BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a cross section of a multilayer printed circuit board according to a first embodiment of the present invention;
FIG. 2 is a plan view of the multilayer printed circuit board shown in FIG. 1;
FIG. 3 is a schematic for explaining warping of solder masks shown in FIG. 1;
FIG. 4 is another schematic for explaining warping of the solder masks;
FIG. 5 is an example of the contents of a material characteristics table;
FIG. 6 is a cross section of a multilayer printed circuit board according to a second embodiment of the present invention;
FIG. 7 is a plan view of the multilayer printed circuit board shown in FIG. 6;
FIG. 8 is a plan view of a conventional printed circuit board;
FIG. 9 is a cross section of the conventional printed circuit board; and
FIG. 10 is a schematic for explaining warping of a conventional solder mask.