Claims
- 1. In a leadframe comprising a single frame structure for supporting leads on IC chips, the improvement wherein the leadframe is made of a high-strength, high-electroconductivity copper alloy, the copper alloy being made by a process which comprises preparing an ingot of a copper alloy consisting essentially of 0.05-0.40 wt. % Fe, 005-040 wt. % Ni, 0.01-0.30 wt. % P and the balance being Cu and incidental impurities, heating the ingot to a temperature of 800 to 950.degree. C. and hot working the ingot to a reduction ratio of 50% or more, quenching the resultant hot worked material at a temperature from 600.degree. C. or above down to a temperature of 300.degree. C. or below at a cooling rate of at least 1.degree. C./second, heat treating the resultant quenched material at a temperature of 380 to 520.degree. C. for 60-600 minutes without performing cold working, and subsequently performing cold working and a heat treatment at a temperature of 450.degree. C. or below, said high-strength, high-electroconductivity copper alloy having contained therein an Fe--Ni--P system intermetallic compound which is precipitated in a Cu matrix as uniform and fine grains not larger than 50 nanometers, said high-strength, high-electroconductivity copper alloy having a Vicker's hardness (Hv) of 163 or more, a tensile strength of 534 N/mm.sup.2 or more, an electrical conductivity of 69.8% IACS or more and a superior amenability to bending work.
- 2. In a leadframe comprising a single frame structure for supporting leads on IC chips, the improvement wherein the leadframe is made of a high-strength, high-electroconductivity copper alloy, the copper alloy being made by a process that comprises preparing an ingot of a copper alloy consisting essentially of 0.05-0.40 wt. % Fe, 0.05-0.40 wt. % Ni, 0.01-0.30 wt. % P, a total of 0.03-0.50 wt. % of at least one metal selected from the group consisting of Sn and Zn, and the balance being Cu and incidental impurities, heating the ingot to a temperature of 800 to 950.degree. C. and hot working the ingot to a reduction ratio of 50% or more, quenching the resultant hot worked material at a temperature from 600.degree. C. or above down to a temperature of 300.degree. C. or below at a cooling rate of at least 1.degree. C./second, heat treating the resultant quenched material at a temperature of 380 to 520.degree. C. for 60-600 minutes without performing cold working, and subsequently performing cold working and a heat treatment at a temperature of 450.degree. C. or below, said high-strength, high-electroconductivity copper alloy having contained therein an Fe--Ni--P system intermetallic compound which is precipitated in a Cu matrix as uniform and fine grains not larger than 50 nanometers, said high-strength, high-electroconductivity copper alloy having a Vicker's hardness (Hv) of 163 or more, a tensile strength of 534 N/mm.sup.2 or more, an electrical conductivity of 69.8% IACS or more and a superior amenability to bending work.
- 3. In a leadframe comprising a single frame structure for supporting leads on IC chips, the improvement wherein the leadframe is made of a high-strength, high-electroconductivity copper alloy consisting essentially of 0.05-0.40 wt. % Fe, 0.05-0.40 wt. % Ni, 0.01-0.30 wt. % P, a total of 0.03-0.50 wt. % of at least one metal selected from the group consisting of Sn and Zn and a total of 0.05-0.50 wt. % of at least one element selected from the group consisting of Ag, Co, B, Mn, Cr, Si, Ti and Zr, with the balance being Cu and incidental impurities, heating the ingot to a temperature of 800 to 950.degree. C. and hot working the ingot to a reduction ratio of 50% or more, quenching the resultant hot worked material from a temperature of 600.degree. C. or above down to a temperature of 300.degree. C. or below at a cooling rate of at least 1.degree. C./second, heat treating the resultant quenched material at a temperature of 380 to 520.degree. C. for 60-600 minutes without performing cold working, and subsequently performing cold working and a heat treatment at a temperature of 450.degree. C. or below, said high-strength, high-electroconductivity copper alloy having contained therein an Fe--Ni--P system intermetallic compound which is precipitated in a Cu matrix as uniform and fine grains not larger than 50 nanometers, said high-strength, high-electroconductivity copper alloy having a Vicker's hardness (Hv) of 163 or more, a tensile strength of 534 N/mm.sup.2 or more, an electrical conductivity of 69.8% IACS or more and a superior amenability to bending work.
- 4. In a leadframe comprising a single frame structure for supporting leads on IC chips, the improvement wherein the leadframe is made of a high-strength, high-electroconductivity copper alloy, the copper alloy being made by a process which comprises preparing an ingot of a copper alloy consisting essentially of 0.05-0.40 wt. % Fe, 0.05-0.40 wt. % Ni, 0.01-0.30 wt. % P and optionally a total of 0.03-0.50 wt. % of at least one metal selected from the group consisting of Sn and Zn and a total of 0.05-0.50 wt. % of at least one element selected from the group consisting of Ag, Co, B, Mn, Cr, Si, Ti and Zr, with the balance being Cu and incidental impurities, heating the ingot to a temperature of 800 to 950.degree. C. and hot working the ingot to a reduction ratio of 50% or more, quenching the resultant hot worked material from a temperature of 600.degree. C. or above down to a temperature of 300.degree. C. or below at a cooling rate of at least 1.degree. C./second, heat treating the quenched material at a temperature of 380 to 520.degree. C. for 60-600 minutes without performing cold working, and subsequently performing cold working an a heat treatment at a temperature of 450.degree. C. or below, whereby an Fe--Ni--P system intermetallic compound is precipitated in a Cu matrix as uniform and fine grains not larger than 50 nanometers, said high-strength, high-electroconductivity copper alloy having a Vicker's hardness (Hv) of 163 or more, a tensile strength of 534 N/mm.sup.2 or more, an electrical conductivity of 69.8% IACS or more and a superior amenability to bending work.
