Claims
- 1. A method for routing an interconnect structure to a target area arranged on an insulative structure comprising the steps of:
- positioning an interconnect bonding pad upon an upper structure of the insulative structure;
- extending a plated hole entirely between the upper surface and a lower surface of the insulative structure;
- connecting the plated hole to the interconnect bonding pad on the upper surface and to a test pad on the lower surface;
- extending a signal via from the upper surface to one of a plurality of conductors buried within the insulative structure;
- connecting the signal via to the interconnect bonding pad on the upper surface;
- positioning a potential bonding pad on the upper surface spaced apart from the interconnect bonding pad;
- extending a potential via between the upper surface and a potential conductor buried within the insulative structure;
- connecting the potential via to the potential bonding pad on the upper surface; and
- bonding opposing ends of an electrical component between the interconnect bonding pad and the potential bonding pad.
- 2. The method as recited in claim 1, comprising the further steps of:
- connecting a flywire to the plated hole in the interconnect structure; and
- connecting the flywire to the target area.
- 3. The method as recited in claim 2, comprising the further step of:
- electrically contacting the test pad with a test probe to test a reroute signal across the flywire.
Parent Case Info
This is a divisional of copending application Ser. No. 08/257,402 filed on Jun. 9, 1994.
US Referenced Citations (9)
Non-Patent Literature Citations (1)
Entry |
Research Disclosure No. 31769, Sep. 1990, p. 757. |
Divisions (1)
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Number |
Date |
Country |
Parent |
257402 |
Jun 1994 |
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