Claims
- 1. A method of processing a substrate, comprising:
a) positioning the substrate in an electrolyte solution a first distance from a permeable disc disposed in the electrolyte; b) applying a current to a surface of the substrate exposed to the electrolyte and depositing a material on the substrate; and c) positioning the substrate a second distance from the permeable disc, the second distance being less than the first distance.
- 2. The method of claim 1, wherein the electrolyte is a copper containing solution.
- 3. The method of claim 2, wherein less than 5000 angstroms of material is deposited at the first distance.
- 4. The method of claim 1, wherein the current is applied in a range from about 20 amps or less.
- 5. The method of claim 1, wherein the permeable disc is a polishing pad.
- 6. The method of claim 5, wherein applying the current to the substrate comprises the use of a pulse plating technique.
- 7. The method of claim 1, wherein the first distance is between about 1 mm and about 5 mm.
- 8. The method of claim 7, wherein the second distance is less than about 100 μm.
- 9. The method of claim 7, wherein the substrate and the permeable disk are in contact at the second distance.
- 10. The method of claim 1, further comprising transferring the substrate to a polishing apparatus.
- 11. The method of claim 9, wherein the permeable disk exerts a pressure on the substrate of about 2 psi or less at the second distance.
- 12. The method of claim 1, wherein the current is applied in a range between about 0.5 amps and about 5.0 amps.
- 13. A method of processing a substrate, comprising:
positioning the substrate in an electrolyte solution a first distance from a permeable disc disposed in the electrolyte; and applying a current to a surface of the substrate exposed to the electrolyte and depositing a material on the substrate.
- 14. The method of claim 13, wherein the electrolyte is a copper containing solution.
- 15. The method of claim 13, wherein less than 5000 angstroms of material is deposited at the first distance.
- 16. The method of claim 13, wherein the current is applied in a range from about 20 amps or less.
- 17. The method of claim 13, wherein the permeable disc is a polishing pad.
- 18. The method of claim 13, further comprising transferring the substrate to a polishing apparatus.
- 19. The method of claim 13, wherein the current is applied in a range between about 0.5 amps and about 5.0 amps.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of co-pending U.S. patent application Ser. No. 09/739,139, filed Dec. 18, 2000. The aforementioned related patent application is herein incorporated by reference.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09739139 |
Dec 2000 |
US |
Child |
10792069 |
Mar 2004 |
US |