Claims
- 1. A lead frame for a resin-sealed semiconductor package, having outer leads and inner leads with tips and formed by etching a blank; wherein
- the tips of the inner leads have a thickness smaller than that of other portions of the lead frame;
- the tip of each inner lead has an upper surface depressed relative to one of the surfaces of each of other portions of the lead frame, and a lower surface flush with other lower surfaces of each of other portions of the lead frame; and
- both of the opposite surfaces of the tip of each inner lead have areas greater than the sectional area of the middle portion with respect to the thickness of the tip of the same inner lead; and
- the upper surface of the tip of each inner lead is formed by etching the blank to form an etched recess with a flat bottom so that each inner lead has a tip wherein the upper surface of the tip is in a level plane.
- 2. The lead frame according to claim 1, wherein the thickness of the tips of the inner leads is 1/5 to 1/2 of the thickness of other portions of the lead frame.
- 3. The lead frame according to claim 1, wherein
- both the major surfaces of each outer lead have areas smaller than the sectional area of the middle portion with respect to the thickness of the same outer lead.
Priority Claims (2)
Number |
Date |
Country |
Kind |
6-154323 |
Jun 1994 |
JPX |
|
7-80906 |
Mar 1995 |
JPX |
|
Parent Case Info
This is a Division of application Ser. No. 08/489,319 filed Jun. 12, 1995, now U.S. Pat. No. 5,683,943.
US Referenced Citations (3)
Foreign Referenced Citations (2)
Number |
Date |
Country |
4-180661 |
Jun 1992 |
JPX |
6-163780 |
Jun 1994 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
489319 |
Jun 1995 |
|