For a better understanding of the present disclosure, reference is made to the accompanying drawings, which are incorporated herein by reference and in which:
The apparatus is described herein in connection with an ion implanter. However, the apparatus can be used with other processes involved in manufacturing that use a mask, such as plasma immersion, chemical vapor deposition, physical vapor deposition, or other processes known to those skilled in the art that utilize masking. Thus, the invention is not limited to the specific embodiments described below.
A block diagram of an ion implanter 100 in accordance with an embodiment of the invention is illustrated in
The ion implanter 100 may further include a mask transport system 2, a platen 13 to support a workpiece 12, and a controller 60. The mask 10 may be circular or other geometries and one embodiment of a circular mask 10 is illustrated in
The aperture 11 of
The mask 10 can be fabricated of a conductive material that minimizes contamination of the workpiece being implanted such as, for example, carbon fiber, silicon carbide, silicon, or graphite. As an example, a carbon fiber mask can have a thickness of 0.090 inch. In one specific example, the aperture 11 may have a relatively sharp edge at the boundary between the mask material and the aperture 11.
The mask transport system 2 may include a transfer arm 19 and a drive system 20. The transfer arm 19 is configured to retain and transport the mask 10. One or more retaining elements 21 of the transfer arm 19 may engage the mask 10 to retain the mask 10 on the transfer arm 19. The retaining element 21 may be mechanically activated or may be a fixed structure. The transfer arm 19 also defines a retaining plane 50. The drive system 20 may include motors, gear trains, linkages, and other components known in the art to drive the transfer arm 19 and hence the mask 10 when the mask 10 is retained on the transfer arm 19. At least three sensors 32a, 32b, and 32c are disposed on the transfer arm 19 and are configured to detect a position of the mask 10 relative to the retaining plane 50.
The sensors 32a, 32b, 32c may be equally spaced from each other in a triangular, circular, or other non-linear pattern. The sensors 32a, 32b, 32c may also be varying distances from each other in such patterns. The sensors 32a, 32b, 32c may be switches that when contacted by the blocking portion 17 of the mask 10 are activated to changes states. The switches, e.g., sub-miniature snap action switches in one embodiment, may have an open and closed position that is activated to change states when contacted. The sensors 32a, 32b, 32c may also be an electrical circuit having an open and closed state.
The sensors 32a, 32b, 32c may be configured to verify connections from the sensors to the controller 60. For example, one of the sensors 32a may be in a closed state when not contacted by the mask 10. The other two sensors 32b and 32c may be in an open state when not contacted by the mask 10. Thus, when the three sensors 32a, 32b, 32c are not in contact with mask 10, the sensors 32a, 32b, 32c would read one closed and two open. However, when the three sensors 32a, 32b, 32c are in contact with mask 10 in a proper masking position, the three sensors 32a, 32b, 32c would be activated to changes states to two closed and one open. This embodiment allows detection of when the three sensors 32a, 32b, 32c are not properly connected to the controller 60. For example, having all three sensors 32a, 32b, 32c in a closed state when not in contact with the mask 10 may give the same reading as three sensors 32a, 32b, 32c that have been inadvertently disconnected, or are otherwise not functioning correctly. Having one sensor 32a read opposite of the other two sensors 32b, 32c may allow confirmation that all three sensors 32a, 32b, 32c are connected and functioning.
Relative positions of the mask 10 and the workpiece 12 may be changed to implant different areas of the workpiece 12 through the aperture 11. The repositioning may be performed through re-orienting the workpiece 12, the mask 10, or both the workpiece 12 and the mask 10. In another embodiment, different masks may be used to implant different areas of the workpiece 12.
The mask transport system 2 may transport the mask 10 to and between a non-masking position 10′ and a masking position 10″. A non-masking position 10′ may be a storage location where the mask 10 has no effect on ions 15 implanted into the workpiece 10. The storage location may be inside or outside the process chamber. The masking position 10″ may be upstream from the workpiece where upstream and downstream are referenced in the direction of ion flow. In a proper masking position 10″, a surface of the mask is parallel with a support plane 52 defined by the front surface of the platen 13 that supports the workpiece 12.
The workpiece 12 may be a semiconductor wafer having a common disk shape. The mask 10 may be transported to the masking position 10″ and then retained in the masking position 10″ by one or more mask retaining elements 22. In one embodiment, the mask 10 may be spaced from a front surface of the platen 13 forming a gap 4 of sufficient size to permit a workpiece 12 to be loaded and unloaded from the platen 13 without contacting the mask 10. The workpiece 12 may be clamped to the platen 13 using known techniques, e.g., electrostatic wafer clamping where the wafer is clamped to the platen with electrostatic forces.
