Multilayer printed circuit board and manufacturing method thereof

Abstract

A printed circuit board includes a product portion and a backing plate. Upper and lower surfaces of the backing plate are coated with solder masks with different material characteristics.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross section of a multilayer printed circuit board according to a first embodiment of the present invention;

FIG. 2 is a plan view of the multilayer printed circuit board shown in FIG. 1;

FIG. 3 is a schematic for explaining warping of solder masks shown in FIG. 1;

FIG. 4 is another schematic for explaining warping of the solder masks;

FIG. 5 is an example of the contents of a material characteristics table;

FIG. 6 is a cross section of a multilayer printed circuit board according to a second embodiment of the present invention;

FIG. 7 is a plan view of the multilayer printed circuit board shown in FIG. 6;

FIG. 8 is a plan view of a conventional printed circuit board;

FIG. 9 is a cross section of the conventional printed circuit board; and

FIG. 10 is a schematic for explaining warping of a conventional solder mask.

Claims

1. A multilayer printed circuit board that includes a conductive circuit pattern and an electronic component, the multilayer printed circuit board comprising: a backing plate that includes a first surface and a second surface and that is to be removed-away during manufacturing process of the multilayer printed circuit board, at least one of the first surface and the second surface being coated with a solder mask; anda product portion for mounting the electronic component and at least partially surrounded by the backing plate.

2. The multilayer printed circuit board according to claim 1, wherein the first surface of the backing plate is coated with a first solder mask, andthe second surface of the backing plate is coated with a second solder mask with a material characteristic different from that of the first solder mask.

3. The multilayer printed circuit board according to claim 2, wherein the product portion is coated with a third solder mask with a material characteristic different from that of the first solder mask and the second solder mask.

4. The multilayer printed circuit board according to claims 2, wherein the material characteristic includes linear expansion coefficient.

5. The multilayer printed circuit board according to claim 2, wherein the material characteristic includes Young's modulus.

6. A multilayer printed circuit board that includes a plurality of conductive circuit patterns and an electronic component, the multilayer printed circuit board comprising: a backing plate that includes a first surface and a second surface and that is to be removed-away during manufacturing process of the multilayer printed circuit board;a product portion for mounting the electronic component and at least partially surrounded by the backing plate; anda reinforcing member that is arranged in a portion where less number of the conductive circuit patterns are present.

7. The multilayer printed circuit board according to claim 6, wherein the reinforcing member is arranged at a periphery of the product portion.

8. The multilayer printed circuit board according to claim 6, wherein at least one of the first surface and the second surface of the backing plate is coated with a solder mask.

9. The multilayer printed circuit board according to claims 6, wherein the first surface of the backing plate is coated with a first solder mask, andthe second surface of the backing plate is coated with a second solder mask with a material characteristic different from that of the first solder mask.

10. A manufacturing method of a multilayer printed circuit board that includes a product portion and a backing plate, the manufacturing method comprising: forming a circuit pattern on the product portion;mounting an electronic component on the product portion; andapplying solder masks with different material characteristics to a first surface and a second surface of the backing plate.