Number | Date | Country | Kind |
---|---|---|---|
5-006488 | Jan 1993 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
4341574 | Landes | Jul 1982 | |
4808948 | Patel et al. | Feb 1989 | |
4824005 | Smith, Jr. | Apr 1989 | |
5044543 | Yamazaki et al. | Sep 1991 | |
5046654 | Yamazaki et al. | Sep 1991 | |
5176311 | Levine et al. | Jan 1993 | |
5213249 | Long et al. | May 1993 | |
5238173 | Ura et al. | Aug 1993 |
Entry |
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Semicon NEWS, Feb. 1990, p. 80, "High Speed Wire Bonding Apparatus Acceptable for Multi-pin System" by Takaji Tsujimura. |