Patent Application
20140001471
1. Field of the Invention
The present invention relates generally to a conformal shielding module, and more particularly to a conformal shielding module which can allow an in-circuit test to be performed on internal electronic components.
2. Description of the Related Art
Referring to
However, in the conventional design, all of the electronic components 4 are sealed by the molding compound 2, so the electronic components 4 inside the molding compound 2 cannot be tested separately. When the tester tests and finds there is something wrong within the packaging module, the tester must destroy the packaging module 1, before conducting damage analysis, to identify the problem. Thus, the conventional conformal shielding module 1 indeed needs improvement in structure.
The primary objective of the present invention is to provide a conformal shielding module which can allow an in-circuit test to be performed on internal electronic components without removal of the molding compound.
The foregoing objective of the present invention is attained by the conformal shielding module comprising a substrate, at least one electronic component, a molding compound, and an electrically conductive structure. The at least one electronic component is mounted to a surface of the substrate. The molding compound is perfused on the surface of the substrate to cover the at least one electronic component for protecting the at least one electronic component. A vertical channel is formed inside the molding compound to run therethrough, extending to the at least one electronic component from a surface of the molding compound. The electrically conductive structure is disposed to the vertical channel and electrically connected with the at least one electronic component to form a testing contact on the surface of the molding compound in such a way that the tester can conveniently apply in-circuit test to the at least one electronic component via the testing contact.
In the conformal shielding module of the present invention, an electromagnetically shielding layer can be disposed on the surface of the molding compound for providing electromagnetic shielding effect. Besides, the molding compound includes a concavity formed on the surface thereof and communicating with the vertical channel. The testing contact of the electrically conductive structure is formed inside the concavity for avoiding short circuit with the electromagnetically shielding layer.
Referring to
The substrate 12 is structurally identical to that of the conventional multi-layer printed circuit board. All of the electronic components 14 are mounted to a surface of the substrate 12 to be electrically connected with the substrate 12. At least one testing point 121 can be additionally mounted on the surface of the substrate 12 where this surface faces the molding compound 16.
The molding compound 16 is perfused on the surface of the substrate 12 to cover the electronic components 14 for protecting the electronic components 14. A plurality of vertical channels 162 are formed inside the molding compound 16 by laser scribing or chemical etching according to the number of the electronic components 14 to be tested, each extending to the electronic component 14 or to the testing point 121 from the surface of the molding compound 16.
The electrically conductive structure 18 is provided with a mask (not shown) having a predetermined pattern formed thereon by means of metal sputtering, spray coating, or another coating manner and disposed inside the vertical channels 162 of the molding compound 16. In this way, one end of the electrically conductive structure 18 is electrically connected with the electronic components 14 to be tested or with the testing point 121 and the other end defines a testing contact 182 on the surface of the molding compound 16 for a testing probe (not shown) to contact.
When the tester intends to conduct a damage analysis, the tester only needs to make the testing probe contact the testing contact 182 and then basic in-circuit test can be applied to the electronic components 14 or the testing point 121 to be tested. And meanwhile, the tester can be aware of which of the electronic components 14 is problematic or identify whether the substrate 12 functions normally or not. Thus, it will not be necessary to remove the molding compound 16 or destroy the whole module and the prior art can be effectively improved.
It is to be noted that the electronic components 14 to be tested are not limited to those indicated in the first embodiment of the present invention but some or all of the electronic components 14; besides, the substrate 12 can optionally exclude any testing point 121 thereon according to the actual requirement of the technician in the art.
Referring to
Referring to
The section of the concavity 266 is not limited to a rectangle in shape but can be a trapezoid in which a top side (open) thereof is bigger than a bottom side thereof, as shown in
It is to be noted that the conformal shielding module 20 of this embodiment can employ the testing contacts 282 and one semiconductor device 30 stacked on a top side of the conformal shielding module 20 for electric connection to further constitute a stacked package 40, as shown in
In light of the vertical channels and the electrically conductive structure of the conformal shielding module of the present invention, the in-circuit test of the electronic components can be quickly finished without removal of the molding compound and whatever the problem happens can be easily located to effectively enhance the efficiency of the packaging process.
Although the present invention has been described with respect to specific preferred embodiments thereof, it is in no way limited to the specifics of the illustrated structures but changes and modifications may be made within the scope of the appended claims.
