Claims
- 1. A photosensitive resin composition which consists essentially of (A) a polyamic acid having at least a recurring unit represented by the formula (I): ##STR10## wherein R.sup.1 represents ##STR11## and R.sup.2 represents a divalent organic group, wherein the polyamic acid includes a reaction product of an acid component comprising oxydiphthalic acid or oxydiphthalic anhydride with a diamine, and wherein the diamine contains a diaminopolysiloxane represented by the formula (III): ##STR12## wherein R.sup.5 and R.sup.6 each represent a divalent hydrocarbon group, R.sup.7 and R.sup.8 each represent a monovalent hydrocarbon group, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 each may be the same or different, and t represents an integer of 1 to 5, and optionally, the polyamic acid having at least one other recurring unit which is a reaction product of said diamine with at least one other tetracarboxylic dianhydride; (B) an acryl compound having an amino group; and (C) a photoinitiator for an i-line stepper, the composition transmitting light of the i-line stepper.
- 2. The photosensitive resin composition according to claim 1, wherein the acid component comprises 80 mol % or less of the other tetracarboxylic dianhydride based on the whole acid component.
- 3. The photosensitive resin composition according to claim 1, wherein the other tetracarboxylic dianhydride is a compound represented by the formula (II): ##STR13## wherein R.sup.3 and R.sup.4 may be the same or different from each other and each represent a monovalent hydrocarbon group; and s is an integer of 1 to 5; and when s is 2 or more, respective R.sup.3 s or R.sup.4 s may be the same or different from each other.
- 4. The photosensitive resin composition according to claim 1, wherein R.sup.5 and R.sup.6 each represent a divalent hydrocarbon group having 1 to 3 carbon atoms; and R.sup.7 and R.sup.8 each represent a monovalent hydrocarbon group having 1 to 3 carbon atoms.
- 5. The photosensitive resin composition according to claim 1, wherein said diaminopolysiloxane is contained in an amount of 1 to 10 mole % based on the total amount of the diamine component.
- 6. The photosensitive resin composition according to claim 1, wherein the acryl compound (B) having an amino group is at least one selected from N,N-dimethylaminoethyl methacrylate, N,N-diethylaminoethyl methacrylate, N,N-dimethylaminopropyl methacrylate, N,N-diethylaminopropyl methacrylate, N,N-dimethylaminoethyl acrylate, N,N-diethylaminoethyl acrylate, N,N-dimethylaminopropyl acrylate, N,N-diethylaminopropyl acrylate, N,N-dimethylaminoethylacrylamide, and N,N-diethylaminoethyl-acrylamide.
- 7. The photosensitive resin composition according to claim 1 which comprises 1 to 200% by weight of the acryl compound (B) having an amino group based on the weight of the polyamic acid (A) having recurring units represented by the formula (I).
- 8. The photosensitive resin composition according to claim 1 which comprises 5 to 50% by weight of the acryl compound (B) having an amino group based on the weight of the polyamic acid (A) having recurring units represented by the formula (I).
- 9. The photosensitive resin composition according to claim 1, wherein the photoinitiator (C) is at least one selected from 4,4'-bis(diethylamino)benzophenone and 1-phenyl-2-(o-ethoxycarbonyl)oxyiminopropan-1-one.
- 10. The photosensitive resin composition according to claim 1, wherein the photoinitiator is included in the composition in an amount of 0.01 to 30% by weight based on the polyamic acid having said recurring unit.
- 11. The photosensitive resin composition according to claim 1, wherein the composition also contains (D) an addition-polymerizable compound.
- 12. The photosensitive resin composition according to claim 1, wherein the composition also contains (E) an azido compound.
- 13. The photosensitive resin composition according to claim 12, wherein said azido compound is an azide compound having two azido groups.
- 14. The photosensitive resin composition which consists essentially of (A) a polyamic acid having at least a recurring unit represented by the formula (I): ##STR14## wherein R.sup.1 represents ##STR15## and R.sup.2 represents a divalent organic group, wherein the polyamic acid includes a reaction product of an acid component comprising oxydiphthalic acid or oxydiphthalic anhydride with a diamine containing a diaminopolysiloxane, and, optionally, the polyamic acid having at least one other recurring unit which is a reaction product of said diamine with at least one other tetracarboxylic dianhydride; said at least one other tetracarboxylic dianhydride being a compound represented by the formula (II): ##STR16## wherein R.sup.3 and R.sup.4 may be the same or different from each other and each represent a monovalent hydrocarbon group; and s is an integer of 1 to 5; and when s is 2 or more, respective R.sup.3 s or R.sup.4 s may be the same or different from each other, and the diamine containing a diaminopolysiloxane is represented by the formula (III): ##STR17## wherein R.sup.5 and R.sup.6 each represent a divalent hydrocarbon group having 1 to 3 carbon atoms, R.sup.7 and R.sup.8 each represent a monovalent hydrocarbon group having 1 to 3 carbon atoms, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 each may be the same or different, and t represents an integer of 1 to 5; (B) an acryl compound having an amino group, (C) a photoinitiator and (E) an azide compound having two azido groups.
- 15. The photosensitive resin composition according to claim 14 transmits light for an i-line stepper.
