Claims
- 1. A method for making an integrated circuit device, comprising the steps of:
- forming solder pads on the bottom side of a chip carrier;
- forming corresponding solder pads on the top side of a mother board;
- positioning the chip carrier on the mother board so that the solder pads of the chip carrier are adjacent the corresponding solder pads of the mother board;
- heating the solder pads to melt the solder and join the corresponding solder pads; and
- circulating solvent between the chip carrier and the mother board through an opening in the mother board.
- 2. The method of claim 1, wherein the step of circulating solvent through an opening in the mother board is accomplished by dipping the mother board into a circulating solution of organic solvent.
- 3. The method of claim 1, wherein the step of circulating solvent through an opening in the mother board is accomplished by exposing the mother board to organic solvent fumes.
Priority Claims (1)
Number |
Date |
Country |
Kind |
53-153950 |
Nov 1978 |
JPX |
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Parent Case Info
This application is a division of application Ser. No. 201,484, filed June 23, 1980, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3777220 |
Tatusko et al. |
Dec 1973 |
|
3794886 |
Goldman |
Feb 1974 |
|
Non-Patent Literature Citations (1)
Entry |
Separating Semi-Conductor Devices from Supporting Substrates, Roush and Sullivan, IBM Tech. Discl. Bull., vol. 16, No. 1, Jun. 1973, p. 41. |
Divisions (1)
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Number |
Date |
Country |
Parent |
201484 |
Jun 1980 |
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