- 5. In a leadframe comprising a single frame for supporting leads on IC chips, the improvement wherein the leadframe is made of a high-strength, high-electroconductivity copper alloy, the copper alloy being made by a process which comprises heating an ingot of a copper alloy consisting essentially of 0.1-0.3 wt. % Fe, 0.1-0.3 wt. % Ni, 0.03-0.1 wt. % P, and optionally (i) a total of 0.03-0.5 wt. % of at least one metal selected from the group consisting of Sn and Zn and (ii) a total of 0.05-0.5 wt. % of at least one element selected from the group consisting of Ag, Co, B, Mn, Cr, Si, Ti and Zr, with the balance being Cu and incidental impurities, to a temperature of 800 to 950.degree. C. and hot working to a reduction ratio of 50% or more to form a reduced thickness ingot, quenching the resultant hot worked reduced thickness ingot from a temperature of 600.degree. C. or above down to a temperature of 300.degree. C. or below at a cooling rate of at least 1.degree. C./second, heat treating the resultant quenched reduced thickness ingot at a temperature of 380 to 520.degree. C. for 60-600 minutes without performing cold working, and subsequently performing cold working and a heat treatment at a temperature of 450.degree. C. or below, whereby an Fe--Ni--P system intermetallic compound is precipitated in a Cu matrix as uniform and fine grains not lager than 50 nanometers, said high-strength, high-electroconductivity copper alloy having a Vicker's hardness (Hv) of 163 or more, a tensile strength of 534 N/mm.sup.2 or more, an electrical conductivity of 69.8% IACS or more and a superior amenability to bending work.
- 6. The leadframe of claim 5, wherein said copper alloy does not contain more than 30 ppm of oxygen.
- 7. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.121 wt. % Fe, 0.146 wt. % Ni, 0.052 wt. % P, 0.042 wt. % B, 0.057 wt. % Ti and the balance being essentially Cu.
- 8. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.154 wt. % Fe, 0.152 wt. % Ni, 0.043 wt. % P, 0.082 wt. % Sn, 0.054 wt. % Ag and the balance being essentially Cu.
- 9. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.202 wt. % Fe, 0.159 wt. % Ni, 0.060 wt. % P and the balance being essentially Cu.
- 10. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.202 wt. % Fe, 0.159 wt. % Ni, 0.060 wt. % P, 0.069 Sn and the balance being essentially Cu.
- 11. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.219 wt. % Fe, 0.163 wt. % Ni, 0.071 wt. % P, 0.057 wt. % Sn, 0.042 wt. % Zn and the balance being essentially Cu.
- 12. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.321 wt. % Fe, 0.259 wt. % Ni, 0.069 wt. % P, 0.054 wt. % Sn, 0.105 wt. % Si and the balance being essentially Cu.
- 13. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.321 wt. % Fe, 0.259 wt. % Ni, 0.093 wt. % P, 0.054 wt. % Cr, 0.045 wt. % Zr and the balance being essentially Cu.
- 14. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.389 wt. % Fe, 0.377 wt. % Ni, 0.102 wt. % P, 0.202 wt. % Co, 0.032 wt. % Mn and the balance being essentially Cu.
- 15. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.202 wt. % Fe, 0.159 wt, % Ni, 0.60 wt. % P, 0.069 wt. % Sn and the balance being essentially copper.
- 16. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.196 wt. % Fe, 0.152 wt, % Ni, 0.56 wt. % P, 0.070 wt. % Sn and the balance being essentially cu.
- 17. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.202 wt. % Fe, 0.157 wt, % Ni, 0.60 wt. % P, 0.069 wt. % Sn and the balance being essentially cu.
- 18. The leadframe of claim 5, wherein said copper alloy consists essentially of 0.201 wt. % Fe, 0.148 wt, % Ni, 0.65 wt. % P, 0.068 wt. % Sn and the balance being essentially cu.
- 19. The leadframe of claim 5, wherein the Vicker's hardness is 163 to 174, the tensile strength is 534 to 607 N/mm.sup.2 and the electrical conductivity is 69.8 to 78.3% IACS.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-287826 |
Oct 1995 |
JPX |
|
Parent Case Info
This is a division of application Ser. No. 08/662,695 filed Jun. 13, 1996, now U.S. Pat. No. 5,814,168.
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Divisions (1)
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Number |
Date |
Country |
Parent |
662695 |
Jun 1996 |
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