Claims
- 1. A semiconductor device comprising:a) a lead frame having an array of small mount pads elevated from the surface of a relatively large mount pad, b) a semiconductor circuit chip selectively affixed to the surface of the small pads with a minimal amount of adhesive, sufficient to cover said small pads only; c) bonding wires interconnecting the chip bond pads to the lead frame, and d) a molded resin encapsulation of the assemblage.
- 2. A semiconductor device as in claim 1 wherein said small mount pads are formed from, and are an integral part of the large pad.
- 3. A semiconductor device as in claim 1 wherein said large pad is downset from the plane of the internal lead frame leads, and the surfaces of the small pads are positioned about one-half of said downset distance above the large pad.
- 4. A semiconductor device as in claim 1 wherein the lead frame comprises a copper alloy.
- 5. A device as in claim 1 wherein said small pads form a direct heat path between the chip and the large pad.
- 6. A semiconductor device as in claim 1 wherein the elevated pads are arrayed in a square pattern.
- 7. A semiconductor device as in claim 1 wherein the elevated pads are arrayed in a triangular pattern.
- 8. A semiconductor device as in claim 1 wherein the elevated pads are arrayed in a linear pattern.
- 9. A semiconductor device as in claim 1 having a single centrally located small elevated pad.
- 10. A semiconductor device as in claim 1 wherein said chip area is equal to or greater than the outermost perimeter of the elevated pads, and is within the lead frame fingers.
- 11. A semiconductor device as in claim 1 wherein the assemblage comprises a Small Outline Package.
- 12. A semiconductor device as in claim 1 wherein assemblage comprises a Quad Flat Pack.
- 13. A semiconductor device as in claim 1 wherein the assemblage comprises a surface mounted package.
Parent Case Info
This application claims the benefit of Provisional application Ser. No. 60/179,183, filed Jan, 31, 2000.
US Referenced Citations (2)
Provisional Applications (1)
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Number |
Date |
Country |
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60/179183 |
Jan 2000 |
US |