The controller 60 may include a general-purpose computer or network of general-purpose computers that may be programmed to perform desired input/output functions. The controller 60 may also include a processor and a machine readable medium. The processor may include one or more processors known in the art such as, for example, those commercially available from Intel Corporation. Machine readable medium may include one or more machine readable storage media, such as random-access memory (RAM), dynamic RAM (DRAM), magnetic disk (e.g., floppy disk and hard drive), optical disk (e.g., CD-ROM), and/or any other device that can store instructions for execution. The controller 60 may also include user interface devices such as touch screens, user pointing devices, displays, printers, etc. to allow a user to input commands and/or data and/or to monitor the ion implanter 100. The controller 60 may receive input data and instructions from any variety of systems and components including the sensors 32a, 32b, 32c, and may provide output signals to control other components of the ion implanter 100 in response thereto.
Turning to
When the mask 10 is properly engaged with the one or more retaining elements 21, a surface 302 of the mask 10 is parallel to the retaining plane 50 as illustrated in
When the mask 10 is not properly engaged with the one or more retaining elements 21, the surface 302 of the mask 10 is not parallel to the retaining plane 50 as illustrated in
Turning to
Once the mask 10 is physically coupled to the one or more mask retaining elements 22, the transfer arm 19 may then be retracted and extended by the drive system 20 in a direction indicated by arrows 402. The transfer arm 10 may be retracted a short distance so that all the sensors 32a, 32b, 32c no longer contact any portion of the mask 10. The transfer arm 19 may then be extended back towards the mask 10 until it contacts a portion of the mask 10 to determine if the mask 10 is properly positioned in the masking position.
In another embodiment, the three sensors 32a, 32b, 32c are included on a separate mechanism from the mask transport system 2. This separate mechanism may be another transfer arm. It may advance or retract to activate sensors 32a, 32b, 32c and may be stored to the side of the platen 13. In other embodiments, this separate transfer arm may be disposed on the platen 13 or a mechanical scanner and translated to test whether the mask 10 is properly positioned relative to a retaining plane defined by the transfer arm.
Turning to
The platen 13 is supported by the mechanical scanner 16. The mechanical scanner 16 may translate the workpiece 12 in one or two dimensions depending on the architecture of the ion implanter to distribute ions 15 over the front surface of workpiece 12. The mechanical scanner 16 may also tilt the platen 13 around a horizontal axis for angled implants or may rotate the platen 13 about a horizontal axis to a workpiece load/unload position. Additionally, the mechanical scanner 16 may translate platen 13 vertically during ion implantation. The mechanical scanner 16 may also move platen 13 upwardly with respect to mask 10 so that mask 10 or at least one finger 31 on the mask 10 may engage an associated mask retaining element 22.
The transfer arm 19 is driven by the drive system 20. The transfer arm 19 includes at least one retaining element 21 for engaging the mask during transport of the mask 10 between different positions. The three sensors 32a, 32b, 32c, may be radially disposed from a center 504 of the transfer arm a similar distance. The sensors 32a, 32b, 32c may also be disposed at a similar angle from each other with respect to the center 504 to form an equilateral triangle when joined by three lines.
Turning to
Accordingly, there is provided a transfer arm defining a retaining plane with at least three sensors disposed on the transfer arm and configured to detect a position of a mask relative to the retaining plane. The at least three sensors may be used to determine if the mask is properly positioned on the transfer arm for transport. Therefore, inadvertent disengagement of the mask from the transfer arm during transport can be minimized preventing damage to workpieces. In addition, proper positioning of the mask on the transfer arm can improve the likelihood of successfully placing the mask in other positions. The at least three sensors may also be used to determine if the mask is properly positioned in a masking position. Accordingly, implantation of ions with the mask in an improper masking position may be avoided thus minimizing deviation from an intended implant area.
The terms and expressions which have been employed herein are used as terms of description and not of limitation, and there is no intention, in the use of such terms and expressions, of excluding any equivalents of the features shown and described (or portions thereof), and it is recognized that various modifications are possible within the scope of the claims. Other modifications, variations, and alternatives are also possible. Accordingly, the foregoing description is by way of example only and is not intended as limiting.