Claims
- 1. A wiring forming method comprising:
forming a wiring material layer on an insulation film covering one of major surfaces of a substrate; forming a first antireflection coating film made of Ti(O)N on said wiring material layer; forming a second antireflection coating film made of an organic material directly on said first antireflection coating film; and forming a resist layer on a lamination film which includes said first and second antireflection coating films, and exposing said resist layer to light in accordance with predetermined wiring patterns.
- 2. A wiring forming method wherein said wiring material layer is a polycide.
Priority Claims (1)
Number |
Date |
Country |
Kind |
HEI 9-191985 |
Jul 1997 |
JP |
|
RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent application Ser. No. 09/969,270, filed Oct. 1, 2001, which is a division of application Ser. No. 09/109,443, filed Jul. 2, 1998, the disclosures of which are incorporated herein by reference.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09109443 |
Jul 1998 |
US |
Child |
09969270 |
Oct 2001 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09969270 |
Oct 2001 |
US |
Child |
10246723 |
Sep 2002 |
US |