Method of manufacturing semiconductor device

Abstract

A method for manufacturing a semiconductor device is provided, which includes feeding a coating liquid comprising a silicon-containing compound dissolved in a solvent onto a semiconductor substrate, revolving the semiconductor substrate to form a coated film containing the silicon-containing compound, feeding a rinsing liquid at least partially comprising α-pinene onto the underside of the semiconductor substrate to perform back-rinsing and washing of the underside of the semiconductor substrate, drying the semiconductor substrate that has been back-rinsed to remove the rinsing liquid, and heat-treating the semiconductor substrate to remove the solvent from the coated film to obtain an insulating film containing the silicon-containing compound.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a cross-sectional view illustrating a step in the method of manufacturing a semiconductor device according one embodiment of the present invention;

FIG. 2 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 1;

FIG. 3 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 2;

FIG. 4 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 3;

FIG. 5 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 4;

FIG. 6 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 5;

FIG. 7 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 6;

FIG. 8 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 7;

FIG. 9 is a cross-sectional view illustrating a step in the method of manufacturing a semiconductor device according another embodiment of the present invention;

FIG. 10 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 9;

FIG. 11 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 10;

FIG. 12 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 11;

FIG. 13 is a cross-sectional view illustrating a step in the method of manufacturing a semiconductor device according a further embodiment of the present invention;

FIG. 14 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 13;

FIG. 15 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 14;

FIG. 16 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 15;

FIG. 17 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 16;

FIG. 18 is a cross-sectional view illustrating a step in the method of manufacturing a semiconductor device according a further embodiment of the present invention;

FIG. 19 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 18;

FIG. 20 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 19;

FIG. 21 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 20;

FIG. 22 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 21;

FIG. 23 is a cross-sectional view illustrating a step in the method of manufacturing a semiconductor device according a further embodiment of the present invention;

FIG. 24 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 23; and

FIG. 25 is a cross-sectional view illustrating a step subsequent to the step shown in FIG. 24.

Claims

1. A method for manufacturing a semiconductor device comprising: feeding a coating liquid comprising a silicon-containing compound dissolved in a solvent onto a semiconductor substrate;revolving the semiconductor substrate to form a coated film containing the silicon-containing compound;feeding a rinsing liquid at least partially comprising α-pinene onto the underside of the semiconductor substrate to perform back-rinsing and washing of the underside of the semiconductor substrate;drying the semiconductor substrate that has been back-rinsed to remove the rinsing liquid; andheat-treating the semiconductor substrate to remove the solvent from the coated film to obtain an insulating film containing the silicon-containing compound.

2. The method according to claim 1, wherein the silicon-containing compound is a compound represented by the following general formula (1): —[(SiR1R2)x+1Oy(NR3)z]—  (1)wherein R1, R2 and R3 may be the same or different and are individually a group selected from the group consisting of a hydrogen atom, alkyl group, alkoxy group, alkenyl group, hydroxyl group and amino group; and x, y and z are individually an integer of 0 or more.

3. The method according to claim 1, wherein the solvent is a compound selected from the group consisting of propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, xylene and di-n-butyl ether.

4. The method according to claim 1, further comprising feeding a rinsing liquid at least partially comprising α-pinene to an edge of the semiconductor substrate having the coated film formed thereon to carry out edge-cutting of the edge.

5. The method according to claim 1, further comprising subjecting the insulating film containing the silicon-containing compound to oxidizing treatment in an atmosphere comprising water vapor to turn the insulating film into a silicon dioxide film.

6. The method according to claim 1, further comprising heat-treating the silicon dioxide film in an inert gas atmosphere to densify the silicon dioxide film.

7. The method according to claim 1, further comprising forming a trench in the semiconductor substrate before feeding the coating liquid onto the semiconductor substrate, thereby filling the trench with the insulating film.

8. The method according to claim 1, further comprising: forming a semiconductor element including an impurity region and a gate electrode in the semiconductor substrate before feeding the coating liquid onto the semiconductor substrate;forming a through-hole in the insulating film to expose the impurity region; andfilling the through-hole with a conductive material.

9. The method according to claim 1, further comprising: forming a first wiring on the semiconductor substrate before feeding the coating liquid onto the semiconductor substrate;forming a through-hole in the insulating film to expose the first wiring; andfilling the through-hole with a conductive material to form a second wiring.

10. A method for manufacturing a semiconductor device comprising: successively forming a gate insulating film, a first gate electrode film and a stopper film above a semiconductor substrate;forming an element-isolating trench having a depth penetrating through the gate insulating film, the first gate electrode film and the stopper film and reaching to the semiconductor substrate;feeding a coating liquid comprising a silicon-containing compound dissolved in a solvent onto the semiconductor substrate;revolving the semiconductor substrate to form a coated film containing the silicon-containing compound;feeding a rinsing liquid at least partially comprising α-pinene onto the underside of the semiconductor substrate to perform back-rinsing and washing of the underside of the semiconductor substrate;drying the semiconductor substrate that has been back-rinsed to remove the rinsing liquid;heat-treating the semiconductor substrate to remove the solvent from the coated film to obtain an insulating film containing the silicon-containing compound;subjecting the insulating film containing the silicon-containing compound to oxidizing treatment in an atmosphere comprising water vapor to turn the insulating film into a silicon dioxide film;removing a part of the silicon dioxide film deposited on the stopper film to selectively leave the silicon dioxide film in the element-isolating trench, thereby forming an element isolating insulating film;removing the stopper film to expose a surface of the first gate electrode film;removing an upper part of the element isolating insulating film to expose an upper part of side of the first gate electrode film;forming an interelectrode insulating film on the first gate electrode film having an exposed upper part of side as well as on the element isolating insulating film whose upper part has been removed; andforming a second gate electrode film on the interelectrode insulating film.

11. The method according to claim 10, wherein the first gate electrode film is formed using a material selected from the group consisting of polycrystalline silicon, WSi and CoSi.

12. The method according to claim 10, wherein the silicon-containing compound is a compound represented by the following general formula (1): —[(SiR1R2)x+1Oy(NR3)z]—(1)Wherein R1, R2 and R3 may be the same or different and are individually a group selected from the group consisting of s hydrogen atom, alkyl group, alkoxy group, alkenyl group, hydroxyl group and amino group; and x, y and z are individually an integer of 0 or more.

13. The method according to claim 10, wherein the solvent is a compound selected from the group consisting of propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, xylene and di-n-butyl ether.

14. The method according to claim 10, further comprising feeding a rinsing liquid at least partially comprising α-pinene to an edge of the semiconductor substrate having the coated film formed thereon to carry out edge-cutting of the edge.

15. The method according to claim 10, wherein the oxidizing treatment of the insulating film containing the silicon compound is performed at a temperature ranging from 230° C. to 900° C.

16. The method according to claim 10, wherein removing the silicon dioxide film existing on the stopper film is carried out by CMP.

17. The method according to claim 10, further comprising heat-treating the silicon dioxide film in an inert gas atmosphere to densify the silicon dioxide film.

18. The method according to claim 17, wherein the heat treatment is performed at a temperature ranging from 700° C. to 1,100° C.

19. The method according to claim 17, wherein the heat treatment is performed before removing the silicon dioxide film existing on the stopper film.

20. The method according to claim 17, wherein the heat treatment is performed after removing the silicon dioxide film existing on the stopper film.