- 16. The photosensitive resin composition according to claim 14, wherein the photoinitiator (C) is at least one selected from 4,4'-bis(diethylamino)benzophenone and 1-phenyl-2-(o-ethoxycarbonyl)oxyiminopropan-1-one, and the azido compound (E) is 2,6-bis(4'-azidobenzal)-4-carboxycyclohexanone.
- 17. The photosensitive resin composition according to claim 14, wherein the acryl compound (B) having an amino group is at least one selected from N,N-dimethylaminoethyl methacrylate, N,N-diethylaminoethyl methacrylate, N,N-dimethylaminopropyl methacrylate, N,N-diethylaminopropyl methacrylate, N,N-dimethylaminoethyl acrylate, N,N-diethylaminoethyl acrylate, N,N-dimethylaminopropyl acrylate, N,N-diethylaminopropyl acrylate, N,N-dimetylaminoethylacrylamide, and N,N-diethylaminoethyl-acrylamide; said composition comprising 1 to 20% by weight of the acryl compound (B) having an amino group based on the polyamic acid (A) having recurring units formed by the formula (I).
- 18. The photosensitive resin composition according to claim 14, wherein the photoinitiator (C) is at least one selected from the group consisting of 4,4'-bis(diethylamino)benzophenone and 1-phenyl-2-(o-ethoxycarbonyl)oxyiminopropan-1-one, and the azido compound is 2,6-bis(4'-azidobenzal)-4-carboxycyclohexanone.
- 19. The photosensitive resin composition according to claim 14, wherein the photoinitiator (C) is contained in an amount of 0.01 to 30% by weight based on the polyamic acid and the azido compound (E) is contained in an amount of 0.01 to 30% by weight based on the polyamic acid.
- 20. The photosensitive resin composition according to claim 15, wherein the photoinitiator (C) is at least one selected from 4,4'-bis(diethylamino)-benzophenone and 1-phenyl-2-(o-ethoxycarbonyl)oxyiminopropan-1-one, and the azido compound (E) is 2,6-bis(4'-azidobenzal)-4-carboxycyclohexanone.
- 21. A photosensitive resin composition which comprises (A) a polyamic acid having at least a recurring unit represented by the formula (I): ##STR18## wherein R.sup.1 represents ##STR19## and R.sup.2 represents a divalent organic group, wherein the polyamic acid includes a reaction product of an acid component comprising oxydiphthalic acid or oxydiphthalic anhydride with a diamine, and wherein the diamine contains a diaminopolysiloxane represented by the formula (III): ##STR20## wherein R.sup.5 and R.sup.6 each represent a divalent hydrocarbon group, R.sup.7 and R.sup.8 each represent a monovalent hydrocarbon group, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 each may be the same or different, and t represents an integer of 1 to 5, and, optionally, the polyamic acid having at least one other recurring unit which is a reaction product of said diamine with at least one other tetracarboxylic dianhydride;
- (B) an acryl compound having an amino group; and
- (C) a photoinitiator for an i-line stepper,
- wherein the composition transmits light of the i-line stepper.
- 22. The photosensitive resin composition according to claim 21, wherein the composition also contains (E) an azido compound.
- 23. The photosensitive resin composition according to claim 22, wherein said azido compound is an azide compound having two azido groups.
- 24. A photosensitive resin composition which comprises (A) a polyamic acid having at least a recurring unit represented by the formula (I): ##STR21## wherein R.sup.1 represents ##STR22## and R.sup.2 represents a divalent organic group, wherein the polyamic acid includes a reaction product of an acid component comprising oxydiphthalic acid or oxydiphthalic anhydride with a diamine, and wherein the diamine contains a diaminopolysiloxane represented by the formula (III): ##STR23## wherein R.sup.5 and R.sup.6 each represent a divalent hydrocarbon group, R.sup.7 and R.sup.8 each represent a monovalent hydrocarbon group, R.sup.5 and R.sup.6, R.sup.7 and R.sup.8 each may be the same or different, and t represents an integer of 1 to 5, and, optionally, the polyamic acid having at least one other recurring unit represented by a formula IV: ##STR24## wherein R.sup.1 has been defined previously, and R.sup.9 is selected from the group consisting of ##STR25## (B) an acryl compound having an amino group; and (C) a photoinitiator for an i-line stepper, wherein the composition transmits light of the i-line stepper.
- 25. The photosensitive resin composition according to claim 24, wherein R.sup.9 is ##STR26##
- 26. The photosensitive resin composition according to claim 24, wherein R.sup.9 is ##STR27##
- 27. The photosensitive resin composition according to claim 24, wherein R.sup.9 is ##STR28##
- 28. The photosensitive resin composition according to claim 24, wherein R.sup.9 is ##STR29##
Priority Claims (2)
Number |
Date |
Country |
Kind |
5-219720 |
Sep 1993 |
JPX |
|
6-002282 |
Jan 1994 |
JPX |
|
Parent Case Info
This application is a Continuation application of application Ser. No. 299,628, filed Sep. 2, 1994, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4587197 |
Kojima et al. |
May 1986 |
|
4783391 |
Ohbayashi et al. |
Nov 1988 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
299628 |
Sep 1994 |
|