Cyprian Emeka Uzoh

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pads over TSV
- Patent number 11,955,445
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 11,955,463
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding elements including conductive interface feat...
- Patent number 11,955,393
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for releveled bump planes for chiplets
- Patent number 11,862,604
- Issue date Jan 2, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for processing devices
- Patent number 11,855,064
- Issue date Dec 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 11,837,582
- Issue date Dec 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 11,837,596
- Issue date Dec 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 11,764,189
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 11,756,880
- Issue date Sep 12, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 11,749,645
- Issue date Sep 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable hybrid bonded apparatus
- Patent number 11,742,314
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 11,742,315
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laterally unconfined structure
- Patent number 11,735,523
- Issue date Aug 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED arrays including optical elements configured to t...
- Patent number 11,715,730
- Issue date Aug 1, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier collar for interconnects
- Patent number 11,694,925
- Issue date Jul 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 11,658,173
- Issue date May 23, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 11,652,083
- Issue date May 16, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 11,515,279
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Large metal pads over TSV
- Patent number 11,393,779
- Issue date Jul 19, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly from processed substrate
- Patent number 11,367,652
- Issue date Jun 21, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for releveled bump planes for chiplets
- Patent number 11,348,898
- Issue date May 31, 2022
- Xcelsis Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing stacked substrates
- Patent number 11,348,801
- Issue date May 31, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED structure contacts and substrate contacts
- Patent number 11,329,034
- Issue date May 10, 2022
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR RELEVELED BUMP PLANES FOR CHIPLETS
- Publication number 20240162190
- Publication date May 16, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20240145458
- Publication date May 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20240113059
- Publication date Apr 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240105674
- Publication date Mar 28, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...
- Publication number 20240096683
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV AS PAD
- Publication number 20240088101
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERALLY UNCONFINED STRUCTURE
- Publication number 20240071915
- Publication date Feb 29, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED OPTOELECTRONIC DEVICES
- Publication number 20240063199
- Publication date Feb 22, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20240047344
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS
- Publication number 20240038702
- Publication date Feb 1, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20240021573
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20240021572
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING SURFACE VALIDATION ON DICING TAPE
- Publication number 20230369136
- Publication date Nov 16, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE DIRECT BONDING
- Publication number 20230361074
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER COLLAR FOR INTERCONNECTS
- Publication number 20230360968
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
- Publication number 20230343734
- Publication date Oct 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED LED ARRAYS AND DRIVERS
- Publication number 20230317703
- Publication date Oct 5, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROL FOR BONDING
- Publication number 20230299029
- Publication date Sep 21, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20230282610
- Publication date Sep 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230268300
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20230268307
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT BONDED AND INTERCONNECTED STACK
- Publication number 20230253367
- Publication date Aug 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING ON PACKAGE SUBSTRATES
- Publication number 20230215836
- Publication date Jul 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTERCONNECT ASSEMBLIES
- Publication number 20230207474
- Publication date Jun 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR DIE BOND CONTROL
- Publication number 20230207514
- Publication date Jun 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS DIRECT HYBRID BONDING
- Publication number 20230197655
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS

Cyprian Emeka Uzoh

Person

Patents Grantslast 30 patents

Methods for low temperature bonding using nanoparticles

Metal pads over TSV

Direct bonded stack structures for increased reliability and improv...

Structures for bonding elements including conductive interface feat...

Flat metal features for microelectronics applications

Multi-metal contact structure

Systems and methods for releveled bump planes for chiplets

Techniques for processing devices

Molded direct bonded and interconnected stack

Stacked dies and methods for forming bonded structures

Molded direct bonded and interconnected stack

Interconnect structures

TSV as pad

Reliable hybrid bonded apparatus

Die processing

Laterally unconfined structure

Direct-bonded LED arrays including optical elements configured to t...

Structures and methods for low temperature bonding using nanoparticles

Diffusion barrier collar for interconnects

Stacked dies and methods for forming bonded structures

Processed stacked dies

Chemical mechanical polishing for hybrid bonding

Low temperature bonded structures

Seal for microelectronic assembly

Large metal pads over TSV

Microelectronic assembly from processed substrate

Systems and methods for releveled bump planes for chiplets

Processing stacked substrates

Direct-bonded LED structure contacts and substrate contacts

Bond enhancement structure in microelectronics for trapping contami...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR RELEVELED BUMP PLANES FOR CHIPLETS

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

LOW TEMPERATURE BONDED STRUCTURES

BONDED STRUCTURE AND METHOD OF FORMING SAME

APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...

TSV AS PAD

LATERALLY UNCONFINED STRUCTURE

DIRECT-BONDED OPTOELECTRONIC DEVICES

INTERCONNECT STRUCTURES

HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

RELIABLE HYBRID BONDED APPARATUS

DIE PROCESSING

SEAL FOR MICROELECTRONIC ASSEMBLY

BONDING SURFACE VALIDATION ON DICING TAPE

LOW TEMPERATURE DIRECT BONDING

DIFFUSION BARRIER COLLAR FOR INTERCONNECTS

EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

DIRECT-BONDED LED ARRAYS AND DRIVERS

EXPANSION CONTROL FOR BONDING

PROCESSED STACKED DIES

BONDED STRUCTURES

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

LOW TEMPERATURE BONDED STRUCTURES

MOLDED DIRECT BONDED AND INTERCONNECTED STACK

DIRECT BONDING ON PACKAGE SUBSTRATES

BONDED STRUCTURES WITH INTERCONNECT ASSEMBLIES

APPARATUSES AND METHODS FOR DIE BOND CONTROL

LOW STRESS DIRECT HYBRID BONDING