components of claim 10, wherein the electrode plates are electrically conductive to each other by the conductive structures in the carrier boards.

16. The circuit board having a capacitor array and embedded electronic components of claim 15, wherein the conductive structures are conductive vias or plated through holes.

17. The circuit board having a capacitor array and embedded electronic components of claim 15, wherein the conductive structures act as positive/negative electrodes of the capacitors, allowing the capacitors to be electrically conductive to each other in parallel or in series.

18. The circuit board having a capacitor array and embedded electronic components of claim 10, wherein the high dielectric constant material is selected from a material selected from a group comprising polymer, ceramic material, ceramic filled polymer or similar material.