Claims
- 1. A circuit apparatus, comprising:
a laminar support; a conductive track on the laminar support; an auxiliary conductive element electrically connected to the conductive track, wherein the auxiliary conductive element is applied by means of an apparatus for applying SMD components.
- 2. The apparatus of claim 1, wherein the auxiliary conductive element is electrically connected to the laminar support by means of an adhesive and soldered thereto by a wave soldering procedure.
- 3. The apparatus of claim 1, wherein the auxiliary conductive element is electrically connected to the laminar support by means of a cream solder and a reflow soldering procedure.
- 4. The apparatus of claim 1, wherein said laminar support includes a first face a second face, and a thickness, the first face exhibits a plurality of auxiliary conductive elements and a plurality of SMD electronic components, the second face exhibits a plurality of electronic components furnished with legs, and the legs pass through the thickness of the laminar support.
- 5. The apparatus of claim 4, wherein the auxiliary conductive elements are mutually identical.
- 6. The apparatus of claim 1, wherein the auxiliary conductive element includes a metal pad.
- 7. The apparatus of claim 1, wherein
the auxiliary conductive element is electrically connected to the conductive track by a solder alloy; and the auxiliary conductive element includes a metal with high electrical conductivity, and the auxiliary conductive element is coated with a metallic layer with both high wettability and a melting temperature higher than the melting temperature of the solder alloy.
- 8. A flexible material strip, comprising:
a plurality of auxiliary conductive elements; and a plurality of adjacent recesses, wherein each of the recesses houses a respective auxiliary conductive element.
- 9. The flexible material strip of claim 8, wherein the auxiliary conductive element includes a metal pad.
- 10. The flexible material strip of claim 8, wherein each auxiliary conductive element is produced from a metal with high electrical conductivity and coated with a metallic layer with both a wettability and a melting temperature sufficient for a soldering process.
Priority Claims (3)
Number |
Date |
Country |
Kind |
98/36625 |
Feb 1998 |
WO |
|
FI97A000023 |
Feb 1997 |
IT |
|
PCT/IT98/00026 |
Aug 1999 |
IT |
|
Parent Case Info
[0001] This application claims benefit as a divisional of co-pending U.S. patent application Ser. No. 09/374,971 filed Aug. 16, 1999, entitled “Process for Producing Printed Circuits and Printed Circuits Thus Obtained” which claimed benefit as a national stage application of PCT Application No. WO 98/36625 filed Feb. 16, 1998, entitled “Process for Producing Printed Circuits and Printed Circuits thus Obtained” which claims priority from Italian Application No. FI97A000023, filed Feb. 17, 1997. These references are hereby incorporated by reference.
[0002] I, Antonio Canova, a citizen of Italy, residing at Via Po, 79/A, I-5205 Mantevarchi; have invented a new and useful “Process for Producing Printed Circuits and Printed Circuits thus Obtained.”
Divisions (1)
|
Number |
Date |
Country |
Parent |
09374971 |
Aug 1999 |
US |
Child |
10043002 |
Jan 2002 |
US |